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91.
公开(公告)号:EP4268757A3
公开(公告)日:2023-12-06
申请号:EP23193162.7
申请日:2018-10-05
IPC分类号: G01B11/02 , G01B11/25 , G06T15/60 , B64D47/08 , G02B6/04 , A61B1/05 , B29C64/10 , A61B1/00 , A61B1/06 , A61B1/07 , A61B34/10 , A61B34/20 , A61B90/30 , A61B90/00 , G01B11/24 , A61B90/10 , A61B90/20 , A61B90/50 , F21K9/00
摘要: Disclosed herein are various embodiments relate generally to computer vision, graphics, image scanning, and image processing as well as associated mechanical, electrical and electronic hardware, computer software and systems, and wired and wireless network communications to form at least three-dimensional models or images of objects and environments.
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92.
公开(公告)号:EP3692329B1
公开(公告)日:2023-12-06
申请号:EP18864936.2
申请日:2018-10-05
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公开(公告)号:EP4257628A3
公开(公告)日:2023-11-29
申请号:EP23183272.6
申请日:2019-04-05
申请人: Poly-Med, Inc.
IPC分类号: B29C64/10 , B29C64/124 , B33Y70/00 , C08G63/08
摘要: The present disclosure is directed to methods and compositions comprising photopolymerizable compositions for use in additive manufacturing, particularly for digital light processing, stereolithography or continuous liquid interface processing.
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公开(公告)号:EP3442773B1
公开(公告)日:2023-10-18
申请号:EP16910766.1
申请日:2016-07-29
发明人: NAUKA, Krzysztof , ANTHONY, Tom
IPC分类号: B29C64/20 , B29C64/10 , B29C64/141 , B29C64/295 , B29C64/393 , B29C64/268 , B33Y10/00 , B33Y30/00 , B29C64/153
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公开(公告)号:EP4249250A1
公开(公告)日:2023-09-27
申请号:EP20962469.1
申请日:2020-11-20
申请人: Fuji Corporation
发明人: TOMINAGA, Ryojiro
摘要: To provide a production method and a production device for a three-dimensionally fabricated object that can alleviate a limitation on a curable resin to be used, in a case where the three-dimensionally fabricated object having an electronic device is produced using an additive manufacturing method. A production method for a three-dimensionally fabricated object of the present disclosure includes a first fabricating step of fabricating the attached object including an attachment section, to which the electronic device is attachable, with a first curable resin, using an additive manufacturing method, a second fabricating step of fabricating a resin layer with a second curable resin, fabricating a conductor with a fluid containing a metal particle, and fabricating the electronic device having the conductor in the resin layer, using the additive manufacturing method, and an attaching step of attaching the electronic device to the attachment section of the attached object.
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公开(公告)号:EP3906148B1
公开(公告)日:2023-07-05
申请号:EP19823837.0
申请日:2019-11-22
发明人: FELLER, Bob E.
IPC分类号: B29C64/153 , B33Y10/00 , B33Y80/00 , B29C64/10
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公开(公告)号:EP3774338B1
公开(公告)日:2023-07-05
申请号:EP19781362.9
申请日:2019-04-05
IPC分类号: B29C64/10 , B29C64/124 , B33Y70/00 , C08G63/08
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公开(公告)号:EP4139395A1
公开(公告)日:2023-03-01
申请号:EP21792067.7
申请日:2021-04-22
发明人: CERNOHOUS, Jeffrey, J. , CERNOHOUS, Brandon , OCKWIG, Nathan, W. , DEPRENGER-GOTTFRIED, Gavriel , FOLLENSBEE, Robert, A. , FARREN, Jonathan
IPC分类号: C08L29/04 , C08L39/06 , C08L77/00 , C08L101/00 , C08L101/14 , C08K5/1545 , B29C64/10 , B33Y10/00 , B33Y70/00
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公开(公告)号:EP4126504A1
公开(公告)日:2023-02-08
申请号:EP21779458.5
申请日:2021-03-30
申请人: Quadratic 3D, Inc.
发明人: ARNDT, Eric, M.
IPC分类号: B29C64/10 , B29C64/106 , B29C64/264
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