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公开(公告)号：EP4117397A1
公开(公告)日：2023-01-11
申请号：EP20923257.8
申请日：2020-03-02
申请人： Fuji Corporation
摘要： To provide a wiring formation method that can increase the wiring density in a case where wiring is formed on an inclined surface by three-dimensional additive manufacturing. The wiring formation method of the present disclosure includes a metal member forming step of forming multiple metal members with a first fluid containing metal particles, a resin layer forming step of forming a resin layer including an upper surface and an inclined surface inclined downward from the upper surface, and a connection wiring forming step of forming multiple connection wirings on the inclined surface and the upper surface of the resin layer with a second fluid containing metal particles, and the connection wirings being formed to individually connect the multiple connection wirings to the multiple metal members on a lower surface of the inclined surface.
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公开(公告)号：EP4007459A1
公开(公告)日：2022-06-01
申请号：EP19939582.3
申请日：2019-07-30
申请人： Fuji Corporation
摘要： To provide an electronic circuit production method using 3D layer shaping capable of producing an electronic circuit having improved electrical properties and mechanical properties by utilizing characteristics of a fluid containing a metal particle by selectively using the fluid containing the metal particle. The electronic circuit production method using 3D layer shaping, the method including a wiring forming step of forming a wiring by applying a fluid containing a nano-sized metal nanoparticle on an insulating member and curing the applied fluid containing the metal nanoparticle; and a connection terminal forming step of forming a connection terminal electrically connected to the wiring by applying a fluid containing a micro-sized metal microparticle and curing the applied fluid containing the metal microparticle.
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公开(公告)号：EP4415490A1
公开(公告)日：2024-08-14
申请号：EP21959971.9
申请日：2021-10-08
申请人： Fuji Corporation
发明人： TOMINAGA, Ryojiro
IPC分类号： H05K3/10
CPC分类号： H05K3/10
摘要： A circuit forming method including: an acquiring step of acquiring metal-containing liquid information including at least one of a density of a metal-containing liquid containing metal fine particles or a content of the metal fine particles; a calculating step of calculating the number of layers of the metal-containing liquid required to form a wiring by stacking the metal-containing liquid, based on the metal-containing liquid information acquired in the acquiring step; and a wiring forming step of forming a wiring by stacking the metal-containing liquid in the number of layers calculated in the calculating step.
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公开(公告)号：EP4007458A1
公开(公告)日：2022-06-01
申请号：EP19939422.2
申请日：2019-07-31
申请人： Fuji Corporation
摘要： In a case where a circuit wiring is formed on a resin member by three-dimensional additive manufacturing, a method for manufacturing the circuit wiring by three-dimensional additive manufacturing capable of suppressing swelling or cracking of the circuit wiring is provided. A method for manufacturing a circuit wiring by three-dimensional additive manufacturing includes a discharging step of discharging a fluid containing a metal particle onto a resin member formed of a resin material; and a circuit wiring forming step of forming a circuit wiring by heating the fluid containing the metal particle discharged onto the resin member at a heating temperature to be cured, and the heating being performed at the heating temperature based on a glass transition point of the resin material, a linear expansion coefficient of the resin material, and a room temperature.
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公开(公告)号：EP4249250A1
公开(公告)日：2023-09-27
申请号：EP20962469.1
申请日：2020-11-20
申请人： Fuji Corporation
发明人： TOMINAGA, Ryojiro
摘要： To provide a production method and a production device for a three-dimensionally fabricated object that can alleviate a limitation on a curable resin to be used, in a case where the three-dimensionally fabricated object having an electronic device is produced using an additive manufacturing method. A production method for a three-dimensionally fabricated object of the present disclosure includes a first fabricating step of fabricating the attached object including an attachment section, to which the electronic device is attachable, with a first curable resin, using an additive manufacturing method, a second fabricating step of fabricating a resin layer with a second curable resin, fabricating a conductor with a fluid containing a metal particle, and fabricating the electronic device having the conductor in the resin layer, using the additive manufacturing method, and an attaching step of attaching the electronic device to the attachment section of the attached object.
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公开(公告)号：EP3780916A1
公开(公告)日：2021-02-17
申请号：EP18914298.7
申请日：2018-04-12
申请人： Fuji Corporation
发明人： TOMINAGA, Ryojiro
摘要： A printed substrate forming method includes: a resin layer forming step of forming a resin layer with curable resin in a specific region that is a region other than a predetermined region of a base which is composed of an insulating layer and a conductor layer, the predetermined region of which being a region on which a solder resist is formed; and a wiring forming step of forming a wiring by discharging metal-containing liquid which contains metal fine particles onto a top
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公开(公告)号：EP4007462A1
公开(公告)日：2022-06-01
申请号：EP19939888.4
申请日：2019-07-30
申请人： Fuji Corporation
发明人： TOMINAGA, Ryojiro
IPC分类号： H05K3/46 , H01L25/065 , H01L25/07 , H01L25/18 , H05K3/10
摘要： In a method for manufacturing a stack component in which an interposer (12) is interposed to form a space for inserting an interlayer connection pin (13) between circuit layers (11) to be stacked, the method includes a printing step of simultaneously printing and forming the circuit layer and the interposer side by side in a planar manner by a 3D printer, a step of mounting a circuit element (14) on the circuit layer, a step of mounting the interposer on the circuit layer, a step of inserting the interlayer connection pin into the interposer mounted on the circuit layer, and a step of electrically connecting the circuit layer and another circuit layer by the interlayer connection pin by stacking the other circuit layer on the circuit layer via the interposer.
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8.发明公开
公开(公告)号：EP3716741A1
公开(公告)日：2020-09-30
申请号：EP17932653.3
申请日：2017-11-21
申请人： Fuji Corporation
发明人： TOMINAGA, Ryojiro
IPC分类号： H05K3/46 , B29C64/112 , B33Y10/00 , B33Y80/00
摘要： Disclosed is a method of manufacturing a three-dimensional multi-layer electronic device, the method including: a unit forming process of forming a multi-layer unit including an electronic component and a circuit wiring by three-dimensional lay-out forming; and a unit lay-out process of manufacturing a three-dimensional multi-layer electronic device by laying out and integrating the multi-layer unit in a vertical direction.
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公开(公告)号：EP4035871A1
公开(公告)日：2022-08-03
申请号：EP19947100.4
申请日：2019-09-24
申请人： Fuji Corporation
IPC分类号： B29C64/386 , B33Y50/00 , H05K3/10
摘要： An image processing device that processes an image in which a wiring pattern is drawn and outputs the image as raster data in which formation content of wiring print dots is defined for each pixel, includes an input section that receives the image in which the wiring pattern including a wire having a prescribed width that is an integer multiple of a pixel width and a prescribed angle that is an integer multiple of a predetermined angle is drawn, a scan section that sequentially performs scanning in a scan direction at intervals of the pixel width in a direction orthogonal to the scan direction to detect respective intersection points between an outline of the wire and respective scan lines, a calculation section that calculates an intersection-to-intersection distance in the scan direction based on positions of the intersection points, and a determination section that determines a line width of the wire in the scan direction and determine formation of dots for the determined line width for each pixel based on the intersection-to-intersection distance, the prescribed width, and a line width of an inclination wire which is the line width, in the scan direction, of a wire inclined according to the prescribed angle.
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公开(公告)号：EP4005776A1
公开(公告)日：2022-06-01
申请号：EP19939655.7
申请日：2019-07-31
申请人： Fuji Corporation
IPC分类号： B29C64/124 , B29C64/30 , B33Y10/00 , B33Y30/00
摘要： A cured resin formation method including an applying step of applying an ultraviolet curable resin on a base; and a curing step of curing the ultraviolet curable resin by irradiating the ultraviolet curable resin applied in the applying step with ultraviolet rays, in which in the curing step, the ultraviolet curable resin is irradiated with ultraviolet rays while cooling the ultraviolet curable resin, so that a difference between an ordinary temperature of the ultraviolet curable resin and a temperature of the ultraviolet curable resin when irradiated with ultraviolet rays is within a set temperature difference set in advance.
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