摘要:
A polishing slurry for chemically mechanically polishing metal layers and films during the various stages of multilevel interconnect fabrication associated with integrated circuit manufacturing. The slurry includes an aqueous medium, an abrasive, an oxidizing agent, and an organic acid. The polishing slurry has been found to significantly lower or inhibit the silicon dioxide polishing rate, thus yielding enhanced selectivity. In addition, the polishing slurry is useful in providing effective polishing to metal layers at desired polishing rates while minimizing surface imperfections and defects. Also disclosed is a method for producing coplanar metal/insulator films on a substrate utilizing the slurry of the present invention and chemical mechanical polishing technique relating thereto.
摘要:
A polishing composition comprising fumed silica, a basic potassium compound and water, of which the specific electric conductivity is from 100 to 5,500 µS/cm.
摘要:
Baths for chemically polishing stainless steel surfaces comprising, in an aqueous solution, a mixture of hydrochloric acid, nitric acid and phosphoric acid, an optionally substituted hydroxybenzoic acid, at least one quaternary ammonium salt and an additive selected from perchloric acid and the water-soluble salts thereof.
摘要:
A composition is described for use in the physicochemical surface refinement of objects having surfaces of titanium, nickel, and alloys of each, normally in a vibratory mass finishing process, comprising a combination of sulfamic acid, ammonium bifluoride, and hydrogen peroxide. The maximum concentration of the peroxide is controlled to avoid inhibiting or arresting the reaction with the metal; maintaining a minimum concentration prevents excessive metal dissolution, pitting and other undesirable surface defects.
摘要:
Procédé de purification et de récupération des bains de rinçage de bains acides de brillantage, caractérisé en ce qu'il comprend une mise en oeuvre en continu, et au moins des étapes suivantes, une étape de purification de bains de rinçage par des échanges liquide-liquide comportant une mise en contact de ces bains de rinçage enrichis en acides et en sels métalliques ou phase aqueuse, et d'un solvant organique ou phase organique, et une étape de récupération des acides par des échanges liquide-liquide comportant une mise en contact d'une eau et d'une phase organique chargée d'acides.