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29 条记录 (耗时 0.012 秒)

    Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
    11.
    发明公开
    Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield 审中-公开
    电磁屏蔽铜箔，处理用于其制备方法和电磁屏蔽

    公开(公告)号：EP1452627A3

    公开(公告)日：2006-02-08

    申请号：EP04004493.5

    申请日：2004-02-27

    申请人： FURUKAWA CIRCUIT FOIL CO., LTD.

    发明人： Yoshihara, Yasuhisha ,  Kimijima, Hisao

    IPC分类号： C25D3/38 ,  C25D3/12 ,  C25D5/10 ,  C25D7/06

    CPC分类号： C25D5/10 ,  C25D3/562 ,  C25D3/58 ,  C25D5/16 ,  H05K1/0218 ,  H05K3/384 ,  Y10T428/12063 ,  Y10T428/1209 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/12681 ,  Y10T428/1291 ,  Y10T428/12993

    摘要： An electromagnetic shielding copper foil superior in electromagnetic shielding ability, high in transmittance, and free from particle shedding comprising a copper foil on at least one surface of which a fine roughening particle layer of copper or an alloy is provided and having on the fine roughening particle layer a smoothening layer comprised of cobalt, nickel, indium, or an alloy of the same and an electromagnetic shield able to be suitably used for a PDP using the same. The fine roughening particle layer may also be a layer comprised of a fine particle roughening particle layer of copper on which a fine roughening particle layer of a copper alloy is stacked or may also be formed by a copper-cobalt-nickel alloy. The smoothening layer of the copper foil may be treated for stainproof or by a silane coupling agent to protect the surface of the copper foil.

    摘要翻译： 优异的电磁波屏蔽能力，在透射率高，并且自由其中至少一个表面上包含铜箔的铜或合金的微粗糙化颗粒层的电磁屏蔽铜箔从粒子脱落被设置并且具有在细粗化粒子 层的钴，镍，铟的平滑层合宁组成，或以相同的合金和电磁屏蔽能够使用相同的适合用于的PDP。 因此，细颗粒粗化层可以由细颗粒粗化在其上的铜合金的微粗糙化颗粒层被堆叠或因此可以通过铜 - 钴 - 镍合金形成的铜粒子层的层。 铜箔的平滑合宁层可以被用于治疗或防污通过硅烷偶联剂，以保护铜箔的表面上。

    Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
    12.
    发明公开
    Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier 审中-公开
    使用与载体的极薄铜箔的载体和电路板的超薄铜箔

    公开(公告)号：EP1531656A2

    公开(公告)日：2005-05-18

    申请号：EP04026739.5

    申请日：2004-11-10

    申请人： FURUKAWA CIRCUIT FOIL CO., LTD.

    发明人： Suzuki, Akitoshi ,  Fukuda, Shin

    IPC分类号： H05K3/02 ,  C25D1/04

    CPC分类号： C25D7/0614 ,  C25D1/04 ,  C25D5/48 ,  H05K3/025 ,  H05K3/383 ,  H05K3/384 ,  Y10T428/12028 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12569 ,  Y10T428/12903 ,  Y10T428/12993 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/265

    摘要： To produce an ultra-thin copper foil with a carrier foil that microscopic crystal grains can be deposited without being affected by the surface roughness of a carrier foil, etching can be performed until an ultrafine width such that line/space is 15 µm or less, and the microscopic line and a wiring board have large peel strength even after line of 15 µm is etched. An ultra-thin copper foil wherein a carrier foil, a peeling layer, an ultra-thin copper foil are laminated in this order, the ultra-thin copper foil (before roughening treatment is performed) is an electrolytic copper foil that surface roughness of 2.5 µm as ten point height of roughness profile, and the minimum distance between peaks of salients of a based material is 5 µm or more. Moreover, the surface of the ultra-thin copper foil is performed roughening treatment.

    摘要翻译： 为了产生在附有载体箔的超薄铜箔并显微镜下的晶体颗粒可以，而不受载体箔的表面粗糙度被沉积，蚀刻可以进行直到在超细宽度搜索做线/空间为15微米或更小， 和微观线和布线板具有15微米线被蚀刻后，即使大的剥离强度。 的极薄铜箔worin载体箔（1），剥离层（2）的超薄铜箔（4）以此顺序层压，所述极薄铜箔（4）（粗糙化处理前是 进行的）的电解铜箔做了2.5微米的粗糙度轮廓的十点高度，并基于材料的salients的峰值之间的最小距离的表面粗糙度为5微米或更大。 更完了，超薄铜箔的表面上进行粗糙化处理（5）。

    Method of making electrolytic metal foil and apparatus used therefor
    14.
    发明公开
    Method of making electrolytic metal foil and apparatus used therefor 失效
    Verfahren und Vorrichtung zur elektrolytischen Herstellung von Metallfolien。

    公开(公告)号：EP0271293A1

    公开(公告)日：1988-06-15

    申请号：EP87310676.9

    申请日：1987-12-04

    申请人： FURUKAWA CIRCUIT FOIL CO., LTD.

    发明人： Nakatsugawa, Hiroshi

    IPC分类号： C25D1/04

    CPC分类号： C25D1/04

    摘要： Disclosed is a method of making electrolytic metal foil (7), comprising carrying out electrolysis by filling with an electrolytic solution a space (4) defined between a cathode drum (1) capable of rotating on a horizontal axis and an anode (2) provided in face of the surface of the drum, wherein the electrolytic solution is allowed to flow down from the upper part toward the lower part of the space at the flow velocity such that a gas generated in the solution during the electrolysis may virtually flow out downward in its whole quantity. Disclosed also is an apparatus for making electrolytic metal foil, comprising a cathode drum capable of rotating on a horizontal axis, an anode provided in face of the surface of the drum and provided a solution discharging outlet (3) which allow a gas generated during the electrolysis to flow down the space between the both electrodes at the flow velocity such that the gas generated may downward flow out virtually in its whole quantity together with an electrolytic solution for metal electrodeposition.
    According to this invention, the resulting electrolytic foil can be of dense texture and of excellent physical properties and surface states.

    摘要翻译： 公开了一种制造电解金属箔（7）的方法，包括通过在电解液中填充限定在能够在横轴上旋转的阴极筒（1）和阳极（2）之间的空间（4）来进行电解， 面对鼓的表面，其中允许电解液以流速从空间的上部向下部流下，使得在电解期间在溶液中产生的气体实际上可以向下流出 其总量。 还公开了一种用于制造电解金属箔的装置，包括能够在水平轴上旋转的阴极鼓，设置在所述滚筒表面的阳极，并设置有溶液排出口（3），所述溶液排出口允许在 电解以流速向下流过两个电极之间的空间，使得所产生的气体与用于金属电沉积的电解溶液一起实质上向下流出。 根据本发明，所得到的电解箔可以具有致密的结构和优异的物理性能和表面状态。

    Chip-on-film use copper foil
    18.
    发明公开
    Chip-on-film use copper foil 有权
    Kupferfoliefür芯片上的电影Verwendung

    公开(公告)号：EP1448035A1

    公开(公告)日：2004-08-18

    申请号：EP04003433.2

    申请日：2004-02-16

    申请人： FURUKAWA CIRCUIT FOIL CO., LTD.

    发明人： Yoshihara, Yasuhisa ,  Kimijima, Hisao

    IPC分类号： H05K3/38

    CPC分类号： C25D3/562 ,  C25D7/0614 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12028 ,  Y10T428/12063 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12493 ,  Y10T428/12861 ,  Y10T428/1291 ,  Y10T428/12993 ,  Y10T428/31663

    摘要： A copper foil having a high etching factor, enabling formation of fine patterns excellent in linearity of bottom lines of circuit patterns and without leaving particles of copper foil forming the circuit patterns in the resin, free from a drop in bond strength between the copper foil and resin substrate due to the processing for formation of solder balls, excellent in visibility, and excellent in mounting of ICs on fine patterns, comprising a copper foil on at least one surface of which is provided an alloy fine roughening particle layer comprised of a copper-cobalt-nickel alloy with contents of cobalt and nickel equal to or greater than that of copper, specifically a copper foil on the surface of the copper foil for bonding with the resin substrate of which is provided an alloy fine roughening particle layer comprised of 5 to 12 mg/dm 2 copper, 6 to 13 mg/dm 2 cobalt, and 5 to 12 mg/dm 2 nickel, wherein the alloy fine roughening particle layer provided on the copper foil surface may be treated for stainproof or may be treated by a silane coupling agent.

    摘要翻译： 具有高腐蚀因子的铜箔，能够形成电路图形的底线线性优异的精细图案，并且不留下在树脂中形成电路图案的铜箔颗粒，没有铜箔和 树脂基板，由于形成焊球的可靠性优异，并且IC在精细图案上的安装性优异，包括在其至少一个表面上具有铜箔的铜箔，所述合金细粗糙化颗粒层由铜 - 钴和镍的含量等于或大于铜的钴镍合金，特别是铜箔的表面上的铜箔，用于与其树脂基材粘合，其中提供了一种合金细化粗糙颗粒层，其包含5至 12mg / dm 2的铜，6〜13mg / dm 2的钴和5〜12mg / dm 2的镍，其中设置在铜箔表面上的合金细化粗糙颗粒层 可以进行防污处理，也可以用硅烷偶联剂进行处理。