公开(公告)号：EP4363640A1

公开(公告)日：2024-05-08

申请号：EP22743461.0

申请日：2022-06-30

Applicant: Umicore Galvanotechnik GmbH

Inventor： ZIEBART, Robert ,  WIRTH, Guenter ,  NEUHAUS, Silvia ,  MUELLER, Stefan

IPC: C25D5/10 ,  B32B15/01 ,  C22C9/02 ,  C22C9/04 ,  C22C13/00 ,  C25D7/00

CPC classification number: C22C9/02 ,  C22C9/04 ,  C22C13/00 ,  B32B15/01 ,  C25D5/10 ,  C25D7/00 ,  C25D3/58 ,  C22C30/00

公开(公告)号：EP3144416A4

公开(公告)日：2018-01-10

申请号：EP15793121

申请日：2015-05-15

Applicant: NIPPON STEEL & SUMITOMO METAL CORP ,  VALLOUREC OIL & GAS FRANCE

Inventor： KIMOTO MASANARI ,  ISHII KAZUYA ,  GOTO KUNIO ,  YAMAMOTO TATSUYA ,  OSHIMA MASAHIRO ,  NAKAO SEIICHIRO ,  YAMAGUCHI DAISUKE

IPC: C25D3/56 ,  C25D7/00 ,  C25D7/04 ,  F16L15/04

CPC classification number: C25D3/58 ,  C25D3/56 ,  C25D7/003 ,  C25D7/04 ,  F16L15/04

Abstract: Provided is a plating solution for a threaded connection for pipe or tube used for forming a plating film excellent in galling resistance, crevice corrosion resistance, and exposure corrosion resistance. The plating solution for a threaded connection for pipe or tube of the present embodiment contains no cyanide, but contains: a water-soluble copper salt; a water-soluble tin salt; a water-soluble bismuth salt; a free acid; and a thiourea-based compound of 10 g/L or less (excluding 0) that is represented by Chemical Formula (1): €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒX 1 X 2 N-C(=S)-NX 3 X 4 €ƒ€ƒ€ƒ€ƒ€ƒ(1), where each of X 1 , X 2 , X 3 , and X 4 is any one of hydrogen, an alkyl group, an allyl group, a tolyl group, or a group represented by Chemical Formula (2), but excluding that X 1 , X 2 , X 3 , and X 4 are all hydrogen: €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ-CH 2 -CH 2 -S-CH 2 -CH 2 -X 5 €ƒ€ƒ€ƒ€ƒ€ƒ(2), where X 5 is OH or NH 2 .

公开(公告)号：EP2576696B1

公开(公告)日：2017-10-04

申请号：EP11789339.6

申请日：2011-05-31

Applicant: BASF SE

Inventor： SIEMER, Michael ,  RÖGER-GÖPFERT, Cornelia ,  MEIER, Nicole ,  RAETHER, Roman, Benedikt ,  ARNOLD, Marco ,  EMNET, Charlotte ,  MAYER, Dieter ,  FLÜGEL, Alexander

IPC: C08L79/04 ,  C25D3/52 ,  C08G73/06 ,  C25D3/02 ,  C25D3/32 ,  C25D3/38 ,  C25D3/58 ,  C25D5/02 ,  C23C18/31

CPC classification number: C25D3/38 ,  C08G73/0616 ,  C08L79/04 ,  C23C18/31 ,  C25D3/02 ,  C25D3/32 ,  C25D3/58 ,  C25D5/02

公开(公告)号：EP3068819A4

公开(公告)日：2017-08-09

申请号：EP13896914

申请日：2013-11-06

Applicant: ROHM & HAAS ELECT MATERIALS ,  DOW GLOBAL TECHNOLOGIES LLC

Inventor： DUAN LINGLI ,  NIAZIMBETOVA ZUHRA I ,  CHEN CHEN ,  SUN TONG ,  RZEZNIK MARIA ANNA

IPC: C08G69/26 ,  C08G73/06 ,  C08K3/30 ,  C08L77/06 ,  C09D179/04 ,  C25D3/32 ,  C25D3/38 ,  C25D3/58 ,  C25D3/60 ,  C25D7/00 ,  C25D7/12 ,  H05K3/18

CPC classification number: C25D3/32 ,  C08G73/0616 ,  C09D179/04 ,  C25D3/38 ,  C25D3/58 ,  C25D3/60 ,  C25D7/00 ,  C25D7/123 ,  H05K3/10 ,  H05K3/188 ,  H05K2203/0723 ,  C08K3/30 ,  C08L71/02

Abstract: Polymers of reaction products of polyamines and nitrogen containing cyclic compounds are included in metal electroplating compositions to provide level metal deposits on substrates.

Abstract translation: 多胺和含氮环状化合物的反应产物的聚合物包含在金属电镀组合物中以在基材上提供水平金属沉积。

公开(公告)号：EP3026145A4

公开(公告)日：2017-04-12

申请号：EP14829592

申请日：2014-07-23

Applicant: JX NIPPON MINING & METALS CORP

Inventor： ISHII MASAFUMI ,  HONDA MISATO ,  MIYAMOTO NOBUAKI

IPC: C25D7/06 ,  B32B15/08 ,  H05K1/09 ,  H05K3/18 ,  H05K3/38

CPC classification number: H05K3/025 ,  B32B3/26 ,  B32B15/08 ,  B32B15/20 ,  B32B2457/08 ,  C23C18/1653 ,  C23C18/405 ,  C25D1/04 ,  C25D3/38 ,  C25D3/562 ,  C25D3/58 ,  C25D5/022 ,  C25D5/10 ,  C25D5/18 ,  C25D5/34 ,  C25D5/48 ,  C25D7/0614 ,  C25D7/0671 ,  H05K1/09 ,  H05K3/205 ,  H05K3/384 ,  H05K3/388 ,  H05K3/389 ,  H05K3/427 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/072 ,  H05K2203/0726 ,  H05K2203/1152

Abstract: The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil having a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 µm.

公开(公告)号：EP3026144A4

公开(公告)日：2017-04-12

申请号：EP14829332

申请日：2014-07-24

Applicant: JX NIPPON MINING & METALS CORP

Inventor： KOHIKI MICHIYA

IPC: C25D7/06 ,  B32B15/08 ,  C25D1/04 ,  H05K1/09 ,  H05K3/18

CPC classification number: H05K3/025 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B2457/08 ,  C23C18/1653 ,  C25D1/04 ,  C25D3/38 ,  C25D3/58 ,  C25D5/10 ,  C25D7/0614 ,  C25D7/0671 ,  H05K1/09 ,  H05K3/205 ,  H05K3/384 ,  H05K3/388 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/072 ,  H05K2203/0726

公开(公告)号：EP3103896A1

公开(公告)日：2016-12-14

申请号：EP16181053.6

申请日：2014-05-09

Applicant: The Royal Mint Limited

Inventor： JAMES, David Matthew ,  THOMAS, Ellis Rhys ,  HIBBERT, Gwilym

IPC: C25D3/12 ,  C25D3/22 ,  C25D3/38 ,  C25D3/56 ,  C25D3/58 ,  C25D5/04 ,  C25D5/48 ,  C25D15/00 ,  C25D21/10 ,  C25D7/00 ,  C23C18/16 ,  C09K11/02 ,  C25D3/30 ,  C25D5/20 ,  C25D5/36

CPC classification number: C25D15/00 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1662 ,  C25D3/12 ,  C25D3/22 ,  C25D3/30 ,  C25D3/38 ,  C25D3/56 ,  C25D3/562 ,  C25D3/565 ,  C25D3/58 ,  C25D5/20 ,  C25D5/36 ,  C25D5/48 ,  C25D7/00 ,  C25D7/005 ,  C25D21/10 ,  G07D5/00

Abstract: Herein is described an apparatus, for carrying out a method of plating articles, the apparatus comprising:
a container for holding a plating solution,
a receptacle for holding a plurality of articles within the plating solution, and,
a means for agitating the plating solution before and/or during the plating
wherein the receptacle for holding a plurality of articles within the plating solution is configured to move during the plating process,
wherein the means for agitating the plating solution before and/or during the plating, is:
(i) located in an agitation unit, that is separate from the container for holding the plating solution in which the articles are plated, and the apparatus is adapted to circulate the plating solution from the container for holding the plating solution in which the articles are plated to the agitation unit, in which the plating solution is agitated by subjecting the plating solution to high shear, before and/or during plating of the articles, and then return the plating solution to the container for holding the plating solution in which the articles are plated; and/or
(ii) a means for subjecting the plating solution to an ultrasound treatment. A method for plating articles is also described.

Abstract translation: 这里描述了一种用于执行电镀物品的方法的设备，该设备包括：用于保持电镀液的容器，用于在电镀溶液内保持多个物品的容器，以及用于在电镀溶液之前搅拌电镀溶液的装置 和/或在电镀期间，其中用于保持电镀溶液中的多个物品的容器被配置为在电镀过程期间移动，其中用于在电镀之前和/或期间搅拌电镀液的装置是：（i） 在搅拌单元中，其与用于保持制品被镀覆的电镀溶液的容器分离，并且该装置适于将电镀液从用于保持制品被镀覆的电镀溶液的容器循环至搅拌 单元，其中通过在电镀之前和/或期间对镀液进行高剪切来搅拌镀液，然后返回 电镀溶液到用于保持制品被镀覆的电镀溶液的容器; 和/或（ii）用于对镀液进行超声处理的装置。 还描述了电镀制品的方法。

公开(公告)号：EP3084042A1

公开(公告)日：2016-10-26

申请号：EP14818924.4

申请日：2014-12-11

Applicant: Umicore Galvanotechnik GmbH

Inventor： BRONDER, Klaus ,  BERGER, Sascha ,  WEYHMUELLER, Bernd ,  MANZ, Uwe

IPC: C25D3/58 ,  C25D3/60

CPC classification number: C25D3/58 ,  C25D3/60 ,  C25D17/10

Abstract: The present invention relates to a cyanide-free electrolyte which contains a phosphate and aliphatic or aromatic thio compounds and also to a process for the electrolytic deposition of an alloy of the elements copper and tin and optionally zinc. The electrolyte and the process are characterized in that stannate ions and copper ions and optionally zinc(II) ions and also aliphatic and/or aromatic thio compounds are present in the electrolyte used. The electrolyte can optionally additionally contain carboxylic acids, wetting agents and/or brighteners. The present invention further provides a process for the electrolytic deposition of alloys of copper, tin and optionally zinc on consumer goods and decorative goods using the electrolyte of the invention.

公开(公告)号：EP3068819A1

公开(公告)日：2016-09-21

申请号：EP13896914.2

申请日：2013-11-06

Applicant: Rohm and Haas Electronic Materials LLC ,  Dow Global Technologies LLC

Inventor： DUAN, Lingli ,  NIAZIMBETOVA, Zuhra I. ,  CHEN, Chen ,  SUN, Tong ,  RZEZNIK, Maria Anna

IPC: C08G69/26 ,  C08L77/06 ,  C25D3/02

CPC classification number: C25D3/32 ,  C08G73/0616 ,  C09D179/04 ,  C25D3/38 ,  C25D3/58 ,  C25D3/60 ,  C25D7/00 ,  C25D7/123 ,  H05K3/10 ,  H05K3/188 ,  H05K2203/0723 ,  C08K3/30 ,  C08L71/02

Abstract: Polymers of reaction products of polyamines and nitrogen containing cyclic compounds are included in metal electroplating compositions to provide level metal deposits on substrates.

公开(公告)号：EP3040451A2

公开(公告)日：2016-07-06

申请号：EP15194686.0

申请日：2015-11-16

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： NIAZIMBETOVA, Zuhra I. ,  RZEZNIK, Maria Anna

IPC: C25D7/12 ,  C25D3/32 ,  C25D3/38

CPC classification number: C25D3/38 ,  C07D303/04 ,  C07D303/18 ,  C25D3/32 ,  C25D3/58 ,  C25D7/123

Abstract: Reaction products of one or more amino acids and one or more epoxies are included in copper and copper alloy electroplating baths to provide good throwing power. Such reaction products may plate copper and copper alloys with good surface properties and good physical reliability.

Abstract translation: 一种或多种氨基酸和一种或多种环氧化物的反应产物包括在铜和铜合金电镀浴中以提供良好的投掷力。 这种反应产物可以对具有良好表面性能和良好物理可靠性的铜和铜合金进行镀覆。