公开(公告)号：EP1151033B1

公开(公告)日：2004-02-11

申请号：EP99954912.4

申请日：1999-10-14

申请人： Cool Options, Inc.

发明人： MCCULLOUGH, Kevin, A.

IPC分类号： C08K3/10 ,  C08K3/04 ,  C08K3/22 ,  C08K3/38 ,  H01B1/06 ,  C08K7/00

CPC分类号： C08K7/00 ,  C08K3/013 ,  C08K2201/014 ,  C08K2201/016 ,  H01L2924/0002 ,  H01L2924/00

摘要： A conductive molding composition, with a thermal conductivity above 22 W/m DEG K., is provided. The thermally conductive composition includes a polymer base matrix of, by volume, between 30 and 60 percent. A first thermally conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second thermally conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.