公开(公告)号：EP1783075A2

公开(公告)日：2007-05-09

申请号：EP06021626.4

申请日：2006-10-16

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Nishimura, Takanobu ,  Hiramitsu, Naruaki

IPC分类号： B65H3/06

CPC分类号： B65H3/0638 ,  B65H3/0653 ,  B65H2220/09 ,  B65H2401/111 ,  B65H2701/1916

摘要： A take-out roller (4) which rotates and contacts a paper sheet (P) supplied to a take-out position has an outer layer (42) to contact the paper sheet (P) and an inner layer (44) provided inside the outer layer. The outer layer (42) is made of relatively hard rubber material with a sufficient coefficient of kinetic friction. The inner layer (44) is made of relatively soft non-foamed rubber material deformable by a relatively weak force. When the take-out roller (4) contacts the paper sheet (P) supplied to the take-out position in the inclined state, the inner layer (44) is largely deformed, and the outer surface of the outer layer (42) stably contacts the surface of the paper sheet (P).

摘要翻译： 与提供给取出位置的纸张（P）旋转接触的取出辊（4）具有与纸张（P）接触的外层（42）和设置在纸张 外层。 外层（42）由相对硬的橡胶材料制成，具有足够的动摩擦系数。 内层（44）由相对较软的非发泡橡胶材料制成，可通过相对较弱的力变形。 当取出辊（4）以倾斜状态与供给到取出位置的纸张（P）接触时，内层（44）发生大的变形，外层（42）的外表面稳定 接触纸张（P）的表面。

公开(公告)号：EP1026709B1

公开(公告)日：2007-04-25

申请号：EP00101676.5

申请日：2000-02-02

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Okutomi, Tsutomu ,  Kusano, Takashi ,  Ohshima, Iwao ,  Homma, Mitsutaka ,  Yamamoto, Atsushi ,  Nishimura, Takanobu

IPC分类号： H01H1/02 ,  H01H33/66

CPC分类号： H01H1/0203

公开(公告)号：EP1598294A2

公开(公告)日：2005-11-23

申请号：EP05008405.2

申请日：2005-04-18

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Nishimura, Takanobu

IPC分类号： B65H3/52 ,  B65H3/06

CPC分类号： B65H3/5246 ,  B65H3/0653 ,  B65H2301/531 ,  B65H2701/1916

摘要： A sheet processing apparatus takes out postal matters that are inserted by a take-out roller, and separates them in sheets by a feed roller (21) and a reversing roller (22), and feeds into the apparatus. A cleaning roller (27) having rubber sponges having foamed vesicles in mean diameter 50 to 500 µm is provided to the feed roller (21) in contact with it. Paper-dusts on the surfaces of the feed roller (21) and the reversing roller (22) are removed by driving this cleaning roller (27) to rotate at a velocity equal to or higher than a rotating speed of the feed roller (21).

摘要翻译： 纸张处理设备取出由取出辊插入的邮件，并通过进给辊（21）和反转​​辊（22）将它们分离成片，并进给到装置中。 将具有平均直径为50〜500μm的泡沫泡沫的橡胶海绵的清洁辊（27）设置在与其接触的进给辊（21）上。 通过驱动该清洁辊（27）以等于或高于进给辊（21）的转速的速度旋转，将进给辊（21）和反转​​辊（22）的表面上的纸屑除去， 。

公开(公告)号：EP1026709A3

公开(公告)日：2002-03-20

申请号：EP00101676.5

申请日：2000-02-02

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Okutomi, Tsutomu ,  Kusano, Takashi ,  Ohshima, Iwao ,  Homma, Mitsutaka ,  Yamamoto, Atsushi ,  Nishimura, Takanobu

IPC分类号： H01H1/02 ,  H01H33/66

CPC分类号： H01H1/0203

摘要： {W - Cu x Sb - balance Cu} alloy is employed for contacts. As the anti-arcing constituent in the alloy W or WMo in a content of 65 to 85%, of grain diameter 0.4 to 9 µm is employed. As auxiliary constituent, Cu x Sb is employed, the content of the Cu x Sb being 0.09 to 1.4 weight%, the x being x=1.9 to 5.5, the grain diameter being 0.02 to 20 µm, and the mean distance between grains being 0.2 to 300 µm. As conductive constituent, Cu or CuSb solid solution is employed, the Sb content present in solid solution form in the CuSb solid solution being less than 0.5%. As a result, not only is dispersion of Cu x Sb, which is evaporated on subjection to arcing, reduced, but also generation of severe cracks, which have an adverse effect in terms of occurrence of restriking. Arcing at the contacts surfaces is prevented, suppressing dispersion and exfoliation of W grains. In this way, damage due to melting and dispersion at the contacts surfaces is reduced, enabling both restriking to be prevented and the contact resistance characteristic to be improved.

公开(公告)号：EP1026709A2

公开(公告)日：2000-08-09

申请号：EP00101676.5

申请日：2000-02-02

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Okutomi, Tsutomu ,  Kusano, Takashi ,  Ohshima, Iwao ,  Homma, Mitsutaka ,  Yamamoto, Atsushi ,  Nishimura, Takanobu

IPC分类号： H01H1/02 ,  H01H33/66

CPC分类号： H01H1/0203

摘要： {W - Cu x Sb - balance Cu} alloy is employed for contacts. As the anti-arcing constituent in the alloy W or WMo in a content of 65 to 85%, of grain diameter 0.4 to 9 µm is employed. As auxiliary constituent, Cu x Sb is employed, the content of the Cu x Sb being 0.09 to 1.4 weight%, the x being x=1.9 to 5.5, the grain diameter being 0.02 to 20 µm, and the mean distance between grains being 0.2 to 300 µm. As conductive constituent, Cu or CuSb solid solution is employed, the Sb content present in solid solution form in the CuSb solid solution being less than 0.5%. As a result, not only is dispersion of Cu x Sb, which is evaporated on subjection to arcing, reduced, but also generation of severe cracks, which have an adverse effect in terms of occurrence of restriking. Arcing at the contacts surfaces is prevented, suppressing dispersion and exfoliation of W grains. In this way, damage due to melting and dispersion at the contacts surfaces is reduced, enabling both restriking to be prevented and the contact resistance characteristic to be improved.

摘要翻译： äW - CuxSb - 平衡Cuü合金用于接触。 由于合金W或WMo的抗弧成分含量为65〜85％，粒径为0.4〜9μm。 作为辅助成分，使用CuxSb，CuxSb的含量为0.09〜1.4重量％，x为x = 1.9〜5.5，粒径为0.02〜20μm，晶粒间平均距离为0.2〜300μm 米 作为导电成分，使用Cu或CuSb固溶体，CuSb固溶体中以固溶体形式存在的Sb含量小于0.5％。 结果是，不仅在电弧放电时蒸发的CuxSb的分散减少，而且产生严重的裂纹，这在再起弧的发生方面具有不利影响。 阻止了接触面的电弧，抑制了W晶粒的分散和剥离。 以这种方式，由于触点表面的熔化和分散而导致的损伤减少，从而能够防止再起弧，并且提高接触电阻特性。

公开(公告)号：EP0827810A1

公开(公告)日：1998-03-11

申请号：EP97305885.2

申请日：1997-08-04

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Nishimura, Takanobu

IPC分类号： B24B37/04

CPC分类号： B24B37/14

摘要： A lapping surface plate consisting of an Fe-base material containing 0.8 to 3.5 wt% of C, 1 to 7 wt% of Si, 5 to 15 wt% of Ni, and 1 wt% or less of Mn, the balance substantially being Fe, further containing 0.1 wt% or less of at least one element selected from the group consisting of Mg, Ca, and Ce, and having a graphite structure and a hardness of 250 Hv or more.
Such a plate can be produced without quenching or rapid cooling to provide better accuracy and longer life in lapping operations upon e.g. semiconductor substrates.

摘要翻译： 由含有0.8〜3.5重量％的C，1〜7重量％的Si，5〜15重量％的Ni，1重量％以下的Mn构成的研磨表面板，余量基本上为Fe 进一步含有0.1重量％以下的选自Mg，Ca，Ce中的至少一种元素，具有石墨结构，硬度为250Hv以上。 可以在不进行淬火或快速冷却的情况下制造这样的板，以便提供更好的精度和更长的使用寿命。 半导体衬底。