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    Electrode arrangement of vacuum circuit breaker with magnetic member for longitudinal magnetization
    2.
    发明公开
    Electrode arrangement of vacuum circuit breaker with magnetic member for longitudinal magnetization 有权
    KontaktanordnungfürVakuumschalter mit MagnetelementfürdieSubeMagnetisierung

    公开(公告)号：EP0924729A2

    公开(公告)日：1999-06-23

    申请号：EP98123522.9

    申请日：1998-12-16

    申请人： KABUSHIKI KAISHA TOSHIBA

    发明人： Okutomi, Tsutomu ,  Seki, Tsuneyo ,  Ohshima, Iwao ,  Homma, Mitsutaka ,  Somei, Hiromichi ,  Uchiyama, Kumi ,  Niwa, Yoshimitsu ,  Watanabe, Kenji

    IPC分类号： H01H33/66

    CPC分类号： H01H33/6644 ,  H01H33/185

    摘要： Disclosed is an electrode arrangement of a vacuum circuit breaker for making and breaking electrical connection. The electrode arrangement has: a pair of contact members which are adopted for making contact to and release from each other by relatively moving to and from each other along a predetermined direction; a pair of electrically conductive bars being connected to the above pair of contact members, respectively, for providing electric conduction to the contact members; and a magnetizing device with a magnetic body for generating magnetic field parallel to the predetermined direction between the contact members. The magnetic body is composed of an iron alloy comprising 0.02 to 1.5 % by weight of carbon and iron. The iron alloy may further contain at least one of manganese and silicon.

    摘要翻译： 公开了用于制造和断开电连接的真空断路器的电极装置。 电极装置具有：一对接触构件，其通过沿着预定方向彼此相对移动而彼此接触和释放; 一对导电棒分别连接到上述一对接触构件，用于向接触构件提供电传导; 以及具有用于在接触构件之间产生平行于预定方向的磁场的磁体的磁化装置。 该磁性体由含有0.02-1.5％（重量）碳和铁的铁合金组成。 铁合金还可以含有锰和硅中的至少一种。

    Vacuum interrupter and vacuum switch thereof
    4.
    发明公开
    Vacuum interrupter and vacuum switch thereof 有权
    真空开关

    公开(公告)号：EP1026709A3

    公开(公告)日：2002-03-20

    申请号：EP00101676.5

    申请日：2000-02-02

    申请人： KABUSHIKI KAISHA TOSHIBA

    发明人： Okutomi, Tsutomu ,  Kusano, Takashi ,  Ohshima, Iwao ,  Homma, Mitsutaka ,  Yamamoto, Atsushi ,  Nishimura, Takanobu

    IPC分类号： H01H1/02 ,  H01H33/66

    CPC分类号： H01H1/0203

    摘要： {W - Cu x Sb - balance Cu} alloy is employed for contacts. As the anti-arcing constituent in the alloy W or WMo in a content of 65 to 85%, of grain diameter 0.4 to 9 µm is employed. As auxiliary constituent, Cu x Sb is employed, the content of the Cu x Sb being 0.09 to 1.4 weight%, the x being x=1.9 to 5.5, the grain diameter being 0.02 to 20 µm, and the mean distance between grains being 0.2 to 300 µm. As conductive constituent, Cu or CuSb solid solution is employed, the Sb content present in solid solution form in the CuSb solid solution being less than 0.5%. As a result, not only is dispersion of Cu x Sb, which is evaporated on subjection to arcing, reduced, but also generation of severe cracks, which have an adverse effect in terms of occurrence of restriking. Arcing at the contacts surfaces is prevented, suppressing dispersion and exfoliation of W grains. In this way, damage due to melting and dispersion at the contacts surfaces is reduced, enabling both restriking to be prevented and the contact resistance characteristic to be improved.

    Vacuum interrupter and vacuum switch thereof
    5.
    发明公开
    Vacuum interrupter and vacuum switch thereof 有权
    Vakuumschalter

    公开(公告)号：EP1026709A2

    公开(公告)日：2000-08-09

    申请号：EP00101676.5

    申请日：2000-02-02

    申请人： KABUSHIKI KAISHA TOSHIBA

    发明人： Okutomi, Tsutomu ,  Kusano, Takashi ,  Ohshima, Iwao ,  Homma, Mitsutaka ,  Yamamoto, Atsushi ,  Nishimura, Takanobu

    IPC分类号： H01H1/02 ,  H01H33/66

    CPC分类号： H01H1/0203

    摘要： {W - Cu x Sb - balance Cu} alloy is employed for contacts. As the anti-arcing constituent in the alloy W or WMo in a content of 65 to 85%, of grain diameter 0.4 to 9 µm is employed. As auxiliary constituent, Cu x Sb is employed, the content of the Cu x Sb being 0.09 to 1.4 weight%, the x being x=1.9 to 5.5, the grain diameter being 0.02 to 20 µm, and the mean distance between grains being 0.2 to 300 µm. As conductive constituent, Cu or CuSb solid solution is employed, the Sb content present in solid solution form in the CuSb solid solution being less than 0.5%. As a result, not only is dispersion of Cu x Sb, which is evaporated on subjection to arcing, reduced, but also generation of severe cracks, which have an adverse effect in terms of occurrence of restriking. Arcing at the contacts surfaces is prevented, suppressing dispersion and exfoliation of W grains. In this way, damage due to melting and dispersion at the contacts surfaces is reduced, enabling both restriking to be prevented and the contact resistance characteristic to be improved.

    摘要翻译： äW - CuxSb - 平衡Cuü合金用于接触。 由于合金W或WMo的抗弧成分含量为65〜85％，粒径为0.4〜9μm。 作为辅助成分，使用CuxSb，CuxSb的含量为0.09〜1.4重量％，x为x = 1.9〜5.5，粒径为0.02〜20μm，晶粒间平均距离为0.2〜300μm 米 作为导电成分，使用Cu或CuSb固溶体，CuSb固溶体中以固溶体形式存在的Sb含量小于0.5％。 结果是，不仅在电弧放电时蒸发的CuxSb的分散减少，而且产生严重的裂纹，这在再起弧的发生方面具有不利影响。 阻止了接触面的电弧，抑制了W晶粒的分散和剥离。 以这种方式，由于触点表面的熔化和分散而导致的损伤减少，从而能够防止再起弧，并且提高接触电阻特性。

    Contact material
    9.
    发明公开
    Contact material 有权
    Kontaktwerkstoff

    公开(公告)号：EP0929088A3

    公开(公告)日：2000-03-22

    申请号：EP99100112.4

    申请日：1999-01-04

    申请人： KABUSHIKI KAISHA TOSHIBA

    发明人： Okutomi, Tsutomu ,  Yamamoto, Atsushi ,  Ohshima, Iwao ,  Seki, Tsuneyo ,  Homma, Mitsutaka ,  Kusano, Takahasi

    IPC分类号： H01H1/02

    CPC分类号： H01H1/0203 ,  Y10S428/926 ,  Y10S428/929 ,  Y10T428/12014 ,  Y10T428/1216 ,  Y10T428/12167 ,  Y10T428/12458 ,  Y10T428/12903 ,  Y10T428/12993

    摘要： The contact material of the present invention comprises: an anti-arcing constituent consisting of at least one TiC, V and VC of which the content is 30 ~ 70 volume % and whose mean particle (grain) size is 0,1 ~ 9µm; C whose content is 0.005 ~ 0.5 weight % with respect to the anti-arcing constituent, whose diameter is 0.01 ~ 5 µ m when its shape is calculated as spherical, and which is in non-solid solution condition or condition in which it does not form a chemical compound; and a conductive constituent consisting of Cu and constituting the balance.

    摘要翻译： 本发明的接触材料包括：由至少一种TiC，V和VC组成的防弧成分，其含量为30和70体积％，其平均颗粒（颗粒）尺寸为0.1＆amp; ; 其形状计算为球形时的直径为0.01μm和5μm的抗弧形成分的含量为0.005以上且0.5重量％以下的C，其为非固溶体状态或不溶解条件 形成化合物; 和由Cu组成的导电成分构成天平。