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公开(公告)号：EP2564435A1
公开(公告)日：2013-03-06
申请号：EP11722561.5
申请日：2011-04-27
发明人： BASIN, Grigoriy , MARTIN, Paul, S.
CPC分类号： H01L33/0079 , H01L24/97 , H01L33/0095 , H01L33/22 , H01L33/50 , H01L2224/14 , H01L2224/81 , H01L2924/181 , H01L2933/0041 , H01L2924/00012
摘要： An LED wafer with a growth substrate (32) is attached to a carrier substrate by (38), for example, a heat - releasable adhesive (36) so that the LED layers are sandwiched between the two substrates. The growth substrate (32) is then removed, such as by laser lift-off. The exposed surface (46) of the LED layers is then etched (44) to improve light extraction. A preformed phosphor sheet (48), matched to the LEDs, is then affixed to the exposed LED layer. The phosphor sheet (48), LED layers (30), and, optionally, the carrier substrate (38) are then diced (54) to separate the LEDs. The LED dice are released from the carrier substrate by heat or other means, and the individual LED dice are mounted on a submount wafer using a pick-and-place machine. The submount wafer is then diced to produce individual LEDs. The active layer may generate blue light, and the blue light and phosphor light may generate white light having a predefined white point.
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12.发明授权
公开(公告)号：EP2564435B1
公开(公告)日：2017-09-27
申请号：EP11722561.5
申请日：2011-04-27
发明人： BASIN, Grigoriy , MARTIN, Paul, S.
CPC分类号： H01L33/0079 , H01L24/97 , H01L33/0095 , H01L33/22 , H01L33/50 , H01L2224/14 , H01L2224/81 , H01L2924/181 , H01L2933/0041 , H01L2924/00012
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公开(公告)号：EP2266149B1
公开(公告)日：2017-08-23
申请号：EP09722834.0
申请日：2009-03-13
CPC分类号： H01L33/54 , H01L24/97 , H01L33/0079 , H01L33/56 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
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公开(公告)号：EP1922767B1
公开(公告)日：2016-08-17
申请号：EP06795708.4
申请日：2006-08-21
IPC分类号： H01L33/00
CPC分类号： H01L33/504 , H01L24/97 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01051 , H01L2924/01058 , H01L2924/01063 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2933/0041 , H01L2224/81
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公开(公告)号：EP2537190B1
公开(公告)日：2014-05-07
申请号：EP11707915.2
申请日：2011-02-03
发明人： BASIN, Grigoriy , MARTIN, Paul S.
CPC分类号： H01L33/504 , B29C43/18 , H01L25/0753 , H01L33/005 , H01L33/0075 , H01L33/50 , H01L33/56 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A flexible film comprising a wavelength converting material is positioned over a light source. The flexible film is conformed to a predetermined shape. In some embodiments, the light source is a light emitting diode mounted on a support substrate. The diode is aligned with an indentation in a mold such that the flexible film is disposed between the support substrate and the mold. Transparent molding material is disposed between the support substrate and the mold. The support substrate and the mold are pressed together to cause the molding material to fill the indentation. The flexible film conforms to the shape of the light source or the mold.
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16.发明公开LAMINATE SUPPORT FILM FOR FABRICATION OF LIGHT EMITTING DEVICES AND METHOD ITS FABRICATION 审中-公开层压承载膜产生光发射装置及其制造方法
公开(公告)号：EP2633554A1
公开(公告)日：2013-09-04
申请号：EP11784784.8
申请日：2011-10-20
IPC分类号： H01L25/075 , H01L33/50
CPC分类号： H05B33/02 , F21V9/00 , H01L25/0753 , H01L33/50 , H01L33/58 , H01L33/62 , H01L2224/24 , H01L2933/0041 , H01L2933/0058 , H05B33/10 , Y10T428/24802 , Y10T428/2486 , Y10T428/24926
摘要： Optical elements (130) are attached to a support film (110) at select locations, the select locations corresponding to locations of light emitting elements (140) on another substrate, e.g. the substrate of the title (150).The film is placed on the substrate containing the light emitting elements such that the optical elements are in contact with their corresponding light emitting elements. The optical elements are laminated to the light emitting elements, and the support film is removed. The optical elements may include wavelength conversion elements, lens elements, combinations of elements, and so on. Other elements, such as conductors and reflectors may also be positioned on the laminate film.
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