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56 条记录 (耗时 0.016 秒)

    Polyimide, and preparation process of same
    11.
    发明公开
    Polyimide, and preparation process of same 失效
    Polyimid和dessen Herstellungsverfahren。

    公开(公告)号：EP0572196A1

    公开(公告)日：1993-12-01

    申请号：EP93304007.3

    申请日：1993-05-24

    申请人： MITSUI TOATSU CHEMICALS, Inc.

    发明人： Yamashita, Wataru ,  Okawa, Yuichi ,  Oikawa, Hideaki ,  Ishihara, Yuko ,  Matsuo, Mitsunori ,  Yamaguchi, Keizaburo ,  Yamaguchi, Akihiro

    IPC分类号： C08G73/10

    CPC分类号： C08G73/10 ,  C08G73/1007 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/1067 ,  Y10T428/31504 ,  Y10T428/31721

    摘要： This invention relates to a novel thermoplastic and amorphous polyimide which is readily soluble in organic solvent, a novel aromatic diamino compound used for the polyimide, and a preparation process thereof.
    The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula:

    wherein m and n are individually an integer of 0 or 1, and R is

    The polyimide of the invention is essentially amorphous, excellent in melt flow stability in the decreased temperature as compared with conventionally known polyimide and has greatly improved processability.
    The polyimide of the invention obtained by using a novel aromatic diamino compound as a monomer can control various properties such as melt flow ability and solubility in solvents by side chains and not by principal chain of polyimide. Thus, excellent melt flow property and solubility in solvents can be obtained while maintaining high heat resistance and adhesive property which are derived from benzophenone structure of the diamino compound of the the invention.

    摘要翻译： 本发明涉及易溶于有机溶剂的新型热塑性和无定形聚酰亚胺，用于聚酰亚胺的新型芳族二氨基化合物及其制备方法。 聚酰亚胺包含具有一个或多个下式的重复结构单元的必需结构单元：其中m和n分别为0或1的整数，R为CHEM本发明的聚酰亚胺基本上是无定形的，优异的 在与传统已知的聚酰亚胺相比在降低的温度下的熔体流动稳定性，并且具有极大的改进的加工性能。 通过使用新的芳族二氨基化合物作为单体获得的本发明的聚酰亚胺可以通过侧链而不是聚酰亚胺的主链来控制各种性能如熔体流动性和在溶剂中的溶解度。 因此，在保持由本发明的二氨基化合物的二苯甲酮结构得到的高耐热性和粘合性的同时，可以获得优异的熔体流动性和溶剂中的溶解性。

    Polyimide composition
    13.
    发明公开
    Polyimide composition 失效
    Polyimid Zusammensetzung。

    公开(公告)号：EP0564299A2

    公开(公告)日：1993-10-06

    申请号：EP93302611.4

    申请日：1993-04-01

    申请人： MITSUI TOATSU CHEMICALS, Inc.

    发明人： Okawa, Yuichi ,  Koga, Nobuhito ,  Oikawa, Hideaki ,  Asanuma, Tadashi ,  Yamaguchi, Akihiro

    IPC分类号： C08L79/08

    CPC分类号： C08L71/00 ,  C08G73/101 ,  C08L79/08 ,  C08L81/06

    摘要： This invention relates to a thermoplastic resin composition having good processability, comprising 99.9 ∼ 50 parts by weight of one or more thermoplastic resin and 0.1 ∼ 50 parts by weight of one or more liquid crystal type aromatic polyimide.
    The thermoplastic resin composition comprise 99.9 ∼ 50 parts by weight of one or more thermoplastic resin selected from the group consisting of aromatic polyimide, aromatic polyetherimide, aromatic polyamideimide, aromatic polyethersulfone and aromatic polyether ketone and 0.1 ∼ 50 parts by weight of one or more liquid crystal type aromatic polyimide having recurring structural units represented by the formula (1) :

    wherein R₁ ∼ R₅ is a hydrogen atom, fluorine atom, trifluoromethyl, methyl, ethyl or cyano and may be the same or different, and R is a tetravalent radical having 6 ∼ 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected each other with a direct bond or a bridge member.
    The present invention can provide thermoplastic resin compositions which have remarkably good processability and excellent thermal stability in addition to essentially excellent properties of each resin.

    摘要翻译： 本发明涉及一种具有良好加工性能的热塑性树脂组合物，其包含99.9:50重量份的一种或多种热塑性树脂和0.1〜50重量份的一种或多种液晶型芳族聚酰亚胺。 热塑性树脂组合物包含99.9〜50重量份选自芳香族聚酰亚胺，芳香族聚醚酰亚胺，芳香族聚酰胺酰亚胺，芳香族聚醚砜，芳香族聚醚酮等的1种以上的热塑性树脂和0.1〜50质量份的一种或多种液体 具有由式（1）表示的重复结构单元的结晶型芳族聚酰亚胺：其中R 1〜R 5为氢原子，氟原子，三氟甲基，甲基，乙基或氰基，可以相同或不同，R为 选自具有6个碳原子数为27个碳原子的四价基团，并且选自由直接键合或桥接元件相互连接的单芳族基团，稠合多芳族基团和非缩合芳族基团组成的组。 本发明可以提供除了每种树脂的基本上优异的性能之外，具有非常好的加工性和优异的热稳定性的热塑性树脂组合物。

    Heat-resistant adhesive and method of adhesion by using adhesive
    14.
    发明公开
    Heat-resistant adhesive and method of adhesion by using adhesive 失效
    耐高温粘合剂和使用粘合剂的粘合方法

    公开(公告)号：EP0511813A3

    公开(公告)日：1993-08-25

    申请号：EP92303787.3

    申请日：1992-04-27

    申请人： MITSUI TOATSU CHEMICALS, Inc.

    发明人： Oikawa, Hideaki ,  Iiyama, Katsuaki ,  Tamai, Shoji ,  Kawashima, Saburo ,  Yamaguchi, Akihiro ,  Asanuma, Tadashi

    IPC分类号： C08G73/10 ,  C09J179/08

    CPC分类号： C08G73/1071 ,  C08G73/1014 ,  C08G73/1017 ,  C09J179/08 ,  H05K3/386 ,  Y10S525/928

    摘要： The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3′, 4,4′-biphenyltetracarboxylic dianhydride, 3,3′,4,4′-benzophenonetetracarboxylic dianhydride and/or 3,3′,4,4′-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound ; or comprises a polyimide solution containing the polyimide in a good solvent. The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength. Consequently, the heat-resistant adhesive of the invention is very useful for the adhesion of structural and electronic materials and other industrial materials.

    Process for preparing polyimide and composite material thereof
    17.
    发明公开
    Process for preparing polyimide and composite material thereof 失效
    制备聚酰亚胺及其复合材料的方法

    公开(公告)号：EP0315479A3

    公开(公告)日：1990-10-31

    申请号：EP88310413.5

    申请日：1988-11-04

    申请人： MITSUI TOATSU CHEMICALS, Inc.

    发明人： Ohta, Masahiro ,  Tamai, Shoji ,  Kawashima, Saburo ,  Oikawa, Hideaki ,  Yamaguchi, Akihiro ,  Nakakura, Toshiyuki ,  Masuda, Misao ,  Maruko, Chiaki ,  Koba, Tomohito ,  Sakai, Hideo ,  Kishi, Satoru

    IPC分类号： C08G73/10 ,  C08J5/04

    摘要： This invention relates to a method for preparing polyimide having good heat-stability and excellent flowability in a molten state. The polymide is prepared by reacting aromatic diamines such as 4,4′-bis(3-aminophenoxy)biphenyl, bis[4-(3-aminophenoxy)phenyl] ketone and bis [4-(3-aminophenoxy)phenyl] sulfone; tetracarboxylic dianhydrides such as pyromellitic dianhydride, 3,3′,4,4′-benzophenonetetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl) ether dianhydride; and monoamines such as n-hexylamine, cyclohexylamine, aniline, 4-aminobenzophenone. The molar ratio of tetracarboxylic dianhydride : aromatic diamine : monoamine is 1:(0.9 to 1.0):(0.001 to 1.0). Another invention relates to polyimide composite materials which are excellent in mechanical strengths and processability. The materials contain the polyimide above prepared and fibrous reinforcing materials such as yarn, roving, tow, fabrics, mats and felts of glass fiber, carbon fibers or aromatic polyamide fibers.

    摘要翻译： 本发明涉及一种在熔融状态下具有良好热稳定性和优异流动性的聚酰亚胺的制备方法。 聚酰亚胺是通过使芳族二胺如4,4'-双（3-氨基苯氧基）联苯，双[4-（3-氨基苯氧基）苯基]酮和双[4-（3-氨基苯氧基）苯基]砜反应制备的; 四羧酸二酐如均苯四酸二酐，3,3'，4,4'-二苯甲酮四羧酸二酐和双（3,4-二羧基苯基）醚二酐; 和单胺如正己胺，环己胺，苯胺，4-氨基二苯甲酮。 四羧酸二酐：芳香族二胺：一元胺的摩尔比为1：（0.9〜1.0）：（0.001〜1.0）。 另一发明涉及机械强度和可加工性优异的聚酰亚胺复合材料。 这些材料包含上面制备的聚酰亚胺和纤维增强材料，例如纱线，粗纱，丝束，织物，玻璃纤维的垫子和毛毡，碳纤维或芳族聚酰胺纤维。

    Polyimide resin composition
    18.
    发明公开
    Polyimide resin composition 失效
    Polyimid Harzzubereitung。

    公开(公告)号：EP0294195A2

    公开(公告)日：1988-12-07

    申请号：EP88305033.8

    申请日：1988-06-02

    申请人： MITSUI TOATSU CHEMICALS, Inc.

    发明人： Ohta, Masahiro ,  Tamai, Shoji ,  Kawashima, Saburo ,  Oikawa, Hideaki ,  Yamaguchi, Akihiro ,  Iiyama, Katsuaki

    IPC分类号： C08L79/08

    CPC分类号： C08L79/08

    摘要： Resin composition composed of 99.9 to 50 % by weight of a polyimide having a repeating unit of the formula as defined below and 0.1 to 50 % by weight of an aromatic polyamideimide are improved in heat resistance and mechanical strength and have the inherent properties of polyimide;
    where X indicates a direct bond or is -S- or
    and R is a tetravalent radical selected from the group consisting of aliphatic radicals having at least 2 carbon atoms, cycloaliphatic radicals, monocycloaromatic radicals and condensed polycycloaromatic radicals, and uncon­densed polycycloaromatic radicals including aromatic radicals interconnected directly or through a cross-linkage.

    摘要翻译： 由99.9〜50重量％的具有下式的重复单元的聚酰亚胺和0.1〜50重量％的芳香族聚酰胺酰亚胺构成的树脂组合物的耐热性和机械强度提高，具有聚酰亚胺的固有性质; 其中X表示直接键或是-S-或，R是选自具有至少2个碳原子的脂族基团，环脂族基团，单环芳族基团和缩合多环芳族基团的四价基团，以及 非缩合的多环芳族基团，包括直接或通过交联键互连的芳族基团。