摘要:
Disclosed are a novel aromatic diamine; a polyimide comprising 1,3-bis(3-aminobenzoyl)benzene or 4,4′-bis(3-aminobenzoyl)biphenyl as a diamine component and having recurring structural units represented by the formula (III):
wherein R is a tetravalent radical selected from the group consisting of an aliphatic radical having from 2 to 27 carbon atoms, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, and noncondensed aromatic radical connected each other with a direct bond or a bridge member, and X is a divalent radical of
or
; and a polyimide having a terminal aromatic group which is essentially unsubstituted or substituted with a radical having no reactivity with amines or dicarboxylic acid anhydrides or a composition comprising said polyimide.
摘要:
This invention discloses high-temperature adhesives having a good light-transmittance and excellent high-temperature flowability which comprises polyimide having recurring units represented by the following formula (I) (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutally connected with a bond or a crosslinking function). The ployimide is obtained by preparing polyamic acid through the reaction of 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3,-hexafluoropropane as a diamine component with tetracarboxylic dianhydride such as pyromellitic dianhydride, 3,3ʹ,4,4ʹ-biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride and 3,3ʹ4,4ʹ-benzophenonetetracarboxylic dianhydride, and further conducting the ring-closing reaction of resultant polyamic acid by dehydration.
摘要:
This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin composition of this invention consists of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high temperature engineering polymer. The polyimide consists of recurring units of the following formula: wherein X is a sulfonyl radical or a carbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, The high temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: aromatic polysulfone consisting of recurring units of the formula: or aromatic polyetherimide consisting of recurring units of the formula:
摘要:
Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability. The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives. The polyimide has recurring units of the following formula (I): wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage. The polyimide of this invention is prepared by reacting 4,4ʹ-(p-phenylenedioxy)diphthalic dianhydride with an ether diamine having the following general formula (V): and successively imidizing the resultant polyamic acid.