Heat-curable epoxy compositions and their use in preparing formed articles
    14.
    发明公开
    Heat-curable epoxy compositions and their use in preparing formed articles 失效
    WärmehärtbareEpoxyzusammensetzungen und deren AnwendungfürgeformteGegenstände。

    公开(公告)号:EP0096906A1

    公开(公告)日:1983-12-28

    申请号:EP83200647.2

    申请日:1983-05-04

    摘要: Heat-curable epoxy compositions comprise:

    (1) an epoxy compound having an average more than one epoxy group per molecule,
    (2) at least one unsaturated monomer selected from the group consisting of esters of ethylenically unsaturated monocarboxylic acids, cyano-containing compounds, allyl compounds, olefins and diolefins,
    (3) a carboxyl-containing compound,
    (4) at least one epoxy curing accelerator, and
    (5) a free-radical curing agent.

    An unsaturated aromatic monomer, such as styrene, may additionally be present. The compositions may be moulded and cured by application of heat to produce formed articles.

    摘要翻译: 可热固化的环氧组合物包括:(1)每分子具有平均多于一个环氧基的环氧化合物,(2)至少一种选自烯属不饱和一元羧酸的酯,含氰基化合物, 烯丙基化合物,烯烃和二烯烃,(3)含羧基化合物,(4)至少一种环氧固化促进剂,和(5)自由基固化剂。 可以另外存在不饱和芳族单体,例如苯乙烯。 组合物可以通过加热来模制和固化以产生成形制品。

    Phenolic compounds and glycidyl ethers thereof
    17.
    发明公开
    Phenolic compounds and glycidyl ethers thereof 失效
    Phenolische Verbindungen sowie ihre Glycidylethern。

    公开(公告)号:EP0608952A1

    公开(公告)日:1994-08-03

    申请号:EP94200175.1

    申请日:1994-01-26

    摘要: The present invention relates to a phenolic compound of formula I:

    and to an epoxy resin of the formula II:

    In the above formulae I and II Ar is an aromatic moiety, L is a divalent hexanenorbornane linking moiety, L' is a divalent cycloaliphatic moiety, Gly is a glycidyl ether group, and each of m and n is a number within the range of 0 to 10.
    The above phenols include the product of addition reaction of phenol with a cyclohexenenorbornene compound such as 5-(3-cyclohexen-1-yl)bicyclo[2.2.1]hept-2-ene and the above epoxy resins include the glycidation product thereof. Epoxy resin compositions comprising either the above phenolic compound or the above epoxy resin have in particular low melt viscosity are useful as resinous component of high-performance electrical laminating and encapsulation formulations.

    摘要翻译: 本发明涉及式I的酚类化合物:< CHEM>和式II的环氧树脂:< CHEM>上述式I和II中Ar是芳香族部分,L是二价的己烷-N-降冰片烷基连接部分,L '是二价脂环族部分,Gly是缩水甘油醚基团,m和n各自为0〜10的数。上述酚类包括苯酚与环己烯降冰片烯化合物如5- (3-环己烯-1-基)双环[2.2.1]庚-2-烯和上述环氧树脂包括其缩水甘油产物。 包含上述酚类化合物或上述环氧树脂的环氧树脂组合物具有特别低的熔体粘度,可用作高性能电层压和包封配方的树脂组分。

    Modified bisimide compositions
    20.
    发明公开
    Modified bisimide compositions 失效
    改性双酰亚胺组合物

    公开(公告)号:EP0516237A1

    公开(公告)日:1992-12-02

    申请号:EP92201496.4

    申请日:1992-05-25

    摘要: The solution stability of a modified bisimide resin is enhanced by partially polymerizing a mixture of a bisimide monomer and a reactive triene which contains a conjugated double bond capable of Diels-Alder reaction with the bisimide. Such partial polymerization of a bisimide with a reactive triene such as myrcene provides a modified bisimide having good solubility in an organic solvent, and particularly suitable for electrical laminating applications.

    摘要翻译: 通过部分聚合双酰亚胺单体和含有能够与双酰亚胺进行Diels-Alder反应的共轭双键的反应性三烯的混合物,改进了改性双酰亚胺树脂的溶液稳定性。 双酰亚胺与反应性三烯如月桂烯的这种部分聚合反应提供了在有机溶剂中具有良好溶解性的改性双酰亚胺,并且特别适用于电层压应用。