摘要:
A composition comprising a curable epoxy resin, a reactive diluent, a curing agent for the epoxy resin, and an isocyanate compound which is stable at room temperature for extended periods of time and cures to form a part which has good high-temperature properties.
摘要:
A curable composition, comprising: (1) from 98 to 24 pbw of polyepoxide, (2) from 1 to 75 pbw of an unsaturated aromatic monomer, (3) from 1 to 75 pbw of a polyacrylate or polymethacrylate ester of a polyol, (4) from 0.01 to 10 pbw of a tetrafluoroborate of Cu, Zn, Fe, Ni, Sn, Sb or Al per 100 pbw of the polyepoxide, and (5) a curing amount of a free-radical curing agent.
摘要:
Heat-curable compositions exhibiting improved room temperature pot life and reduced viscosity are obtained from composition comprising a polyepoxide, an aromatic or aliphatic amine, a trihydrocarbyl sulphonium salt, a free radical curing agent and an unsaturated monomer selected from vinylaromatic monomers, alkylesters of unsaturated carboxylic acids, cyano-compounds, vinyl-ester, N-vinylames and allyl compounds.
(1) an epoxy compound having an average more than one epoxy group per molecule, (2) at least one unsaturated monomer selected from the group consisting of esters of ethylenically unsaturated monocarboxylic acids, cyano-containing compounds, allyl compounds, olefins and diolefins, (3) a carboxyl-containing compound, (4) at least one epoxy curing accelerator, and (5) a free-radical curing agent.
An unsaturated aromatic monomer, such as styrene, may additionally be present. The compositions may be moulded and cured by application of heat to produce formed articles.
摘要:
The present invention relates to a phenolic compound of formula I:
and to an epoxy resin of the formula II:
In the above formulae I and II Ar is an aromatic moiety, L is a divalent hexanenorbornane linking moiety, L' is a divalent cycloaliphatic moiety, Gly is a glycidyl ether group, and each of m and n is a number within the range of 0 to 10. The above phenols include the product of addition reaction of phenol with a cyclohexenenorbornene compound such as 5-(3-cyclohexen-1-yl)bicyclo[2.2.1]hept-2-ene and the above epoxy resins include the glycidation product thereof. Epoxy resin compositions comprising either the above phenolic compound or the above epoxy resin have in particular low melt viscosity are useful as resinous component of high-performance electrical laminating and encapsulation formulations.
摘要:
A composition comprising a 1,2-dialkylidenecyclobutane such as 1,2-dimethylenecyclobutane and a polyimide such as a bismaleimide can be thermally cured to a tough copolymer having a high glass transition temperature and low water absorbance.
摘要:
The solution stability of a modified bisimide resin is enhanced by partially polymerizing a mixture of a bisimide monomer and a reactive triene which contains a conjugated double bond capable of Diels-Alder reaction with the bisimide. Such partial polymerization of a bisimide with a reactive triene such as myrcene provides a modified bisimide having good solubility in an organic solvent, and particularly suitable for electrical laminating applications.