公开(公告)号：EP4397702A2

公开(公告)日：2024-07-10

申请号：EP24177664.0

申请日：2019-01-11

申请人： Mitsubishi Chemical Corporation

发明人： Teranishi, Takuya ,  Okamoto, Satoshi ,  Oota, Akira ,  Ichino, Masahiro

IPC分类号： C08J5/24

CPC分类号： C08G59/4021 ,  C08G59/686 ,  C08G59/5086 ,  C08G59/5073 ,  C08G59/245 ,  C08G59/26 ,  C08G59/56 ,  C08G59/3218 ,  C08J5/042 ,  C08J2363/0020130101 ,  C08J2463/0020130101 ,  C08J3/226 ,  C08J5/243

摘要： A prepreg contains: a reinforcing fiber material; and a resin composition with which the reinforcing fiber material is impregnated. The resin composition contains an epoxy resin, an amine curing agent, and an imidazole curing agent. An amount of the amine curing agent is less than or equal to 3.8 parts by mass, relative to 100 parts by mass of the epoxy resin, and a sum of the amount of the amine curing agent and an amount of the imidazole curing agent is less than or equal to 10 parts by mass, relative to 100 parts by mass of the epoxy resin. The fiber-reinforced composite material is a cured product of the prepreg.

公开(公告)号：EP3590991B1

公开(公告)日：2024-05-01

申请号：EP18761012.6

申请日：2018-02-27

IPC分类号： C08G59/56 ,  C08G59/62 ,  C08J5/04 ,  C08J5/24 ,  C08G59/68

CPC分类号： C08G59/56 ,  C08J5/042 ,  C08J2363/0020130101 ,  C08G59/504 ,  C08G59/621 ,  C08G59/68 ,  C08J5/249

公开(公告)号：EP3441385A1

公开(公告)日：2019-02-13

申请号：EP17779118.3

申请日：2017-04-04

申请人： Mitsubishi Gas Chemical Company, Inc.

发明人： SATO, Saeko ,  ASAI, Yuiga ,  WADA, Tomotaka ,  HANAOKA, Takuma

IPC分类号： C07C211/27 ,  C07C209/60 ,  C08G59/50 ,  C09D7/12 ,  C09D163/00 ,  C09J11/06 ,  C09J163/00 ,  C09K3/10 ,  C07B61/00

CPC分类号： C08G59/5033 ,  C07B61/00 ,  C07C209/60 ,  C07C211/27 ,  C08G59/50 ,  C08G59/56 ,  C08K5/0025 ,  C09D7/40 ,  C09D163/00 ,  C09J11/06 ,  C09J163/00 ,  C09K3/10

摘要： Provided are an amine compound represented by the following formula (1), which has a low active hydrogen equivalent weight and thus is capable of providing a cured product having good properties because the amine compound has sufficient curability even though the amount of amine compound blended in an epoxy resin composition is small when the amine compound is used as an epoxy resin curing agent, and an amine composition and an epoxy resin curing agent, which contain the compound:

wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

公开(公告)号：EP2731979B1

公开(公告)日：2018-08-22

申请号：EP12733145.2

申请日：2012-07-09

申请人： Sika Technology AG

发明人： KRAMER, Andreas ,  KASEMI, Edis

IPC分类号： C08G59/50 ,  C08G59/56 ,  C08G59/62 ,  C08L63/00 ,  C09D163/00

CPC分类号： C08G59/623 ,  B05D1/00 ,  C08G59/50 ,  C08G59/5033 ,  C08G59/56 ,  C08L63/00 ,  C09D163/00 ,  C09K3/00

公开(公告)号：EP2746328B1

公开(公告)日：2018-06-20

申请号：EP13005821.7

申请日：2013-12-13

申请人： Evonik Degussa GmbH

发明人： Patel, Pritesh G. ,  Tijsma, Edze Jan

IPC分类号： C08K5/16 ,  C08G59/50 ,  C08L63/00 ,  C08G59/56 ,  C08K7/02

CPC分类号： C08K7/14 ,  C08G59/50 ,  C08G59/56 ,  C08K5/16 ,  C08K7/02 ,  C08K7/06 ,  C08L1/02 ,  C08L63/00 ,  C08L63/04

摘要： An epoxy resin composition having a curing component and an epoxy component is disclosed. The curing component includes an amount of about 8% to about 70% by weight of the composition of a primary curing agent and about 0.001% to about 5% by weight of the composition of a secondary curing agent. The present disclosure includes the use of solid secondary curing agents, in particular solvated secondary curing agents, and methods to formulate such a solvated solid to result in a liquid curing component. The epoxy composition also includes about 30% to about 92% by weight of the composition of the epoxy component. A number of equivalents of reactive curative groups in the curing component is from about 0.50 to 0.98 times the number of epoxide equivalents present in the epoxy component. An epoxy product formed from the epoxy resin composition is also disclosed.

公开(公告)号：EP3202866A4

公开(公告)日：2017-12-13

申请号：EP15846386

申请日：2015-09-15

申请人： TATSUTA ELECTRIC WIRE & CABLE CO LTD

发明人： UMEDA HIROAKI ,  MATSUDA KAZUHIRO

IPC分类号： C09D163/00 ,  C09D4/02 ,  C09D5/24 ,  C09D7/12 ,  H01L21/56 ,  H01L23/29 ,  H01L23/552

CPC分类号： C09D5/24 ,  C08G59/46 ,  C08G59/56 ,  C08K5/07 ,  C08L33/26 ,  C09D5/031 ,  C09D7/40 ,  C09D163/00 ,  H01L21/56 ,  H01L23/00 ,  H01L23/28 ,  H01L23/29 ,  H01L23/295 ,  H01L23/31 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/3025

摘要： Provided herein is a conductive coating material that can be spray coated to form a shielding layer having desirable shielding performance, and desirable adhesion to a package. A shielded package producing method using the conductive coating material is also provided. The conductive coating material comprises at least (A) 100 parts by mass of a binder component containing 5 to 30 parts by mass of a solid epoxy resin that is solid at ordinary temperature, and 20 to 90 parts by mass of a liquid epoxy resin that is liquid at ordinary temperature, (B) 200 to 1800 parts by mass of metallic particles, and (C) 0.3 to 40 parts by mass of a curing agent. The conductive coating material has a viscosity of 3 to 30 dPa·s.

公开(公告)号：EP3202866A1

公开(公告)日：2017-08-09

申请号：EP15846386.9

申请日：2015-09-15

申请人： Tatsuta Electric Wire & Cable Co., Ltd.

发明人： UMEDA, Hiroaki ,  MATSUDA, Kazuhiro

IPC分类号： C09D163/00 ,  C09D4/02 ,  C09D5/24 ,  C09D7/12 ,  H01L21/56 ,  H01L23/00 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31

CPC分类号： C09D5/24 ,  C08G59/46 ,  C08G59/56 ,  C08K5/07 ,  C08L33/26 ,  C09D5/031 ,  C09D7/40 ,  C09D163/00 ,  H01L21/56 ,  H01L23/00 ,  H01L23/28 ,  H01L23/29 ,  H01L23/295 ,  H01L23/31 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/3025

摘要： Provided herein is a conductive coating material that can be spray coated to form a shielding layer having desirable shielding performance, and desirable adhesion to a package. A shielded package producing method using the conductive coating material is also provided. The conductive coating material comprises at least (A) 100 parts by mass of a binder component containing 5 to 30 parts by mass of a solid epoxy resin that is solid at ordinary temperature, and 20 to 90 parts by mass of a liquid epoxy resin that is liquid at ordinary temperature, (B) 200 to 1800 parts by mass of metallic particles, and (C) 0.3 to 40 parts by mass of a curing agent. The conductive coating material has a viscosity of 3 to 30 dPa·s.

摘要翻译： 本文提供了可以喷涂的导电涂层材料，以形成具有期望的屏蔽性能和期望的与封装的粘合性的屏蔽层。 还提供了使用导电涂层材料的屏蔽封装制造方法。 导电性涂料至少含有（A）100质量份粘合剂成分和20〜90质量份液态环氧树脂，所述粘合剂成分含有5〜30质量份常温下为固体的固态环氧树脂， 在常温下为液态，（B）金属粒子200〜1800质量份，（C）固化剂0.3〜40质量份。 导电性涂料的粘度为3〜30dPa·s。

公开(公告)号：EP3178863A1

公开(公告)日：2017-06-14

申请号：EP16201591.1

申请日：2016-12-01

申请人： Evonik Degussa GmbH

发明人： Ortelt, Martina ,  Fuchsmann, Dirk ,  de Nardo, Sebastian ,  Langkabel, Eike ,  Kohlstruk, Britta ,  Sandkühler, Annette ,  Aldridge, Ralph ,  Karns, Katharina

IPC分类号： C08G59/50 ,  C08J5/24 ,  C08G59/56

CPC分类号： C08G59/506 ,  B32B27/26 ,  B32B27/38 ,  C08G59/245 ,  C08G59/3227 ,  C08G59/50 ,  C08G59/5073 ,  C08G59/56 ,  C08J5/04 ,  C08J5/042 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00

摘要： Gegenstand der Erfindung sind Epoxidharz-Zusammensetzungen bestehend aus mindestens einer Harzkomponente und mindestens einer Härterkomponente, wobei die Zusammensetzung geeignet ist als duroplastische Matrix zur Herstellung von Faser-Matrix-Halbzeugen und ausgehärteten Faser-Matrix-Laminaten, sogenannten Composites.

摘要翻译： 本发明涉及包含至少一种树脂组分和至少一种硬化剂组分，其中所述组合物是适合作为热固性基质用于生产纤维基质半成品和固化的纤维基质层压件，即所谓的复合材料的环氧树脂组合物。

公开(公告)号：EP3178862A1

公开(公告)日：2017-06-14

申请号：EP15199600.6

申请日：2015-12-11

申请人： Evonik Degussa GmbH

发明人： ORTELT, dr., Martina ,  LANGKABEL, Eike ,  FUCHSMANN, Dirk ,  KOHLSTRUK, Britta ,  KARNS, Katharina

IPC分类号： C08G59/50 ,  C08J5/24 ,  C08G59/56

CPC分类号： C08G59/502 ,  C08G59/506 ,  C08G59/56 ,  C08G59/686 ,  C08J5/04 ,  C08J5/042 ,  C08J2363/00 ,  C08J2363/02

摘要： Gegenstand der Erfindung sind Epoxid-Zusammensetzungen bestehend aus mindestens einer Harzkomponente und mindestens einer Härterkomponente, wobei die Zusammensetzung geeignet ist als duroplastische Matrix zur Herstellung von Faser-Matrix-Halbzeugen und ausgehärteten Faser-Matrix-Laminaten.

摘要翻译： 本发明涉及由至少一种树脂组分和至少一种硬化剂组分组成的环氧组合物，其中所述组合物适合作为用于生产纤维基质半成品和固化纤维基质层压材料的热固性基质。

公开(公告)号：EP3176200A1

公开(公告)日：2017-06-07

申请号：EP15826619.7

申请日：2015-07-03

申请人： Toray Industries, Inc.

发明人： HONDO, Kazunori ,  TOMIOKA, Nobuyuki

IPC分类号： C08G59/56 ,  C08J5/24

CPC分类号： C08J5/04 ,  C08G59/3227 ,  C08G59/5033 ,  C08G59/56 ,  C08G59/62 ,  C08G59/621 ,  C08J5/042 ,  C08J5/24 ,  C08J2363/00

摘要： A two-pack type epoxy resin composition for a fiber-reinforced composite material, including the following components (A) to (C), the epoxy resin composition having: an epoxy base resin liquid containing 30 mass% or more and 100 mass% or less of a component (A) and a curing agent liquid containing a component (B). The component (A) is a glycidylamine type epoxy resin; the component (B) is an aromatic amine; and the component (C) is a compound having at least two aromatic rings each of which has a phenolic hydroxy group.

摘要翻译： 一种双组分型纤维增强复合材料用环氧树脂组合物，其包含以下组分（A）至（C）），所述环氧树脂组合物具有：含有30质量％以上至100质量％的环氧树脂基树脂液，或 较少组分（A）和含有组分（B）的固化剂液体。 组分（A）是缩水甘油胺型环氧树脂; 组分（B）是芳族胺; （C）成分为具有至少两个具有酚羟基的芳香环的化合物。