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公开(公告)号：EP3728390B1
公开(公告)日：2023-03-01
申请号：EP18890806.5
申请日：2018-12-17
发明人： KINCAID, Derek , LE, Dong , GHAZIZADEH, Madhi , TAO, Tao
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公开(公告)号：EP4074746A1
公开(公告)日：2022-10-19
申请号：EP20900457.1
申请日：2020-10-23
发明人： TABUCHI, Akihiro
摘要： A resin composition according to the present invention includes an epoxy resin, a curing agent, and an inorganic filler, the inorganic filler being dispersed in the epoxy resin, wherein the epoxy resin includes a tetramethylbisphenol F type epoxy resin, and the curing agent includes a trisphenol type phenol resin.
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公开(公告)号：EP3683249A1
公开(公告)日：2020-07-22
申请号：EP17925438.8
申请日：2017-09-28
发明人： ZHOU, Meng , LIU, Zhaoxing , DU, Xiucai , SUN, Xiaoli , CHU, Changkun , ZHANG, Congying , LI, Xin , JIANG, Qingmei
摘要： The present invention provides an epoxy resin material, a preparation method therefor and an application thereof. The present method for preparing an epoxy resin material comprises: heating a mixture of an epoxy resin main agent and a curing agent that are placed at room temperature to 40-85 °C for reaction and curing. The curing agent contains an adduct of an olefinic nitrile compound and an amine compound. The present method for preparing an epoxy resin material has the characteristics of low mixing viscosity, long operation time, and low amount of heat released during preparation.
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4.发明授权
公开(公告)号：EP3030615B1
公开(公告)日：2019-12-18
申请号：EP14835426.9
申请日：2014-08-06
IPC分类号： C08L63/02 , C08L71/12 , C08G59/02 , C08G65/38 , C09D163/02 , C09D171/12
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公开(公告)号：EP3424702A1
公开(公告)日：2019-01-09
申请号：EP17760050.9
申请日：2017-02-28
发明人： FUJIWARA,Takeshi , INAGAKI, Jyunichi , AGARI, Yasuyuki , HIRANO, Hiroshi , KADOTA, Joji , OKADA, Akinori
摘要： The present invention is a laminate: with which differences in the thermal expansion coefficient at interfaces between different materials in the interior of a semiconductor element or the like can be kept small; which has high heat resistance; and which has high thermal conductivity. This laminate is provided with at least two layers of thermal expansion-controlling members, the thermal expansion-controlling members including a thermally conductive first inorganic filler joined to one end of a first coupling agent, and a thermally conductive second inorganic filler joined to one end of a second coupling agent; the other end of the first coupling agent and the other end of the second coupling agent are respectively joined to a polymerizable compound, or joined to one another; and the thermal expansion-controlling members have thermal expansion coefficients that are respectively different.
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公开(公告)号：EP2385969A4
公开(公告)日：2017-11-08
申请号：EP09837248
申请日：2009-01-06
申请人： BLUE CUBE IP LLC
IPC分类号： C08L63/00 , C08J5/24 , C08K3/10 , C08K3/22 , C08K5/00 , C08K5/49 , C08L63/02 , C09D163/00 , C09J163/00
CPC分类号： C08K5/0091 , C08J5/24 , C08J2363/02 , C08K3/22 , C08K5/49 , C08K2003/2296 , C09D163/00 , C09J163/00 , C08L63/00
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8.发明公开POLY(PHENYLENE ETHER) /EPOXY HOMOGENEOUS SOLID AND POWDER COATING COMPOSITION INCORPORATING SAME 审中-公开均匀聚合物（苯乙烯）/环氧树脂FESTSTOFF UND PULVERBESCHICHTUNGSZUSAMMENSETZUNG DAMIT
公开(公告)号：EP3030615A4
公开(公告)日：2017-05-03
申请号：EP14835426
申请日：2014-08-06
IPC分类号： C08L63/02 , C08G59/02 , C08G65/38 , C08L71/12 , C09D163/02 , C09D171/12
CPC分类号： C09D163/00 , C08G65/38 , C08G65/40 , C08L63/00 , C08L63/04 , C08L71/00 , C08L71/12 , C09D163/04 , C09D171/00 , C09D171/12
摘要： A homogeneous solid composition includes an aromatic epoxy resin and a poly(phenylene ether) having a number average molecular weight of 600 to 2000 atomic mass units and an average of 1.5 to 3 hydroxyl groups per molecule. The molecular weight and hydroxyl functionality of the poly(phenylene ether) allow it to be dissolved in the epoxy resin at relatively low temperature, and remain dissolved as the solution is cooled and solidified. The homogeneous solid composition facilitates incorporation of the poly(phenylene ether) into powder coating compositions that exhibit reduced water absorption in the cured state.
摘要翻译： 均匀固体组合物包含芳族环氧树脂和数均分子量为600至2000原子质量单位且平均每分子具有1.5至3个羟基的聚（亚苯基醚）。 聚（亚苯基醚）的分子量和羟基官能度使其能够在相对较低的温度下溶解在环氧树脂中，并在溶液冷却和固化时保持溶解。 均匀固体组合物促进聚（亚苯基醚）结合到粉末涂料组合物中，所述粉末涂料组合物在固化状态下表现出吸水性降低。
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9.发明公开
公开(公告)号：EP3118236A1
公开(公告)日：2017-01-18
申请号：EP14885174.4
申请日：2014-11-06
申请人： Omron Corporation
发明人： NAKAJIMA, Seiji , TATSUNO, Yosuke , ITO, Mitsuo , HIRONO, Satoshi , MORISAKI, Yuzo , KAWAMOTO, Junji
CPC分类号： C08K3/36 , C08G59/188 , C08G59/245 , C08G59/5033 , C08G59/686 , C08J3/241 , C08J2363/02 , C08K3/013 , C08K3/04 , C08K3/22 , C08K3/40 , C08K5/3417 , C08K7/20 , C08K2003/2265 , C08L63/00 , C08L67/02
摘要： The present invention provides a resin composition which can be cured in a short time without a heat load on an adherend and with which a cured product having stable quality can be obtained. The resin composition in accordance with the present invention contains (i) a bisphenol A epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.
摘要翻译： 本发明提供一种树脂组合物，其能够在被粘物上在短时间内不发生热负荷而固化，能够得到质量稳定的固化物。 根据本发明的树脂组合物包含（i）双酚A环氧树脂，（ii）包含含有固化剂的芯和包覆芯的壳的包封固化剂，（iii）填料和（ iv）彩色材料。
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10.发明公开A COMPOSITION COMPRISING LIGNIN AND EPOXY COMPOUND FOR COATING AND METHOD FOR THE MANUFACTURING THEREOF AND USE THEREOF 审中-公开木质素的组合物和用于THEREOF AND USE THEREOF生产用于涂料和方法的环氧
公开(公告)号：EP3049489A1
公开(公告)日：2016-08-03
申请号：EP14849103.8
申请日：2014-09-25
申请人： Stora Enso Oyj
发明人： ZAFAR, Ashar , ARESKOGH, Dimitri
IPC分类号： C09D197/00 , C07G1/00 , C08G59/04 , C08G59/18 , C08G59/40 , C08H7/00 , C08L63/00 , C08L63/02 , C09J197/00
CPC分类号： C09D163/00 , C08G59/063 , C08G59/22 , C08H6/00 , C09D171/02 , C09D171/03 , C09J197/005 , C09D197/005 , C08L63/00 , C08L79/00
摘要： The present invention relates to a composition for coating, in particular a composition comprising lignin and one or more epoxy-group containing compounds, and methods for the manufacturing thereof and uses thereof. The present invention also relates to products obtainable by said methods and uses thereof.
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