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    DUAL ACTION STENCIL WIPER ASSEMBLY FOR STENCIL PRINTER
    19.
    发明公开
    DUAL ACTION STENCIL WIPER ASSEMBLY FOR STENCIL PRINTER 审中-公开
    用于标准打印机的双作用标准刮水器组件

    公开(公告)号：EP3307540A1

    公开(公告)日：2018-04-18

    申请号：EP16725655.1

    申请日：2016-05-04

    申请人： Illinois Tool Works Inc.

    发明人： LOSIEWICZ, William A.

    IPC分类号： B41F15/08 ,  B41F15/36 ,  B41F15/42 ,  H05K3/12 ,  B41F35/00 ,  B41F15/46

    CPC分类号： B41F15/0881 ,  B41F15/36 ,  B41F15/423 ,  B41F15/46 ,  B41F35/005 ,  B41P2215/50 ,  H05K3/1216 ,  H05K3/3484

    摘要： A stencil printer (10) includes a stencil shuttle assembly (18) coupled to a frame (12). The stencil shuttle assembly is configured to move the stencil (16) in an x-axis direction between a first position in which the stencil is positioned toward a front of the stencil printer and a second position in which the stencil is positioned toward a back of the stencil printer. The stencil shuttle assembly (18) further is configured to move the stencil (16) in a y-axis direction to align the stencil. The stencil printer further includes a wiper (164) to remove material from the stencil as the stencil is translated away from the substrate (24) by the stencil shuttle assembly. The stencil shuttle assembly, when the stencil is translated away from the substrate, is configured to move the stencil (16) in the y-axis direction in an oscillating manner. Methods of cleaning a stencil are further disclosed.

    METHOD AND APPARATUS FOR SELECTING A PASTE STENCIL FOR PASTE PRINTING AND FOR APPLYING PASTE ONTO A SUBSTRATE BY MEANS OF THE SELECTED PASTE STENCIL
    20.
    发明公开
    METHOD AND APPARATUS FOR SELECTING A PASTE STENCIL FOR PASTE PRINTING AND FOR APPLYING PASTE ONTO A SUBSTRATE BY MEANS OF THE SELECTED PASTE STENCIL 审中-公开
    用于通过选择的粘贴模板选择用于粘贴印刷和将糊剂施加到衬底上的粘贴标签的方法和设备

    公开(公告)号：EP3170664A3

    公开(公告)日：2017-09-13

    申请号：EP16002457.6

    申请日：2016-11-18

    申请人： ASM Assembly Systems GmbH & Co. KG

    发明人： LIEGEL, Werner

    IPC分类号： B41F15/08 ,  B41F15/36 ,  H05K3/34 ,  H05K13/04

    CPC分类号： B41F15/34 ,  B41F15/0881 ,  B41F15/36 ,  B41P2215/50 ,  H05K3/1225 ,  H05K3/1233 ,  H05K3/3431 ,  H05K3/3484 ,  H05K2203/0126

    摘要： The invention relates to a method and an apparatus for selecting a paste stencil (10) for paste printing onto a substrate (20), the paste stencil (10) being selected on the basis of a stencil thickness (h), in the case of which an area ratio of a small through opening (11 a, 11 b) of the substrate is greater than or equal to a setpoint area ratio. Furthermore, the present invention relates to a method and an apparatus for applying paste material (30) onto a substrate (20) for at least one small component (21 a, 21 b) and at least one large component (22) which is larger than the at least one small component (21 a, 21 b), paste material (30) being applied for the at least one small component (21 a, 21 b) and the at least one large component (22) by means of a paste stencil (10) which is selected according to the invention, and additional paste material (30) being applied onto the paste material (30) for the at least one large component (22), after paste material (30) has been applied by means of the selected paste stencil (10) for the at least one small component (21 a, 21 b) and the at least one large component (22).

    摘要翻译： 本发明涉及一种用于选择用于在基底（20）上进行糊剂印刷的糊剂模板（10）的方法和设备，糊剂模板（10）基于模板厚度（h）被选择， 其中衬底的小通孔（11a，11b）的面积比大于或等于设定面积比。 此外，本发明涉及一种用于将糊状材料（30）施加到用于至少一个小部件（21a，21b）和至少一个较大的较大部件（22）的基板（20）上的方法和设备 所述至少一个小部件（21a，21b）和所述至少一个大部件（22）借助于所述至少一个小部件（21a，21b）施加到所述至少一个小部件 （30）已被施加之后，将根据本发明选择的糊膏模板（10）以及另外的糊剂材料（30）施加到用于至少一个大部件（22）的糊剂材料（30） 用于所述至少一个小部件（21a，21b）和所述至少一个大部件（22）的所选糊膏模板（10）的装置。