摘要:
A method of providing such an intercoupling component (10) includes positioning terminals (34) within holes (64) of an insulative support member (62) and attaching a solder ball (42) to each of the terminals. Attaching the solder ball to the terminals is accomplished using a fixture having a number of recesses located in a pattern corresponding to a pattern of the holes in the insulative support member; filling each of the recesses with a solder ball; positioning the insulative support member over the fixture so that an end of each of the terminals contact a corresponding solder ball soldering the solder ball to the end of the terminal while maintaining the generally spherical of the solder ball.
摘要:
A socket terminal assembly includes a socket body having an end with an opening and an opposite end configured to contact the corresponding connection region of a printed circuit board, a contact spring, disposed at the opening of the socket body, to receive and apply a frictional force sufficient to retain the lower end of a pin within the opening of the socket body; and a resilient member, disposed within a lower end of the opening, to apply, to the pin and in response to a downward force applied to the pin, an upward force sufficient to overcome the fricitonal force of the contact spring. The pin has an end adapted to contact an electrical contacting area of an integrated circuit package and an opposite end configured to be inserted within the opening of the socket body. An intercoupling component includes a socket support member having holes, each hole receiving a corresponding socket terminal assembly.
摘要:
An intercoupling component (10) (e.g. socket or adapter) is provided for increasing the dissipation of heat generated within an integrated circuit (IC) array (12) positioned within the intercoupling component (10), while maintaining a relatively low profile. The intercoupling component (10) includes a heat sink (30) positioned within the package support member (16) and having an upper surface (45) in contact with a lower surface of the integrated circuit package (12). The package support member (16) includes contact terminals (18) disposed within associated openings (20) of the package for electrically connecting the contacting areas of the integrated circuit package (12) to the corresponding connection regions of the substrate (14). The openings (20) extend from an upper surface to an opposite lower surface of the support member (16) and are located in a pattern corresponding to a pattern of the connection contacts. The heat sink (30) may be configured to be removable and replaceable.
摘要:
A socket terminal assembly includes a socket body having an end with an opening and an opposite end configured to contact the corresponding connection region of a printed circuit board, a contact spring, disposed at the opening of the socket body, to receive and apply a frictional force sufficient to retain the lower end of a pin within the opening of the socket body; and a resilient member, disposed within a lower end of the opening, to apply, to the pin and in response to a downward force applied to the pin, an upward force sufficient to overcome the fricitonal force of the contact spring. The pin has an end adapted to contact an electrical contacting area of an integrated circuit package and an opposite end configured to be inserted within the opening of the socket body. An intercoupling component includes a socket support member having holes, each hole receiving a corresponding socket terminal assembly.
摘要:
An apparatus and method are disclosed for making connections between the pins of a multi-pin component and sockets or posts mounted on a circuit board. A plurality of converter elements are installed between the component pins and sockets or posts. Each converter element includes a receptor for mating with a pin of the multiple pin component. The receptor is sized to engage a pin having any diameter within a coarse range of diameters. In the circuit board socket arrangement, each converter element also includes a precision pin for mating with a socket on the circuit board. The diameter of the precision pin is held to a tolerance so that it is within a precision range of diameters. The variation in diameter within the precision range is less than the variation within the coarse range of diameters.