中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

172 records (took 0.016 seconds)

    RADIATOR STRUCTURE
    4.
    发明公开
    RADIATOR STRUCTURE 有权
    散热器结构

    公开(公告)号：EP2717663A1

    公开(公告)日：2014-04-09

    申请号：EP11866754.2

    申请日：2011-07-07

    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA

    Inventor： TAKAHASHI, Hisao ,  ANADA, Satoru ,  IWAZUMI, Toru

    IPC: H05K7/20 ,  H05K7/14

    CPC classification number: H05K7/20 ,  H01L23/3737 ,  H01L23/4006 ,  H01L23/42 ,  H01L2023/4062 ,  H01L2924/0002 ,  H05B3/22 ,  H05K7/20454 ,  H01L2924/00

    Abstract: A disclosed heat radiation arrangement includes a substrate that has a first surface on which a heating element is installed; a heat radiating member that abuts a surface of the heating element via a thermal conductive elastic member, the surface of the heating element being on an opposite side with respect to a side of the first surface; and a casing to which the substrate and the heat radiating member are attached, wherein the substrate is secured to the casing within a region between two extended sides and on opposite sides of the heating element when viewed in a direction perpendicular to the first surface, these two extended sides being defined by extending two opposite sides of the heating element, which form outer edges of the heating element, toward outer edges of the first surface.

    Abstract translation: 所公开的热辐射装置包括具有其上安装有加热元件的第一表面的基板; 散热构件，所述散热构件经由导热性弹性构件与所述发热体的表面抵接，所述发热体的表面相对于所述第一面的相反侧; 以及外壳，所述基板和所述散热构件被附接到所述外壳，其中，当在与所述第一表面垂直的方向上观察时，所述基板在所述加热元件的两个延伸侧之间的区域内和所述加热元件的相对侧上被固定到所述外壳，这些 两个延伸的侧边通过将形成加热元件的外边缘的加热元件的两个相对侧延伸到第一表面的外边缘而限定。

    Electronic device
    5.
    发明公开
    Electronic device 审中-公开
    电子设备

    公开(公告)号：EP2575168A1

    公开(公告)日：2013-04-03

    申请号：EP12181981.7

    申请日：2012-08-28

    Applicant: FUJITSU LIMITED

    Inventor： Fukuzono, Kenji ,  Nakamura, Naoaki

    IPC: H01L23/40

    CPC classification number: H01L23/4006 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2023/4075 ,  H01L2023/4081 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311

    Abstract: An electronic device includes: a first plate; a wiring board arranged on the first plate and configured to have a plurality of first terminals on a surface opposite to a surface facing the first plate; an electronic component arranged above the wiring board and configured to have a plurality of second terminals on a surface facing the wiring board; a connecting unit arranged between the wiring board and the electronic component and configured to electrically couple the first terminals and the second terminals; a second plate arranged on the electronic component; a fixing unit arranged in an area outside of an area where the electronic component is placed and configured to pressurize the first plate and the second plate; and a pressing unit arranged below the area where the electronic component is placed and configured to press the wiring board toward the electronic component.

    Abstract translation: 一种电子设备，包括：第一板; 布线板，布置在所述第一板上并被配置为在与面向所述第一板的表面相反的表面上具有多个第一端子; 电子部件，其配置在所述布线基板的上方，且在与所述布线基板相对的面上具有多个第二端子; 连接单元，所述连接单元布置在所述布线板和所述电子部件之间并且被配置为电耦接所述第一端子和所述第二端子; 布置在电子部件上的第二板; 固定单元，所述固定单元布置在所述电子部件被放置的区域的外侧的区域中，并且被构造为对所述第一板和所述第二板加压; 以及按压单元，其布置在放置电子元件的区域的下方并且被配置为朝向电子元件按压布线板。

    TRANSISTORKLEMMVORRICHTUNG
    7.
    发明公开
    TRANSISTORKLEMMVORRICHTUNG 审中-公开

    公开(公告)号：EP2122680A1

    公开(公告)日：2009-11-25

    申请号：EP07802153.2

    申请日：2007-09-05

    Applicant: Rohde & Schwarz GmbH & Co. KG

    Inventor： KAEHS, Bernhard ,  SEMERAD, Johann

    IPC: H01L23/40

    CPC classification number: H01L23/4006 ,  H01L2023/4031 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The invention relates to a transistor clamping apparatus for a transistor (4) having a holding block (2) and a spring (3). The holding block (2) spans the transistor (4), so that the spring (3) is pretensioned. The holding block (2) and the transistor (4) have a pressure plate (1) provided between them. The spring (3) fixes the pressure plate (1) on the transistor (4), so that a uniform pressure is exerted on the transistor (4) via the pressure plate (1) and the transistor therefore has good conduction of heat to a heat sink (18) on the side which is remote from the pressure plate (1).

    Semiconductor module and semiconductor module heat radiation plate
    10.
    发明公开
    Semiconductor module and semiconductor module heat radiation plate 有权
    Halbleitermodul undWärmeabstrahlende Plattefürdas Halbleitermodul

    公开(公告)号：EP1727198A2

    公开(公告)日：2006-11-29

    申请号：EP06010974.1

    申请日：2006-05-29

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Uehara, Sumio Shinko Electric Industries Co., Ltd. ,  Aoki, Syuzo Shinko Electric Industries Co., Ltd.

    IPC: H01L23/367 ,  H01L23/40 ,  H01L25/10

    CPC classification number: H01L23/4093 ,  G11C5/04 ,  G11C5/143 ,  H01L23/3672 ,  H01L2023/405 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2924/0002 ,  H05K1/181 ,  H01L2924/00

    Abstract: In a semiconductor module 10 in which a semiconductor device 17 is mounted on both surfaces of a circuit board 11 and heat radiation plates 12a, 12b are provided to both surfaces of the circuit board to cover the semiconductor device, a fitting hole via which the heat radiation plates 12a, 12b are fitted is formed in the circuit board 11, and a housing recess portion 18 in which the semiconductor devices 11 are housed is provided to both heat radiation plates 12a, 12b fitted to both surfaces of the circuit board 11 respectively and a fitting edge portion 25 is provided in a position of both heat radiation plates that overlaps with a position in which the fitting hole is formed, and also a fixing means 20 for fixing both heat radiation plates 12a, 12b to the circuit board 11 by caulking to align with the fitting hole is provided to fitting edge portions 25 integrally with the heat radiation plates 12a, 12b.

    Abstract translation: 在半导体模块（10）中，半导体器件（17）安装在电路板（11）的两个表面上，并且散热板（12a，12b）设置在电路板的两个表面以覆盖半导体器件 在电路板（11）上形成有安装有散热板（12a，12b）的嵌合孔，并且在两个热容器中设置容纳有半导体装置（17）的容纳凹部（18） 分别安装在电路板（11）的两个表面上的辐射板（12a，12b）和装配边缘部分（25）设置在与形成安装孔的位置重叠的两个散热板的位置， 并且还具有用于通过铆接将两个散热板（12a，12b）固定到配合孔上的固定装置（20），以与散热板（一体地） 12A，12B）。

Patent Agency Ranking