中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

81 records (took 0.019 seconds)

    Thermal conducting principle and device for prestressed clamping type multi-layered structure
    3.
    发明公开
    Thermal conducting principle and device for prestressed clamping type multi-layered structure 审中-公开
    Wärmeleitungsprinzip和Vorrichtungfürvorgespannte klemmartige Mehrschichtstruktur

    公开(公告)号：EP2385334A1

    公开(公告)日：2011-11-09

    申请号：EP10250884.3

    申请日：2010-05-06

    Applicant: Yang, Tai-Her

    Inventor： Yang, Tai-Her

    IPC: F28F13/00

    CPC classification number: H01L23/36 ,  F28F13/00 ,  F28F2013/005 ,  H01L23/367 ,  H01L23/3677 ,  H01L2023/4056 ,  H01L2023/4068 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The present invention discloses that the relay thermal conductor (102) being made of material having better thermal conductivity coefficient is heat transfer coupled with the heating or cooling first thermal body (101) at one end or face thereof, and is coupled with interface thermal conductor (103) having higher specific heat capacity at the other end or face thereof, wherein the interface thermal conductor (103) having higher specific heat capacity is the heat transfer carrier between relay thermal conductor (102) and second thermal body (104).

    Abstract translation: 本发明公开了由具有较好导热系数的材料制成的继电器导热体（102）与其一端或面上的加热或冷却第一热体（101）传热耦合，并与界面热导体 （103），其另一端或其表面具有较高的比热容，其中具有较高比热容的界面热导体（103）是中继热导体（102）和第二热体（104）之间的传热载体。

    INTEGRATED CIRCUIT INTERCOUPLING COMPONENT WITH HEAT SINK
    4.
    发明公开
    INTEGRATED CIRCUIT INTERCOUPLING COMPONENT WITH HEAT SINK 审中-公开
    IC-FASSUNG MITKÜHLKÖRPER

    公开(公告)号：EP1072180A4

    公开(公告)日：2002-05-02

    申请号：EP99919895

    申请日：1999-04-16

    Applicant: ADVANCED INTERCONNECTIONS

    Inventor： MURPHY JAMES V

    IPC: H05K7/20 ,  H01L23/32 ,  H01L23/40

    CPC classification number: H01L23/32 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/1433 ,  H01L2924/00

    Abstract: An intercoupling component (10) (e.g. socket or adapter) is provided for increasing the dissipation of heat generated within an integrated circuit (IC) array (12) positioned within the intercoupling component (10), while maintaining a relatively low profile. The intercoupling component (10) includes a heat sink (30) positioned within the package support member (16) and having an upper surface (45) in contact with a lower surface of the integrated circuit package (12). The package support member (16) includes contact terminals (18) disposed within associated openings (20) of the package for electrically connecting the contacting areas of the integrated circuit package (12) to the corresponding connection regions of the substrate (14). The openings (20) extend from an upper surface to an opposite lower surface of the support member (16) and are located in a pattern corresponding to a pattern of the connection contacts. The heat sink (30) may be configured to be removable and replaceable.

    Abstract translation: 提供互耦合部件（例如，插座或适配器），用于增加在位于相互耦合部件内的集成电路（IC）阵列内产生的热的耗散，同时保持相对低的轮廓。 相互联接部件包括位于封装支撑构件内的散热器，并且具有与设置在封装支撑构件内的集成电路封装的下表面接触的上表面。 封装支撑构件包括设置在封装的相关开口内的接触端子，用于将集成电路封装的接触区域电连接到衬底的相应连接区域。 开口从支撑构件的上表面延伸到相对的下表面，并且位于与连接触点的图案对应的图案中。 散热器可以被配置为可拆卸和可更换的。

    Semiconductor package
    5.
    发明公开
    Semiconductor package 失效
    半导体封装

    公开(公告)号：EP0853340A3

    公开(公告)日：1998-08-05

    申请号：EP98200584.5

    申请日：1994-12-29

    Applicant: NEC CORPORATION ,  JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED

    Inventor： Sano, Toshifumi ,  Yamada, Masahiro ,  Umezawa, Yoshiaki ,  Okada, Yoshikatsu ,  Natori, Akira, Japan Aviation Electr. Ind., Ltd.

    IPC: H01L23/367 ,  H01L23/552 ,  H01L23/40

    CPC classification number: H01L23/4006 ,  H01L23/552 ,  H01L25/0655 ,  H01L2023/4043 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/3025

    Abstract: In a semiconductor package comprising a heat spreader, a heat sink, a wiring board, and a connector, a heat spreader mounted on a remaining region of the upper surface of a substrate. The heat sink is thermally connected to a primary integrated circuit chip through the heat spreader and to a secondary integrated circuit chip. The heat sink has electrical conductivity. The heat sink comprises a base plate and at least one connecting member which perpendicularly extends from the base plate. A wiring board has a plurality of contact holes and a plurality of contact slits. A connector is mounted on the wiring board. The connector has a plurality of contacts. The contacts comprises a plurality of socket portions and a plurality of terminal portions. The contacts are connected to an input/output pins with the input/output pins inserted into the respective socket portions. The terminal portions are inserted into the respective contact holes. The connector has at least one ground contact. The ground contact comprises a ground socket portion and a ground terminal portion. The at least one ground contact is electrically connected to the at least one connecting member with the connecting member inserted into the ground socket portion. The ground terminal portions are inserted into the contact slits.

    Abstract translation: 在包括散热器，散热器，布线板和连接器的半导体封装中，散热器安装在基板的上表面的剩余区域上。 散热器通过散热器和次集成电路芯片热连接到主集成电路芯片。 散热片具有导电性。 散热器包括基板和至少一个从基板垂直延伸的连接构件。 布线板具有多个接触孔和多个接触狭缝。 连接器安装在接线板上。 该连接器具有多个触点。 触头包括多个插座部分和多个端子部分。 输入/输出引脚插入相应的插座部分，触点连接到输入/输出引脚。 端子部分被插入到相应的接触孔中。 该连接器至少有一个接地触点。 接地触头包括接地插座部分和接地端子部分。 所述至少一个接地触头在所述连接构件插入到所述接地插座部分中的情况下电连接到所述至少一个连接构件。 接地端子部分插入到接触狭缝中。

    Dissipateur thermique
    10.
    发明公开
    Dissipateur thermique 失效
    散热器

    公开(公告)号：EP0527359A3

    公开(公告)日：1993-03-03

    申请号：EP92112420.2

    申请日：1992-07-21

    Applicant: ALCATEL TELSPACE

    Inventor： Rio, Pascal ,  Magnenet, Patrick

    IPC: H01L23/40 ,  H05K7/20

    CPC classification number: H01L23/4006 ,  H01L2023/405 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2023/4081 ,  H01L2924/0002 ,  H05K7/20436 ,  H01L2924/00

    Abstract: Le domaine de l'invention est celui des dissipateurs thermiques destinés à évacuer l'énergie calorifique dissipée par des composants électroniques montés sur une carte. Selon l'invention, le dissipateur thermique est constitué d'une plaque (20) en matériau thermiquement conducteur disposée au-dessus des composants (11) de la carte et fixée à l'aide de moyens (24,25) de fixation à proximité de chacun des composants (11), cette plaque (20) comportant des déformations (21) en regard des composants (11), chaque déformation (21) étant de forme sphérique et en contact thermique avec la source calorifique d'un composant (11).

Patent Agency Ranking