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21.
公开(公告)号:EP4356585A1
公开(公告)日:2024-04-24
申请号:EP22825530.3
申请日:2022-05-26
Applicant: Applied Materials, Inc.
Inventor: SURI, Tameesh , SHEIKH, Bilal Shafi , SHAK, Myron , ZAMAN, Naveed
IPC: H04L45/00 , G06N20/00 , H04L49/109 , G06F13/40
CPC classification number: H04L47/122 , H04L45/74 , H04L47/30 , H04L45/20
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公开(公告)号:EP4352781A1
公开(公告)日:2024-04-17
申请号:EP22820736.1
申请日:2022-04-20
Applicant: Applied Materials, Inc.
Inventor: LAU, Shu-Kwan , CHOO, Enle , WANG, Danny Don , NELLIKKA, Shainish , NAKAGAWA, Toshiyuki , YE, Zhiyuan , DUBE, Abhishek
CPC classification number: H05B3/0047 , H01L21/67115 , H01L21/68742
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公开(公告)号:EP4352275A1
公开(公告)日:2024-04-17
申请号:EP22820968.0
申请日:2022-06-08
Applicant: Applied Materials, Inc.
Inventor: DEEPAK, Nitin , CHAKRABORTY, Tapash , GORADIA, Prerna Sonthalia , SIVARAMAKRISHNAN, Visweswaren , BAGUL, Nilesh Chimanrao , UPADHYE, Bahubali S.
CPC classification number: C23F1/12
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公开(公告)号:EP3452634B1
公开(公告)日:2023-09-06
申请号:EP16719871.2
申请日:2016-05-02
Inventor: PARK, Hyun Chan , GEBELE, Thomas , BHOOLOKAM, Ajay Sampath
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公开(公告)号:EP3207559B1
公开(公告)日:2023-07-12
申请号:EP15850855.6
申请日:2015-10-01
Inventor: PATIBANDLA, Nag B. , KRISHNAN, Kasiraman , REDFIELD, Daniel , BAJAJ, Rajeev , PERRY, Russell Edward , MENK, Gregory E. , REDEKER, Fred C. , ORILALL, Mahendra C. , FUNG, Jason G.
IPC: H01L21/304 , B24B37/24 , B29C64/112 , B24D11/00
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公开(公告)号:EP3555910B1
公开(公告)日:2023-06-14
申请号:EP17880590.9
申请日:2017-12-14
Inventor: SWAMINATHAN, Bharath , WANG, Wei
IPC: H01L21/683 , H01L21/687 , H01L21/67
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公开(公告)号:EP3862460B1
公开(公告)日:2023-02-15
申请号:EP21158423.0
申请日:2014-08-14
Inventor: West, Brian T. , Cox, Michael S. , Oh, Jeonghoon
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公开(公告)号:EP3749796B1
公开(公告)日:2022-06-08
申请号:EP18703315.4
申请日:2018-02-05
Inventor: DEPPISCH, Thomas , ARMSTRONG, Claire , SCHNAPPENBERGER, Frank
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公开(公告)号:EP3431194B1
公开(公告)日:2021-12-29
申请号:EP17192632.2
申请日:2017-09-22
Inventor: Stopper, Markus J. , Schlezinger, Asaf
IPC: B07C5/36
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公开(公告)号:EP3574125B1
公开(公告)日:2021-11-17
申请号:EP18744306.4
申请日:2018-01-18
Inventor: WU, Zhiyuan , BEKIARIS, Nikolaos , NAIK, Mehul B. , PARK, Jin Hee , LEE, Mark Hyun
IPC: H01L21/768 , H01L23/532 , H01L21/67 , H01L21/285
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