SYSTEMS AND METHODS FOR CONTROLLING RELEASE OF TRANSFERABLE SEMICONDUCTOR STRUCTURES
    21.
    发明公开
    SYSTEMS AND METHODS FOR CONTROLLING RELEASE OF TRANSFERABLE SEMICONDUCTOR STRUCTURES 审中-公开
    控制可转移半导体结构释放的系统和方法

    公开(公告)号:EP3157858A1

    公开(公告)日:2017-04-26

    申请号:EP15736210.4

    申请日:2015-06-18

    IPC分类号: B81C99/00

    摘要: The disclosed technology relates generally to methods and systems for controlling the release of micro devices. Prior to transferring micro devices to a destination substrate, a native substrate is formed with micro devices thereon. The micro devices can be distributed over the native substrate and spatially separated from each other by an anchor structure. The anchors are physically connected/secured to the native substrate. Tethers physically secure each micro device to one or more anchors, thereby suspending the micro device above the native substrate. In certain embodiments, single tether designs are used to control the relaxation of built-in stress in releasable structures on a substrate, such as Si (1 1 1). Single tether designs offer, among other things, the added benefit of easier break upon retrieval from native substrate in micro assembly processes. In certain embodiments, narrow tether designs are used to avoid pinning of the undercut etch front.

    摘要翻译: 所公开的技术总体上涉及用于控制微型器件的释放的方法和系统。 在将微型器件转移到目标衬底之前,在其上形成具有微型器件的本地衬底。 微器件可以分布在自然衬底上并且通过锚结构彼此在空间上分离。 锚固物物理连接/固定在天然基底上。 系绳物理地将每个微型装置固定到一个或多个锚定件,从而将微型装置悬挂在自然基板上方。 在某些实施方案中,使用单系链设计来控制衬底上可释放结构(例如Si(111))中内建应力的松弛。 除了别的以外,单系绳设计提供了在微组装过程中从原始基板取回时更容易断裂的附加益处。 在某些实施例中,使用窄绳索设计来避免底切蚀刻前端的钉扎。