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公开(公告)号：EP3216057A1
公开(公告)日：2017-09-13
申请号：EP15790538.1
申请日：2015-11-03
CPC分类号： G01R33/07 , G01R33/0052 , G01R33/077 , H01L24/24 , H01L24/82 , H01L24/94 , H01L43/04 , H01L2224/24146 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73227 , H01L2224/73265 , H01L2224/73267 , H01L2224/83005 , H01L2224/92137 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00 , H01L2224/82 , H01L2224/83
摘要： A semiconductor chip for measuring a magnetic field. The semiconductor chip comprises a magnetic sensing element, and an electronic circuit. The magnetic sensing element is mounted on the electronic circuit. The magnetic sensing element is electrically connected with the electronic circuit. The electronic circuit is produced in a first technology and/or first material and the magnetic sensing element is produced in a second technology and/or second material different from the first technology/material.
摘要翻译： 一种用于测量磁场的半导体芯片100，半导体芯片包括磁敏元件110和电子电路120，其中：磁敏元件110安装在电子电路120上; 磁感应元件110与电子电路120电性连接， 电子电路120以第一技术和/或第一材料制造，并且磁性感测元件110以不同于第一技术/材料的第二技术和/或第二材料制造。 还公开了制造上述半导体芯片100的方法，该方法包括：在第一晶片上制造包括电子电路120的至少一个目标器件; 在第二晶片上制造包括磁敏元件110的至少一个源器件，其中第二材料在室温下具有比第一材料更高的载流子迁移率; 将所述至少一个目标设备传送到所述至少一个源设备，包括以下步骤：用粘合剂覆盖所述目标设备的有地区域; 使用传送元件从第二晶片提升源装置; 将源设备放置在着陆区域上; 将传送元件从源设备上抬起; 并且将源设备电连接到目标设备。
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公开(公告)号：EP3158583A2
公开(公告)日：2017-04-26
申请号：EP15736209.6
申请日：2015-06-18
申请人： X-Celeprint Limited
发明人： BOWER, Christopher , MEITL, Matthew , GOMEZ, David , BONAFEDE, Salvatore , KNEEBURG, David , FECIORU, Alin , PREVATTE, Carl
IPC分类号： H01L25/075 , H01L33/00
CPC分类号： H01L33/385 , F21K9/50 , F21V9/08 , F21Y2101/025 , F21Y2105/003 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , G02B26/04 , G02F1/167 , G09G3/22 , G09G3/32 , G09G2300/0452 , G09G2300/0842 , G09G2310/0264 , H01L23/4821 , H01L23/5381 , H01L25/0753 , H01L25/167 , H01L27/156 , H01L33/20 , H01L33/36 , H01L33/38 , H01L33/405 , H01L33/48 , H01L33/50 , H01L33/502 , H01L33/508 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/18 , H01L2224/73267 , H01L2224/92244 , H05B33/089 , H05K1/0306 , H05K1/09 , H05K1/181 , H05K1/182 , H05K5/0017 , H05K2201/0329 , H05K2201/10106 , H05K2201/10128 , H05K2201/10166
摘要： The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.
摘要翻译： 所公开的技术提供了使用太小的微型LED阵列（例如，宽度或直径为10μm至50μm的微型LED）的微组装微型LED显示器和照明元件，所述微型LED众多或脆弱以通过 常规手段。 所公开的技术提供了使用微转移印刷技术组装的微型LED显示器和照明元件。 微型LED可以在自然基板上制备并印刷到显示基板（例如，塑料，金属，玻璃或其他材料）上，从而避免了在显示基板上制造微型LED。 在某些实施例中，显示器基板是透明的和/或柔性的。
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3.发明公开
公开(公告)号：EP4143895A2
公开(公告)日：2023-03-08
申请号：EP21727085.9
申请日：2021-04-29
申请人： X-Celeprint Limited
发明人： COK, Ronald S. , ROTZOLL, Robert R.
IPC分类号： H01L41/113 , H02N2/18
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公开(公告)号：EP3433852A1
公开(公告)日：2019-01-30
申请号：EP17717329.1
申请日：2017-03-21
申请人： X-Celeprint Limited
发明人： MEITL, Matthew , COK, Ronald S.
IPC分类号： G09G3/3216 , G09G3/3233 , H01L27/02
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6.发明公开
公开(公告)号：EP3365271A1
公开(公告)日：2018-08-29
申请号：EP16795238.1
申请日：2016-10-21
申请人： X-Celeprint Limited
发明人： BOWER, Christopher , MEITL, Matthew
IPC分类号： B81C99/00
CPC分类号： B81C99/008 , B81C2201/0194 , B81C2203/054
摘要： The disclosed technology relates generally to methods and systems for controlling the release of micro devices. Prior to transferring micro devices to a destination substrate, a native substrate is formed with micro devices thereon. The micro devices can be distributed over the native substrate and spatially separated from each other by an anchor structure. The anchors are physically connected/secured to the native substrate. Tethers physically secure each micro device to one or more anchors, thereby suspending the micro device above the native substrate. In certain embodiments, single tether designs are used to control the relaxation of built-in stress in releasable structures on a substrate, such as Si (1 0 0). Single tether designs offer, among other things, the added benefit of easier break upon retrieval from native substrate in micro assembly processes. In certain embodiments, narrow tether designs are used to avoid pinning of the undercut etch front.
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7.发明公开
公开(公告)号：EP4158681A1
公开(公告)日：2023-04-05
申请号：EP21730101.9
申请日：2021-05-12
申请人： X-Celeprint Limited
IPC分类号： H01L21/60 , H01L21/98 , H01L23/485 , H01L21/673 , H01L23/544 , H01L23/31
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公开(公告)号：EP4022674A2
公开(公告)日：2022-07-06
申请号：EP20764325.5
申请日：2020-08-24
IPC分类号： H01L23/48 , H01L21/60 , H01L23/498 , H01L23/538 , H01L21/683 , H01L25/16 , H01L25/065 , H01L23/13 , G02B6/10 , G02B6/42
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公开(公告)号：EP3423285A1
公开(公告)日：2019-01-09
申请号：EP17712035.9
申请日：2017-02-27
申请人： X-Celeprint Limited
IPC分类号： B42D25/305 , G07D11/00 , B42D25/30 , B42D25/29 , B42D25/485
摘要： A hybrid currency banknote includes a banknote having visible markings. One or more light-controlling elements and a controller are embedded in or on the banknote. The controller is electrically connected to the one or more light-controlling elements to control the one or more light-controlling elements. A power input connection is electrically connected to the controller, or one or more light-controlling elements, or both. A power source can be connected to the power input connection, for example a piezoelectric or photovoltaic power source. In response to applied power, the controller causes the one or more light-controlling elements to emit light. A value can be stored in a memory in the controller and displayed by the light-controlling elements. The value can be assigned or varied by a hybrid currency teller machine.
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