公开(公告)号：EP2427522A1

公开(公告)日：2012-03-14

申请号：EP10713989.1

申请日：2010-04-19

Applicant: BASF SE

Inventor： RAMAN, Vijay Immanuel ,  GUBAYDULLIN, Ilshat ,  LI, Yuzhuo ,  BRANDS, Mario ,  LAN, Yongqing

IPC: C09G1/02 ,  C09K3/14 ,  H01L21/321

CPC classification number: C09G1/02 ,  C09K3/1463 ,  H01L21/3212

Abstract: An aqueous CMP agent, comprising (A) solid polymer particles interacting and forming strong complexes with the metal of the surfaces to be polished; (B) a dissolved organic non-polymeric compound interacting and forming strong, water-soluble complexes with the metal and causing an increase of the material removal rate MRR and the static etch rate SER with increasing concentration of the compound (B); and (C) a dissolved organic non-polymeric compound interacting and forming slightly soluble or insoluble complexes with the metal, which complexes are capable of being adsorbed by the metal surfaces, and causing a lower increase of the MRR than the compound (B) and a lower increase of the SER than the compound (B) or no increase of the SER with increasing concentration of the compound (C); a CMP process comprising selecting the components (A) to (C) and the use of the CMP agent and process for polishing wafers with ICs.