摘要:
A pattern forming method comprising: coating a resist composition on a substrate; adjusting a rotational speed of the substrate within a range of 500 to 1,500 rpm so that a film thickness of the resist composition coated is adjusted; and subjecting the resist composition to drying, exposure and development, wherein the resist composition includes: (A) a compound capable of generating an acid upon irradiation with one of actinic rays and radiation; (B) a resin of which dissolution rate in an alkali developer increases under the action of an acid; (C) a mixed solvent; and (D) a surfactant, and the mixed solvent (C) includes at least one member selected from a group A of solvents and at least one member selected from a group B of solvents, or includes at least one member selected from the group A of solvents and at least one member selected from a group C of solvents: Group A: propylene glycol monoalkyl ether carboxylates, Group B: propylene glycol monoalkyl ethers, alkyl lactates, acetic acid esters, one of chain and cyclic ketones, and alkoxyalkyl propionates, and Group C: γ-butyrolactone, ethylene carbonate and propylene carbonate.
摘要:
The present invention relates to a chemical amplification resist composition comprising: (A) a resin increasing the solubility in an alkali developer by the action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation; (C) a compound having a pKa value of 4-15 selected from formulae (FAD-II) and (FAD-III):
wherein R a105 each individually is F or perfluoroalkyl; n is 1 or 2, and (n+m) = 6; R a106 each individually is F or perfluoroalkyl; and A a102 is a bond or a divalent organic group; and
(D) a solvent. Also, the invention relates to a pattern-forming method comprising; forming a resist film with the above composition and exposing and developing the resist film
摘要:
A pattern forming method comprising: coating a resist composition on a substrate; adjusting a rotational speed of the substrate within a range of 500 to 1,500 rpm so that a film thickness of the resist composition coated is adjusted; and subjecting the resist composition to drying, exposure and development, wherein the resist composition includes: (A) a compound capable of generating an acid upon irradiation with one of actinic rays and radiation; (B) a resin of which dissolution rate in an alkali developer increases under the action of an acid; (C) a mixed solvent; and (D) a surfactant, and the mixed solvent (C) includes at least one member selected from a group A of solvents and at least one member selected from a group B of solvents, or includes at least one member selected from the group A of solvents and at least one member selected from a group C of solvents: Group A: propylene glycol monoalkyl ether carboxylates, Group B: propylene glycol monoalkyl ethers, alkyl lactates, acetic acid esters, one of chain and cyclic ketones, and alkoxyalkyl propionates, and Group C: γ-butyrolactone, ethylene carbonate and propylene carbonate.