公开(公告)号：EP2329693A1

公开(公告)日：2011-06-08

申请号：EP09791586.2

申请日：2009-08-17

Applicant: Shocking Technologies Inc

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert

IPC: H05K1/02

CPC classification number: H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/4688 ,  H05K2201/0738 ,  H05K2201/09318 ,  Y10T428/24802 ,  Y10T428/31504

Abstract: A core layer structure is provided for substrate and packed devices. The core layer structure includes a first layer, a second layer combined with the first layer. A layer of voltage switchable dielectric (VSD) material provided in between the first layer and second layer.