公开(公告)号：EP3106740A1

公开(公告)日：2016-12-21

申请号：EP15182629.4

申请日：2015-08-27

Applicant: Xiamen Lee Brothers Co., Ltd.

Inventor： Wu, Feng ,  Chen, Yunwei ,  Wu, Minghao ,  Li, Fuwen

IPC: F21K9/232 ,  F21K9/238 ,  F21K9/235 ,  H05B35/00 ,  F21Y107/00

CPC classification number: F21V29/70 ,  F21K9/1355 ,  F21K9/232 ,  F21K9/235 ,  F21K9/238 ,  F21V3/02 ,  F21V3/0615 ,  F21V17/101 ,  F21V19/006 ,  F21V23/003 ,  F21V23/06 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2107/00 ,  F21Y2115/10 ,  H05B35/00

Abstract: An LED filament lamp comprises a bulb shell and an LED filament component located inside the bulb shell. The LED filament lamp further comprises a driving board, a lamp holder bulb shell and an inside liner. The inside liner is a bulb shell structure made of insulating material and installed inside the lamp holder bulb shell. At least a part of the driving board is located inside the inside liner to make the driving board and the lamp holder bulb shell separate from each other. The LED filament component is electrically connected to the driving board and the lamp holder bulb shell is electrically connected to the driving board. The LED filament lamp has characteristic of simple structure.

Abstract translation: LED灯丝灯包括灯泡壳和位于灯泡壳内部的LED灯丝部件。 LED灯丝灯还包括驱动板，灯座灯泡壳和内衬。 内衬是由绝缘材料制成的灯泡壳结构，安装在灯座灯泡壳内。 驱动板的至少一部分位于内衬里的内部，以使驱动板和灯座灯泡壳彼此分开。 LED灯丝部件电连接到驱动板，并且灯座灯泡壳电连接到驱动板。 LED灯丝灯具有结构简单的特点。

公开(公告)号：EP3102011A1

公开(公告)日：2016-12-07

申请号：EP15740090.4

申请日：2015-01-27

Applicant: Shanghai Sansi Electronics Engineering Co., Ltd. ,  Shanghai Sansi Science and Technology Development ,  Jiashan Sansi Photoelectric Technology Co. Ltd

Inventor： CHEN, Bishou ,  XU, Li ,  WANG, Peng ,  HE, Xiaoliang ,  LI, Sheng ,  LIU, Haibo

IPC: H05K3/10 ,  F21S2/00 ,  F21V3/02 ,  F21V29/00 ,  F21Y101/00

CPC classification number: F21K9/232 ,  B05D3/0254 ,  F21K9/20 ,  F21K9/235 ,  F21K9/237 ,  F21K9/238 ,  F21V3/02 ,  F21V3/061 ,  F21V3/10 ,  F21V17/101 ,  F21V19/006 ,  F21V23/00 ,  F21V23/005 ,  F21V29/506 ,  F21V29/74 ,  F21V29/83 ,  F21Y2113/00 ,  F21Y2115/10 ,  H05K1/0284 ,  H05K1/097 ,  H05K3/0014 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0999 ,  H05K2201/10106

Abstract: An LED light device and a circuit preparation method thereof are provided. The LED light device includes a base (2-1), an LED light unit, and a lamp shade (2-3). The LED light-emitting unit and the lamp shade (2-3) are arranged on the base (2-1). The lamp shade (2-3) covers the LED light-emitting unit inside. An inner surface of the lamp shade (2-3) includes a light distribution surface (2-31) and a thermally-conductive surface (2-32), so that the entire device can dissipate heat all around, thereby greatly improving the heat dissipation performance of the device. The circuit preparation method includes following steps of: providing a base which is a physical entity having a three-dimensional structure on the surface thereof; coating a circuit layer on the base surface through a programmable coating equipment, manual coating or the combined mode, wherein the circuit layer is a liquid or powder coating containing metal materials, and the thickness of the circuit layer is 20 µm or more; baking the base coated with the circuit layer at the high temperature of 100-1,000°C until the circuit layer is dried; and obtaining a base having a three-dimensional circuit after cooling. By adopting the method, a three-dimensional circuit can be manufactured directly on the surface of the base without a circuit board, to achieve electrical connection.

公开(公告)号：EP3101337A1

公开(公告)日：2016-12-07

申请号：EP14880324.0

申请日：2014-04-23

Applicant: Shanghai Sansi Electronic Engineering Co., Ltd ,  Shanghai Sansi Science and Technology Development Co., Ltd ,  Jiashan Sansi Photoelectric Technology Co., Ltd

Inventor： CHEN, Bishou ,  XU, Li ,  WANG, Peng ,  LI, Sheng

IPC: F21V29/00 ,  F21V3/02 ,  F21V23/00

CPC classification number: F21V29/74 ,  F21K9/232 ,  F21K9/235 ,  F21K9/238 ,  F21V3/02 ,  F21V3/06 ,  F21V19/003 ,  F21V29/506 ,  F21V29/83 ,  F21Y2115/10 ,  H05K1/00

Abstract: An LED lighting device includes a base (1), an LED light-emitting unit (2) and a lamp shade (3), wherein the LED light-emitting unit (2) and the lamp shade (3) are arranged on the base (1); the lamp shade (3) is a solid component made of a thermally-conductive material; the lamp shade (3) covers the LED light-emitting unit (2); and the inner surface of the lamp shade (3) has a light distribution surface (31) and a thermally-conductive surface (32). The LED lighting device employs a solid material having better thermal conductivity as the lamp shade (3), therefore, heat generated by the LED light-emitting unit not only can be dissipated via the base (1), but also can be transferred outwards via the lamp shade (3), thus allowing the entire device to dissipate heat in all directions, improving the heat dissipation performance of the device, and prolonging the service life of the device; due to the improvement of the heat dissipation performance, the lighting device of higher power can be manufactured without increasing the size of the device, and the lighting brightness of the device is improved, while the use range and flexibility of the LED lighting device are improved in life and industrial use.

Abstract translation: 一种LED照明装置，包括底座（1），LED发光单元（2）和灯罩（3），LED发光单元（2）和灯罩（3）设置在底座 （1）; 灯罩（3）是由导热材料制成的固体部件; 灯罩（3）覆盖LED发光单元（2）; 并且灯罩（3）的内表面具有配光表面（31）和导热表面（32）。 该LED照明装置采用导热性较好的固体材料作为灯罩（3），因此LED发光单元产生的热量不仅可以通过底座（1）散发，还可以通过底座 灯罩（3），使整个装置散热全方位，提高了装置的散热性能，延长了装置的使用寿命; 由于散热性能的提高，可以在不增加装置尺寸的情况下制造更高功率的照明装置，并且提高装置的照明亮度，同时提高LED照明装置的使用范围和灵活性 在生活和工业中使用。

公开(公告)号：EP3099974A1

公开(公告)日：2016-12-07

申请号：EP15701207.1

申请日：2015-01-26

Applicant: Philips Lighting Holding B.V.

Inventor： KRIJN, Marcellinus Petrus Carolus Michael ,  DE ZWART, Siebe Tjerk ,  DEKKER, Tim ,  VAN NEER, Alexander Jacobus Mariette ,  VAN GHELUWE, Jochen Renaat ,  GOMMANS, Hendrikus Hubertus Petrus

IPC: F21V29/00 ,  F21K99/00 ,  F21V3/00

CPC classification number: F21K9/235 ,  F21K9/232 ,  F21K9/238 ,  F21V3/061 ,  F21V19/005 ,  F21V23/005 ,  F21V29/506 ,  F21V29/83 ,  F21Y2107/30 ,  F21Y2115/10

Abstract: An LED light bulb has a light emitting bulb part 22 which comprises a central core 24 running from the top towards the bottom and which provides an open passageway at least at the top. The LEDs are mounted in thermal contact around the central core 24. This design provides an air flow to promote cooling of the LEDs. This in turn enables a reduced size and cost of the heat sink, or avoids the need for a heat sink altogether.

Abstract translation: LED灯泡具有发光灯泡部分22，其包括从顶部向底部延伸的中心核心24，并且至少在顶部提供开放通​​道。 LED围绕中心芯24以热接触的方式安装。该设计提供空气流以促进LED的冷却。 这反过来又能够减少散热器的尺寸和成本，或者完全避免了散热器的需要。

公开(公告)号：EP3099971A1

公开(公告)日：2016-12-07

申请号：EP15700687.5

申请日：2015-01-19

Applicant: Philips Lighting Holding B.V.

Inventor： DEKKER, Tim ,  SHI, Haoyang ,  EGGINK, Hendrik, Jan ,  GU, Wei ,  JIANG, Qingqing

IPC: F21K99/00 ,  F21V29/00 ,  F21V29/60 ,  F21V29/78 ,  F21V29/83 ,  F21Y111/00

CPC classification number: F21K9/237 ,  F21K9/232 ,  F21K9/235 ,  F21K9/238 ,  F21K9/90 ,  F21V3/02 ,  F21V23/005 ,  F21V29/004 ,  F21V29/60 ,  F21V29/78 ,  F21V29/83 ,  F21Y2107/40 ,  F21Y2115/10

Abstract: An LED light bulb has LEDs (32) mounted on a tubular carrier (22) with open ends. The tube (22) functions as a chimney to promote cooling by creating convection currents through the chimney. The cooling can be entirely passive or it may be active by incorporating a fan (50).

Abstract translation: LED灯泡具有安装在具有开口端的管状载体（22）上的LED（32）。 管（22）用作烟囱，以通过通过烟囱产生对流来促进冷却。 冷却可以是完全无源的，或者通过结合风扇（50）可能是有效的。

公开(公告)号：EP3097347A1

公开(公告)日：2016-11-30

申请号：EP15701155.2

申请日：2015-01-20

Applicant: Philips Lighting Holding B.V.

Inventor： DEN BOER, Reinier Imre Anton

IPC: F21K99/00 ,  F21V3/04 ,  F21V15/01 ,  F21V17/10 ,  F21V9/16 ,  F21V23/00 ,  F21Y103/00 ,  F21Y105/00

CPC classification number: F21K9/237 ,  F21K9/23 ,  F21K9/232 ,  F21K9/235 ,  F21K9/238 ,  F21K9/90 ,  F21V3/062 ,  F21V3/0625 ,  F21V9/30 ,  F21V15/01 ,  F21V15/013 ,  F21V17/007 ,  F21V17/107 ,  F21V19/006 ,  F21V23/006 ,  F21V23/009 ,  F21V23/02 ,  F21V29/507 ,  F21V29/70 ,  F21Y2103/33 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: A method for manufacturing a lighting device (100), the method comprising the steps of providing (S1) a sheet of optically transmissive plastic material, forming (S2) a lighting device housing from the sheet of optically transmissive plastic material, such that the lighting device housing comprises a first portion (212) connected to a second portion (214) by a flexible connecting portion (202), folding (S3) the first (212) or second portion (214) about the flexible connecting portion (202) to enclose a light source (210) and driver electronics (206) within an enclosed region of the lighting device housing, and securing (S4) the first portion (212) to the second portion (214) such that the lighting device housing maintains the folded position.

Abstract translation: 一种制造照明装置（100）的方法，所述方法包括以下步骤：提供（S1）一张透光塑料材料片，从所述光学透射塑料材料片形成（S2）照明装置外壳，使得所述照明 装置壳体包括通过柔性连接部分（202）连接到第二部分（214）的第一部分（212），围绕柔性连接部分（202）将第一部分（212）或第二部分（214）折叠（S3） 将光源（210）和驱动器电子器件（206）包围在照明装置外壳的封闭区域内，并将第一部分（212）固定（S4）到第二部分（214），使得照明装置外壳保持折叠 位置。

公开(公告)号：EP2789893B1

公开(公告)日：2016-05-18

申请号：EP14162130.0

申请日：2014-03-27

Applicant: LG Innotek Co., Ltd.

Inventor： Joo, Keun Tak ,  Lim, Dong Nyung ,  Lee, Sang Hoon

IPC: F21K99/00 ,  F21V15/01 ,  F21V23/00

CPC classification number: F21V23/023 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V3/00 ,  F21V3/04 ,  F21V23/006 ,  F21V23/007 ,  F21V29/506 ,  F21V29/507 ,  F21V29/70 ,  F21V29/713 ,  F21V29/773 ,  F21V29/86 ,  F21V29/87 ,  F21Y2115/10

Abstract: A lighting device may be provided that includes: a heat sink (300) having an optical transmittance; a light source module (200) including a substrate (210) disposed on the heat sink and a light emitting device (230) disposed on the substrate (210); and a cover (100) which is disposed on the light source module (200) and outwardly emits a part of light from the light source module. The cover (100) has an inner surface which reflects a part of light from the light emitting device. The heat sink (300) receives the light from the inner surface of the cover and outwardly emits a part of the received light.

公开(公告)号：EP3001854A1

公开(公告)日：2016-04-06

申请号：EP14723453.8

申请日：2014-05-13

Applicant: Seidel GmbH & Co. KG

Inventor： RITZENHOFF, Andreas ,  ENGEL, Lutz ,  RACHE, Jörg ,  ARNOLD, Oliver

IPC: F21K99/00 ,  F21V19/00 ,  F21V3/00 ,  F21V23/00 ,  F21Y101/00

CPC classification number: F21V29/89 ,  F21K9/232 ,  F21K9/238 ,  F21K9/60 ,  F21K9/90 ,  F21V3/062 ,  F21V7/0016 ,  F21V15/01 ,  F21V17/005 ,  F21V17/164 ,  F21V19/005 ,  F21V19/0055 ,  F21V23/006 ,  F21V29/70 ,  F21V29/713 ,  F21Y2107/00 ,  F21Y2115/10

Abstract: The invention relates to a lighting device comprising at least one semiconductor lighting means (30) and a housing (10) in which the at least one semiconductor lighting means (30) is accommodated. A metallic base body (20), which supports the semiconductor lighting means (30), is arranged in the housing (30). Said lighting device is characterised in that the semiconductor lighting means (30) is fixed to the metallic base body (20) by means of a metallic rivet (223). The invention further relates to a method for mounting semiconductor lighting means (30) on a metallic base body (20) of a lighting device.

Abstract translation: 照明装置包括至少一个半导体发光体和塑料壳体，其中容纳至少一个半导体光源。 照明装置在壳体内部具有固定半导体发光体的金属基体。 金属基体具有与壳体至少部分地在内部接触的表面。

公开(公告)号：EP2800926A4

公开(公告)日：2015-12-23

申请号：EP13733848

申请日：2013-01-03

Applicant: THERMAL SOLUTION RESOURCES LLC

Inventor： SAGAL E MIKHAIL ,  ARNOLD GARY R

IPC: F21S2/00

CPC classification number: H05B37/0272 ,  F21K9/1355 ,  F21K9/23 ,  F21K9/238 ,  F21V23/006 ,  F21V23/0435 ,  F21V23/0471 ,  F21V25/00 ,  F21V29/77 ,  F21V29/773 ,  F21V29/85 ,  F21V29/86 ,  F21V29/87 ,  F21Y2101/00 ,  F21Y2103/33 ,  F21Y2115/10 ,  H05B33/0803 ,  H05B33/0854 ,  H05B37/0218 ,  H05B37/0227

公开(公告)号：EP2955740A1

公开(公告)日：2015-12-16

申请号：EP15170075.4

申请日：2015-06-01

Applicant: vosla GmbH

Inventor： Peter, Alexander ,  Winkler, Markus ,  Sachs, Peter ,  Böttcher, Matthias

IPC: H01J5/52 ,  H01J5/58 ,  H01K1/44 ,  H01K1/46 ,  H01K1/62 ,  H01J61/56 ,  F21V23/00 ,  F21K99/00

CPC classification number: H01K1/46 ,  F21K9/232 ,  F21K9/238 ,  F21K9/90 ,  F21V3/00 ,  F21V23/006 ,  F21Y2107/00 ,  F21Y2115/10 ,  H01J5/52 ,  H01J5/58 ,  H01J61/56 ,  H01K1/44 ,  H01K1/62

Abstract: Lampe (1) mit einem Lampenkolben (2), der eine rohrförmigen Vertiefung (6) aufweist, mit einem Sockel (4), mit einem Adapter (3), der so angeordnet und ausgebildet ist, um den Lampenkolben mit dem Sockel zu verbinden, wobei der Adapter einen ersten Aufnahmeabschnitt (13) aufweist, welcher in der rohrförmigen Vertiefung aufgenommen und in dieser befestigt ist.

Abstract translation: 电灯（1）和具有灯泡（2）的管状凹部（6），其包括基底（4），与适配器（3），其被安排和配置为将灯泡连接至灯座， 这是在管状凹陷部分接收并固定在其中，具有第一接收部（13）的适配器。