公开(公告)号：EP3244155B1

公开(公告)日：2018-12-12

申请号：EP17156704.3

申请日：2017-02-17

Applicant: Christie Digital Systems USA, Inc.

Inventor： ADEMA, Daniel Robert ,  HILL, Graham

IPC: F28D11/02 ,  F28F5/00 ,  F28F13/18 ,  H01S3/00 ,  F28F13/12 ,  F21V9/30 ,  F21V29/502 ,  F28D15/02

CPC classification number: F21V29/502 ,  F21V9/30 ,  F21V29/56 ,  F21V29/713 ,  F21V29/74 ,  F28D11/02 ,  F28D15/0208 ,  F28D2015/0291 ,  F28D2021/0029 ,  F28F5/00 ,  F28F13/125 ,  F28F13/18 ,  F28F2245/06 ,  G03B21/16 ,  G03B21/204

Abstract: According to the present specification there is provided a rotatable heat sink device which comprises a heat sink configured to enclose a cooling fluid, and the heat sink is rotatable about a rotational axis. The heat sink, in turn, comprises a first portion configured to receive thermal energy from a source external to the heat sink, and a second portion configured to dissipate at least a portion of the thermal energy to surroundings external to the device. The device further comprises an optical wavelength conversion material disposed on an outside surface of the first portion of the heat sink, and an agitator disposed inside the heat sink. The agitator is rotationally independent of the heat sink and is configured to promote circulation of the cooling fluid between the first portion and the second portion.

公开(公告)号：EP2241803B1

公开(公告)日：2018-11-07

申请号：EP10171923.5

申请日：2002-05-24

Applicant: GE Lighting Solutions, LLC

Inventor： Bohler, Christopher, L. ,  Pollard, Anthony D. ,  Burkholder, Greg, E. ,  Petroski, James, T. ,  Sommers, Mathew, L ,  Karlicek, Robert, F., Jr. ,  Weaver, Stanton, E., Jr. ,  Becker, Charles, A.

IPC: F21K9/23 ,  F21K9/27 ,  F21V29/77 ,  H01L25/075 ,  H01L33/64

CPC classification number: F21V29/74 ,  F21K9/233 ,  F21V7/0083 ,  F21V7/041 ,  F21V7/06 ,  F21V19/0005 ,  F21V29/004 ,  F21V29/767 ,  F21V29/773 ,  F21V29/81 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/642 ,  H01L2224/48091 ,  Y10S362/80 ,  H01L2924/00014

Abstract: A light module includes light emitting diode assembly defining a front side light emitting diode array and a rear side. The rear side is in thermal communication with a thermally conductive spreader, and a thermally conductive core is in thermal, communication with the conductive spreader. The thermally conductive core includes an electrical conductor in operative communication with the front side light emitting diode array, and a plurality of appendages are disposed about the thermally conductive core such that they are in thermal communication with the conductive spreader.

公开(公告)号：EP3394509A1

公开(公告)日：2018-10-31

申请号：EP16826771.4

申请日：2016-12-21

Applicant: SABIC Global Technologies B.V.

Inventor： CHENG, Yingjun ,  HUANG, Guangde ,  JIANG, Ke ,  YANG, Jian ,  SHEN, Fei

IPC: F21V29/70 ,  F21V29/87 ,  F21K9/232 ,  F21Y107/20 ,  F21Y107/30 ,  F21Y107/40 ,  F21Y115/10

CPC classification number: F21V29/87 ,  F21K9/232 ,  F21V29/70 ,  F21V29/74 ,  F21V29/83 ,  F21Y2107/20 ,  F21Y2107/30 ,  F21Y2107/40 ,  F21Y2115/10 ,  Y02B20/383

Abstract: An illumination device, comprising: a polymeric heat sink having a protrusion extending outward from the polymeric heat sink; a first printed circuit board having at least first and second surfaces opposing one another and being separated by a thickness of the printed circuit board, the first surface of the first printed circuit board supporting at least two light emitting diodes, the second surface of the first printed circuit board conforming to and being thermally coupled to the protrusion of the polymeric heat sink; a radiation-transmissive enclosure configured to at least partially enclose the first printed circuit board and the at least two light emitting diodes; a conductive path placing a light emitting diode into electrical communication with the environment exterior to the device.

公开(公告)号：EP3141951B1

公开(公告)日：2018-10-17

申请号：EP15777211.2

申请日：2015-02-16

Applicant: Sony Corporation

Inventor： TERASAKI, Kazuya

IPC: G03B21/16 ,  F21S2/00 ,  G03B21/14 ,  G03B21/20 ,  H04N5/74 ,  F21V29/51 ,  F21V29/74 ,  F21Y115/30 ,  F21V29/67 ,  F28D15/02

CPC classification number: G03B21/16 ,  F21S2/00 ,  F21V29/51 ,  F21V29/673 ,  F21V29/74 ,  F21Y2115/30 ,  F28D15/0275 ,  G03B21/204 ,  H04N5/74

Abstract: A light source apparatus according to an embodiment of the present technology includes a light source section and a heat dissipation section. The light source section includes a plurality of light source units. The heat dissipation section includes one or more fins commonly thermally connected to the plurality of light source units, a first mounting portion on which a suction mechanism that sucks heated air through the one or more fins is mounted, and a second mounting portion on an opposite side of the first mounting portion, on which the light source section is mounted, the second mounting portion including a first intake port serving as an intake port for cooling air guided to the one or more fins.

公开(公告)号：EP3382276A1

公开(公告)日：2018-10-03

申请号：EP17189868.7

申请日：2017-09-07

Applicant: DONGGUAN PAN AMERICAN ELECTRONICS CO., LTD

Inventor： DENG, Jinsheng

IPC: F21V31/00 ,  F21S8/00 ,  F21S8/04 ,  F21V15/01 ,  F21V29/70 ,  F21W131/10 ,  F21S8/06

CPC classification number: F21S8/04 ,  F21S8/043 ,  F21S8/063 ,  F21V15/01 ,  F21V17/10 ,  F21V19/0055 ,  F21V21/14 ,  F21V29/74 ,  F21V29/763 ,  F21V31/005 ,  F21W2131/10

Abstract: A light includes a bottom box, a cover mounted on the bottom box, a light emitting shield mounted on the cover and a back plate; the bottom box includes a bottom plate, a light source connected to the bottom plate, a sealing strip extending from the bottom plate, a plurality of cooling fins connected to the bottom plate and a rod sleeve connecting the bottom plate; the bottom plate is provided with a plurality of connection holes; the back plate includes a mounting portion, two extending portions extending from both sides of the mounting portion and two fixing portions extending from the extending portions; the mounting portion is provided with a rod receiving hole; the mounting portion is provided with a plurality of plate connection holes; the fixing portion of the back plate is provided with a plurality of fixing holes.

公开(公告)号：EP2657596B1

公开(公告)日：2018-09-19

申请号：EP13162624.4

申请日：2013-04-05

Applicant: Black & Decker Inc.

Inventor： Choksi, Snehal, S ,  Watson, James B. ,  Watts, Fred S. ,  Wojcicki, Andrzej, R. ,  Concari, Gabriel ,  Bascom, James ,  Gibson, Leon, T.

IPC: F21S8/08 ,  F21V21/10 ,  F21V21/22 ,  F21Y115/10 ,  F21V17/08 ,  F21V21/06 ,  F21V21/116 ,  F21V23/02 ,  F21V23/00 ,  F21W131/10 ,  F21V29/76 ,  F21V29/74

CPC classification number: F21S8/081 ,  F21V17/08 ,  F21V21/06 ,  F21V21/10 ,  F21V21/116 ,  F21V21/145 ,  F21V21/22 ,  F21V23/002 ,  F21V23/009 ,  F21V23/02 ,  F21V29/74 ,  F21V29/76 ,  F21W2131/1005 ,  F21Y2115/10

Abstract: A light stand assembly with a base having pivoting legs and a power supply circuit. An adjustable post detachably connects to the base. The adjustable post is configured for telescoping movement between a lowered position and a raised position, and secures at a selected position with latches. An adjustable post connector moveably connects to the adjustable post. A pair of light modules detachably connect to the adjustable post connector and operatively connects to the power supply circuit.

公开(公告)号：EP3361832A1

公开(公告)日：2018-08-15

申请号：EP18162981.7

申请日：2014-06-30

Applicant: Xicato, Inc.

Inventor： HARBERS, Gerard ,  LOVERIDGE, Barry Mark

IPC: H05B37/00 ,  H05B33/08 ,  H04L29/08 ,  H04W84/12 ,  H05B37/02

CPC classification number: H05B37/0263 ,  F21K9/68 ,  F21V29/74 ,  H04L67/125 ,  H04W4/80 ,  H04W84/12 ,  H05B33/0842 ,  H05B33/0845 ,  H05B33/0887 ,  H05B33/089 ,  H05B37/0254 ,  H05B37/0272

Abstract: An LED based illumination device includes a receiver and a transmitter for communications adhering to a lighting control communications protocol and a high speed communications protocol. The LED based illumination device may be part of a lighting control network, wherein the data transmission rate of the high speed communications protocol is more than twice that of the lighting control communications protocol. The lighting control network may be coupled to a digital communications gateway, including a digital communications interface configured to be coupled to a network operating in accordance with an internet protocol and a lighting control network interface coupled to the lighting control network. A processor determines a summary status value of the LED based illumination device based on information stored in memory of the digital communications gateway. The digital communications gateway may periodically transmit the time of day to the LED based illumination device over the lighting control network.

公开(公告)号：EP2589082B1

公开(公告)日：2018-08-08

申请号：EP11800038.9

申请日：2011-06-29

Applicant: Cooledge Lighting Inc.

Inventor： TISCHLER, Michael ,  SCHICK, Philippe ,  ASHDOWN, Ian ,  SHEEN, Calvin Wade ,  JUNGWIRTH, Paul

IPC: H05B37/00 ,  F21K99/00 ,  F21S2/00 ,  H05B37/04 ,  H01L33/62

CPC classification number: H01L51/0097 ,  F21K9/20 ,  F21K9/275 ,  F21K9/278 ,  F21K9/64 ,  F21K9/65 ,  F21K9/66 ,  F21V3/02 ,  F21V9/30 ,  F21V23/003 ,  F21V23/02 ,  F21V29/74 ,  F21Y2115/10 ,  G02F1/133603 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0753 ,  H01L27/156 ,  H01L31/0468 ,  H01L33/0025 ,  H01L33/06 ,  H01L33/08 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/36 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/06102 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2225/107 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/10321 ,  H01L2924/10322 ,  H01L2924/10323 ,  H01L2924/10324 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10332 ,  H01L2924/10333 ,  H01L2924/10334 ,  H01L2924/10335 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/381 ,  H02S30/00 ,  H05B33/0854 ,  H05B37/0218 ,  H05B37/0227 ,  H05B37/0245 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/302 ,  H01L2924/01015 ,  H01L2924/01031 ,  H01L2924/01051 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

公开(公告)号：EP2662612B1

公开(公告)日：2018-07-25

申请号：EP13171518.7

申请日：2008-12-26

Applicant: Nichia Corporation

Inventor： Ozeki, Satoshi ,  Miyairi, Hiroshi ,  Ono, Masato

IPC: F21S4/00 ,  F21V29/00 ,  F21V7/00 ,  F21W131/405 ,  A47F3/00 ,  F21Y115/10

CPC classification number: F21V11/183 ,  A47F3/001 ,  E05D11/082 ,  F16M11/10 ,  F16M2200/022 ,  F21K9/60 ,  F21S2/00 ,  F21S4/28 ,  F21V7/0008 ,  F21V7/005 ,  F21V13/02 ,  F21V19/003 ,  F21V29/70 ,  F21V29/74 ,  F21V29/83 ,  F21W2131/405 ,  F21Y2101/02 ,  F21Y2103/10 ,  F21Y2115/10

Abstract: This aims to provide a support (10) comprising a bracket (7) attached to a predetermined structure, and a generally cylindrical holder (6) retained in the bracket (7). This bracket (7) has a receiving hole (112) for accommodating the holder (6). This holder (6) has a first rib (122) erected on a curved outer circumference, and an elastic portion (124) for giving the first rib (122) the degree of freedom for motions in the substantially radial direction. This also aims to provide a lighting unit (20) characterized by comprising a board (2), in which light emitting portions (23) having semiconductor light emitting devices are arrayed on the upper face side along the longitudinal direction, reflector members (3A and 3B) mounted on the side of the upper face of the board and having reflecting portions (34a and 34b) for covering the light emitting units and for reflecting the lights from the light emitting units, and a case member (4) disposed to support the board and the reflector members upward and downward.

公开(公告)号：EP3330607A1

公开(公告)日：2018-06-06

申请号：EP15899763.5

申请日：2015-07-28

Applicant: Sokolov, Yuriy Borisovich

Inventor： Sokolov, Yuriy Borisovich

IPC: F21V15/01 ,  F21V29/74 ,  F21V19/00 ,  F21Y115/10

CPC classification number: F21K9/237 ,  F21K9/238 ,  F21V19/00 ,  F21V29/713 ,  F21V29/74 ,  F21V29/83 ,  F21V29/85 ,  F21V29/89 ,  F21Y2115/10

Abstract: The invention relates to lighting technology, and specifically, to designs of general-purpose LED bulbs. The technical result of the claimed solution is an improvement in the removal of heat from light-emitting diodes and from a power source, and an increase in the manufacturability and lighting efficiency of a bulb. The LED bulb comprises a body-cum-radiator (1) covered with a dielectric heat-conductive plastic; a base plate with light-emitting diodes; a diffuser (5) covering the light-emitting diodes; a power source; and a cap (7). The body-cum-radiator (1) comprises two combined aluminium profiles (8), the inner and outer surfaces of which are covered with a dielectric heat-conductive plastic, the outer wall has extended ends (11) and a flat surface section which is equipped with heat-removing cooling fins (12), wherein the heat-removing fins of a first part of the body-cum-radiator are oriented towards the heat-removing fins of a second part of the body-cum-radiator and mounted with a gap (13); the base plate of the light-emitting diodes is mounted on flat sections of the surface of each aluminium profile; and the extended ends (11) of the outer wall of each aluminium profile are connected to the cap (7) with the aid of the dielectric heat-conductive plastic, from the material of which an enclosure (14) is formed for accommodating the power source, the enclosure being separated from the aluminium profile by an air gap (15).