公开(公告)号：EP2198484B1

公开(公告)日：2018-12-05

申请号：EP08786264.5

申请日：2008-07-18

Applicant: Robert Bosch GmbH

Inventor： KOPF, Stefan ,  ROHDE, Hartmut

IPC: H01R12/71

CPC classification number: H05K3/368 ,  H01R12/714 ,  H01R13/405 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/181 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10393

公开(公告)号：EP3177117A1

公开(公告)日：2017-06-07

申请号：EP16743575.9

申请日：2016-01-29

Applicant: Fujikura, Ltd.

Inventor： MURAKAMI, Makoto

IPC: H05K3/20 ,  G06F3/041 ,  H05K3/38

CPC classification number: G06F3/044 ,  G06F3/041 ,  G06F2203/04103 ,  H05K1/0296 ,  H05K3/20 ,  H05K3/207 ,  H05K3/38 ,  H05K2201/09045 ,  H05K2201/09681 ,  H05K2203/0502

Abstract: A wiring body (2) includes a conductive portion (5) including a contact surface (51) having a concave-convex shape including a concave portion (511) and a convex portion (512) in a section view in a longitudinal direction, and a top surface (52) facing the contact surface (51), and containing at least conductive particles (CP), and an adhesive layer (4) formed by being stacked on the contact surface (51). The adhesive layer (4) includes a smooth portion (41) provided at a substantially constant thickness and having a substantially smooth main surface (411), and a protrusion (42) provided on the smooth portion (41) to correspond to the conductive portion (5) and protruding from the main surface (411) toward a side of the conductive portion (5), the protrusion (42) comes into contact with the contact surface (51) and includes a concave-convex surface complementary to the concave-convex shape of the contact surface (51), the contact surface (51) is positioned on a side of the top surface (52) with respect to the main surface (411), and the following Formula (1) is satisfied. L 1 > L 2 ... (1). In the above Formula (1), L 1 denotes a unit length of the contact surface (51) in the section view in the longitudinal direction, and L 2 denotes a unit length of the top surface (52) in the section view in the longitudinal direction.

Abstract translation: 布线体（2）具备：导电部（5），该导电部（5）在长度方向上的剖面观察下具有包含凹部（511）和凸部（512）的凹凸形状的接触面（51）， 与接触表面51相对且至少包含导电颗粒CP的顶表面52以及通过堆叠在接触表面51上形成的粘合剂层4。 粘合剂层（4）包括以基本上恒定的厚度设置且具有基本上平滑的主表面（411）的平滑部分（41）和设置在平滑部分（41）上以对应于导电部分 （5）并且从所述主表面（411）朝向所述导电部分（5）的一侧突出，所述突起（42）与所述接触表面（51）接触并且包括与所述凹入表面互补的凹凸表面， （51）的凹凸形状，接触面（51）相对于主面（411）位于顶面（52）侧，满足下式（1）。 L1> L2 ...（1）。 在上式（1）中，L1表示沿纵向的截面图中的接触表面（51）的单位长度，并且L2表示在纵向方向上的截面图中的顶表面（52）的单位长度 。

公开(公告)号：EP3041592A4

公开(公告)日：2017-06-07

申请号：EP14841564

申请日：2014-09-03

Applicant: BRIXO SMART TOYS LTD

Inventor： ALMOG BOAZ ,  SARAF AMIR

IPC: A63H33/04 ,  A63H33/08 ,  H05K3/00

CPC classification number: A63H33/042 ,  A63H33/086 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/326 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/0999 ,  H05K2201/209

Abstract: The present invention relates to a selectively conductive toy building element, comprising: a body adapted for releasable engagement to at least one other toy building element body or to a corresponding baseplate, the body including at least one conductive portion having at least one contact area adapted to generate pressure on a conductive portion or contact area of an adjacent toy building element body, in such a way that ensures electrical conduction between said toy building elements in a desired location and direction.

Abstract translation: 本发明涉及一种选择性导电玩具搭建元件，包括：主体，其适于可释放地接合到至少一个其他玩具搭建元件主体或相应的基板，主体包括至少一个导电部分，该至少一个导电部分具有至少一个接触区域， 以在相邻的玩具构建元件本体的导电部分或接触区域上产生压力，从而确保所述玩具构建元件之间在期望的位置和方向上的导电。

公开(公告)号：EP3149769A1

公开(公告)日：2017-04-05

申请号：EP14893556.2

申请日：2014-05-28

Applicant: Intel Corporation

Inventor： HU, Chuan ,  ELSHERBINI, Adel A. ,  TOMITA, Yoshihiro ,  LIFF, Shawna

IPC: H01L23/48 ,  H01L21/768 ,  H01L21/60

CPC classification number: H05K1/0283 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/1515 ,  H01L2924/181 ,  H05K1/036 ,  H05K1/185 ,  H05K3/1275 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09263 ,  H05K2201/10151 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure describe a wavy interconnect for bendable and stretchable devices and associated techniques and configurations. In one embodiment, an interconnect assembly includes a flexible substrate defining a plane and a wavy interconnect disposed on the flexible substrate and configured to route electrical signals of an integrated circuit (IC) device in a first direction that is coplanar with the plane, the wavy interconnect having a wavy profile from a second direction that is perpendicular to the first direction and coplanar with the plane. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例描述了用于可弯曲和可拉伸装置的波浪互连以及相关联的技术和构造。 在一个实施例中，互连组件包括限定平面的柔性衬底和设置在柔性衬底上的波纹互连，并且被配置为沿与平面共面的第一方向布置集成电路（IC）器件的电信号， 互连件具有从垂直于第一方向并与该平面共面的第二方向的波状轮廓。 可以描述和/或要求保护其他实施例。

公开(公告)号：EP3081057A1

公开(公告)日：2016-10-19

申请号：EP14811773.2

申请日：2014-12-09

Applicant: Giesecke & Devrient GmbH

Inventor： BALDISCHWEILER, Michael

IPC: H05K3/02 ,  B32B15/00 ,  B32B27/00 ,  B32B37/10 ,  G06K19/077 ,  B30B5/06 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K3/022 ,  B30B5/06 ,  B32B15/14 ,  B32B15/20 ,  B32B37/1027 ,  B32B38/06 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/202 ,  G06K19/07718 ,  G06K19/07754 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/0014 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0373 ,  H05K2201/09045 ,  H05K2203/068 ,  H05K2203/1545

Abstract: In a method for producing a module strip (200) with elevations (240) in an electrically conductive layer (230) arranged on one side of the module strip (200), first a carrier layer (220) and the electrically conductive layer (230) are provided. A stencil foil (300), which has clearances (310), is also provided. The stencil foil (300) is then fed together with the carrier layer (220) and the electrically conductive layer (230) to a continuous laminating press (100). The electrically conductive layer (230) is in this case arranged between the stencil foil (300) and the carrier layer (220). The carrier layer (220) is bonded to the electrically conductive layer (230) in the continuous laminating press (100) in a continuous process to form the module strip (200). In this process, the electrically conductive layer (230) is pressed into the clearances (310) in the stencil foil (300), whereby the desired elevations (240) are obtained in the electrically conductive layer (230).

公开(公告)号：EP0773584B1

公开(公告)日：2015-04-15

申请号：EP96308093.2

申请日：1996-11-07

Applicant: Fujitsu Semiconductor Limited

Inventor： Yoneda, Yoshiyuki ,  Tsuji, Kazuto ,  Orimo, Seiichi ,  Sakoda, Hideharu ,  Nomoto, Ryuji ,  Onodera, Masanori ,  Kasai, Junichi

IPC: H01L21/48 ,  H01L21/67 ,  H01L23/00 ,  H01L21/683 ,  H01L29/06 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01L23/31 ,  H01L21/56 ,  H01L25/10

CPC classification number: H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67138 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85664 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device includes a chip (111), and a resin package (112, 151, 314) sealing the chip, the resin package having resin projections (117, 154, 318) located on a mount-side surface of the resin package. Metallic films (113, 155, 315) are respectively provided to the resin projections. Connecting parts (118, 101, 163, 245, 313, 341, 342) electrically connect electrode pads of the chip and the metallic films.

公开(公告)号：EP2600702A3

公开(公告)日：2015-01-07

申请号：EP12194877.2

申请日：2012-11-29

Applicant: Johnson & Johnson Vision Care Inc.

Inventor： Pugh, Randall Braxton ,  Toner, Adam ,  Pandojirao-S, Praveen ,  Riall, James Daniel ,  Otts, Daniel B. ,  Kernick, Edward

IPC: H05K3/30 ,  H05K1/18 ,  G02C7/04 ,  G02C7/08 ,  G02C7/10 ,  H05K1/02

CPC classification number: H05K3/301 ,  G02C7/04 ,  G02C7/083 ,  G02C7/101 ,  H05K1/0274 ,  H05K1/189 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10568 ,  H05K2201/10727 ,  H05K2201/10916 ,  H05K2201/10984

Abstract: Ophthalmic lenses, including contact lenses may be enhanced through the incorporation of both active and passive electrical components. Electrical interconnects and die attachment configurations are required to ensure electrical connectivity between the components and the optic portion of the lens as well as providing a means for mounting planar devices on spherical surfaces. Electrical interconnects and die attachment for powered ophthalmic devices, including contact lenses includes realizing conductive traces on optical plastic, attaching planar dies to spherical surfaces and underfilling, overmolding and light blocking to complete the lens.

Abstract translation: 可以通过并入有源和无源电气元件来增强眼镜片，包括隐形眼镜。 需要电互连和管芯附接配置以确保部件和透镜的光学部分之间的电连接以及提供用于将平面装置安装在球形表面上的装置。 用于动力眼科装置（包括隐形眼镜）的电互连和芯片附件包括实现光学塑料上的导电迹线，将平面裸片附接到球形表面和底部填充，二次模制和遮光以完成透镜。

公开(公告)号：EP2320457A3

公开(公告)日：2014-09-10

申请号：EP11154345.0

申请日：2007-03-22

Applicant: CeramTec GmbH

Inventor： Kluge, Dr. Claus Peter

IPC: H01L23/373 ,  H01L23/367

CPC classification number: F21V29/70 ,  F21K9/23 ,  F21V29/71 ,  F21V29/713 ,  F21V29/75 ,  F21V29/763 ,  F21V29/86 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2115/10 ,  F28F2215/10 ,  H01L23/15 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/552 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L25/16 ,  H01L25/162 ,  H01L33/642 ,  H01L33/648 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/09045 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00011

Abstract: Die Erfindung betrifft einen Trägerkörper (1, 2) für elektrische oder elektronische Bauelemente (6a, 6b, 6c, 6d) oder Schaltungen, wobei der Trägerkörper (1, 2) elektrisch nicht oder nahezu nicht leitend ist und der Trägerkörper (1, 2) einstückig mit Wärme ab- oder zuführenden Kühlelementen (7) versehen ist.
Zur Vereinfachung des Trägerkörpers (1) bei gleichzeitiger extrem verbesserter Wärmeableitung wird erfindungsgemäß vorgeschlagen, dass der Trägerkörper (1, 2) eine Platine ist, der Trägerkörper (1, 2) und das Kühlelement (7) aus einer Keramik oder aus einem Kompositmaterial besteht und das Kompositmaterial elektrisch nicht oder nahezu nicht leitende Matrixmaterialien mit Wärme leitenden Zuschlagstoffen enthält und auf der Oberfläche des Trägerkörpers (1, 2) versinterte Metallisierungsbereiche (41) aufgebracht sind.

Abstract translation: 本发明涉及用于电气或电子部件（6a，6b，6c，6d）或电路的载体（1,2），其中载体（1,2）是不导电的或几乎不导电的，载体（1,2） 整体地设置有散热或馈送冷却元件（7）。 为了简化载体（1）同时具有极大改进的散热性，本发明提出载体（1,2）是电路板，载体（1,2）和冷却元件（7）由陶瓷或复合材料组成，并且 复合材料包含不导电或几乎不导电的基体材料与导热添加剂，并且将烧结金属化区域（41）施加到载体主体（1,2）的表面。

公开(公告)号：EP2763512A1

公开(公告)日：2014-08-06

申请号：EP14153241.6

申请日：2014-01-30

Applicant: Tellabs Oy

Inventor： Holma, Antti ,  Kohonen, Petri

IPC: H05K1/02

CPC classification number: H05K1/0209 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0284 ,  H05K2201/09045

Abstract: A circuit board system according to the invention comprises a circuit board (101), at least one electrical component (102), and a conductor part (103) in heat conducting relation with the electrical component. A surface of the circuit board comprises a portion (104) that is uneven so as to increase the surface area of the portion. The portion is coated with a coating (105) made of conductor material so that a surface of the coating is uneven. The circuit board comprises a heat conductive pathway (106) made of conductor material and extending from the conductor part to the coating. Thus, the coating operates as a cooling element for cooling the electrical component.

Abstract translation: 根据本发明的电路板系统包括电路板（101），至少一个电气部件（102）和与电气部件导热的导体部分（103）。 电路板的表面包括不均匀的部分（104），以增加该部分的表面积。 该部分涂覆有由导体材料制成的涂层（105），使得涂层的表面不均匀。 电路板包括由导体材料制成并从导体部分延伸到涂层的导热通路（106）。 因此，涂层作为用于冷却电气部件的冷却元件工作。

公开(公告)号：EP2156713B1

公开(公告)日：2013-02-13

申请号：EP08717788.7

申请日：2008-03-13

Applicant: Robert Bosch GmbH

Inventor： WERNER, Michael ,  LACHENMAIER, Armin ,  LISCHECK, Andre ,  SCHULZ, Udo ,  PROEPPER, Thomas ,  DIEKE, Stephan ,  BARTH, Heinrich ,  HENNEL, Udo ,  KIRSCHNER, Manfred

IPC: H05K3/10 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K3/105 ,  B82Y10/00 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0284 ,  H05K1/0293 ,  H05K1/0373 ,  H05K1/119 ,  H05K3/4069 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/083 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/104 ,  H05K2203/105 ,  H05K2203/107 ,  H05K2203/159 ,  H05K2203/173