ADHESION PROMOTER AND PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAME

    公开(公告)号:EP3995894A1

    公开(公告)日:2022-05-11

    申请号:EP19936164.3

    申请日:2019-07-02

    IPC分类号: G03F7/004 C07D251/00

    摘要: The present invention relates to an adhesion promoter as shown in Formula (I) and a photosensitive resin composition containing the adhesion promoter, where R 1 , R 2 , R 3 , A and X are defined as shown in the specification and claims. The adhesion promoter and the photosensitive resin composition of the present invention can be used for manufacturing a semiconductor integrated circuit (IC), a light-emitting diode (LED) and a flat-panel display (FPD), such as a liquid crystal display (LCD) and an organic light-emitting display (OLED). The adhesion promoter of the present invention has high effectiveness and can improve the adhesion between the photosensitive resin composition and a surface of a substrate.