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公开(公告)号:EP3815268B1
公开(公告)日:2023-09-06
申请号:EP19818421.0
申请日:2019-11-19
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公开(公告)号:EP4231469A1
公开(公告)日:2023-08-23
申请号:EP22208401.4
申请日:2022-11-18
申请人: Exalos AG
发明人: ROSSETTI, MARCO , DÜLK, MARCUS , CASTIGLIA, ANTONINO FRANCESCO , MALINVERNI, MARCO , VELEZ, CHRISTIAN
摘要: A monolithic edge-emitting semiconductor diode array chip (100) comprises
a one-dimensional array (70) of diode emitters (50), such as laser diodes, superluminescent diodes or semiconductor optical amplifiers. Semiconductor layers are arranged on a conductive substrate (1) and include active region layers (14) arranged between upper and lower cladding layers (12, 16) and separation layers (4, 5) arranged between the conductive substrate (1) and the lower cladding layer (16). The diode emitters (50) are formed by respective ridges (9) that are separated by trenches (25) which are sufficiently deep to penetrate into the separation layers (4, 5). Each diode (50) has its own upper and lower contacts (22, 24) that allow each diode (50) to be independently drivable with a current source driver circuit connected to push a modulated push current through its associated diode and/or a current sink connected to extract a modulated pull current through its associated diode.-
公开(公告)号:EP4224644A2
公开(公告)日:2023-08-09
申请号:EP23165059.9
申请日:2014-04-22
申请人: Nichia Corporation
摘要: A light source apparatus of the present invention has a plurality of semiconductor laser devices and a holding member; the semiconductor laser device includes: a semiconductor laser element; a placing body on which the semiconductor laser element is mounted; a substrate on which the placing body is biased to one side thereof; and a pair of terminals electrically connected to the semiconductor laser element, biased to the other side of the substrate and protruding from the substrate, and the holding member includes: holes aligned in at least a pair of rows; a thin-walled section on which the holes are arranged, the thin-walled section being formed by providing at least a pair of depressions on the other side; and a thick-walled section provided adjacent to the thin-walled section. The semiconductor laser device is mounted on one side of the holding member and the placing body of the semiconductor laser device is disposed on the thick-walled section, and the pair of terminals are exposed
through the holes from the other side of the holding member.-
公开(公告)号:EP3560048B1
公开(公告)日:2023-08-09
申请号:EP17829528.3
申请日:2017-12-20
IPC分类号: H01S5/00 , H01S5/02216 , H01S5/02251 , H01S5/40 , H01S5/022
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公开(公告)号:EP4207514A1
公开(公告)日:2023-07-05
申请号:EP22155253.2
申请日:2022-02-04
发明人: PARKER, John , PIELS, Molly , SHI, Hanxing
IPC分类号: H01S5/02 , H01S5/0225 , G02B6/12 , H01S5/12 , H01S5/00 , H01S5/40 , H01S5/026 , H01S5/0683
摘要: A symmetric distributed feedback (DFB) laser that is integrated in a silicon based photonic integrated circuit can output light from both sides of the symmetric DFB laser onto waveguides. The light in the waveguides can be phase adjusted and combined using an optical coupler. The symmetric DFB laser can generate light and symmetrically output light onto different lanes of a multi-lane transmitter.
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公开(公告)号:EP4199277A1
公开(公告)日:2023-06-21
申请号:EP23154847.0
申请日:2020-01-22
申请人: Nichia Corporation
发明人: MIURA, Soichiro , OKUNO, Ryota
IPC分类号: H01S5/40
摘要: A light emitting device includes semiconductor laser elements, a frame part, a light-reflective member, a step part, metal films, wires, and a first protective element. The frame part surrounds a bottom surface on which the semiconductor laser elements are disposed. The light-reflective member is disposed on the bottom surface inside of a frame formed by the frame part. The step part is formed along a second inner lateral surface of the frame part, and disposed inside of the frame. The metal films are provided on an upper surface of the step part. The wires electrically connect the semiconductor laser elements respectively to the metal films. The first protective element is disposed on the upper surface of the step part and on a light traveling side of the laser light with respect to a plane including an emitting end surface of the first semiconductor laser element.
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公开(公告)号:EP4128450A1
公开(公告)日:2023-02-08
申请号:EP20825083.7
申请日:2020-11-30
申请人: Raytheon Company
发明人: ROCKWELL, David A.
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公开(公告)号:EP4125166A1
公开(公告)日:2023-02-01
申请号:EP20929035.2
申请日:2020-12-21
发明人: TOMIYASU, Takahiro , KAJI, Eisaku , OHKI, Yutaka
摘要: A submount includes a light emitting device mounted thereon. The submount includes: a base including a first surface extending in a first direction and in a second direction that is orthogonal to the first direction; a first electrode extending in the first direction and in the second direction on the first surface, the first electrode including a first end in the second direction, and a second end in opposite direction of the second direction, the second end extending in the first direction; and a second electrode extending in the first direction and in the second direction on the first surface, the second electrode including a third end in the opposite direction of the second direction, the third end being separated from the first end in the second direction with a gap therebetween, and a fourth end in the second direction, the fourth end extending in the first direction. In the second electrode, a second width between the third end and the fourth end in the second direction differs according to a position in the first direction.
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