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    COPPER ALLOY
    36.
    发明公开
    COPPER ALLOY 审中-公开
    铜合金

    公开(公告)号：EP3056578A1

    公开(公告)日：2016-08-17

    申请号：EP14849919.7

    申请日：2014-09-26

    申请人： Mitsubishi Shindoh Co., Ltd.

    发明人： OISHI Keiichiro ,  NAKASATO Yosuke ,  HATA Katsuhiko ,  TANAKA Shinji

    IPC分类号： C22C9/04 ,  C22F1/00 ,  C22F1/08

    CPC分类号： C22C9/04 ,  B22D21/005 ,  C21D8/02 ,  C21D8/0226 ,  C21D8/0236 ,  C21D8/0263 ,  C21D8/0273 ,  C21D9/46 ,  C22F1/08

    摘要： A copper alloy according to the present invention includes 17 mass% to 34 mass% of Zn, 0.02 mass% to 2.0 mass% of Sn, 1.5 mass% to 5 mass% of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12≤f1=[Zn]+5×[Sn]-2×[Ni]≤30, 10≤[Zn]-0.3×[Sn]-2×[Ni]≤28, 10≤f3={f1×(32-f1)×[Ni]} 1/2 ≤33, 1.2≤0.7×[Ni]+[Sn]≤4, and 1.4≤[Ni]/[Sn]≤90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an α phase is 99.5% or more by area ratio or an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% in an α phase matrix satisfy a relationship of 0≤2×(γ)+(β)≤0.7.

    摘要翻译： 根据本发明的铜合金包含17质量％-34质量％的Zn，0.02质量％-2.0质量％的Sn，1.5质量％-5质量％的Ni以及余量由Cu和不可避免的杂质组成的 其中12≤f1= [Zn] + 5×[Sn] -2×[Ni]≤30,10≤[Zn] -0.3×[Sn] -2×[Ni]≤28,10≤f3= { f1×（32-f1）×[Ni]} 1 /2≤33,1.2≤0.7×[Ni] + [Sn]≤4,1.4≤[Ni] / [Sn]≤90，导电率为13 ％IACS至25％IACS，α相的比例为面积比例为99.5％以上，或者α相（γ）％与β相（β）％的面积比例 满足0≤2×（γ）+（β）≤0.7的关系。

    COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD FOR PRODUCING IT, AND ROLLED COPPER ALLOY FOR ELECTRONIC DEVICE
    39.
    发明公开
    COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD FOR PRODUCING IT, AND ROLLED COPPER ALLOY FOR ELECTRONIC DEVICE 审中-公开
    铜合金用于电子装置的，方法及其与压延铜合电子器件用

    公开(公告)号：EP3020836A2

    公开(公告)日：2016-05-18

    申请号：EP15193144.1

    申请日：2011-05-13

    申请人： Mitsubishi Materials Corporation

    发明人： Ito, Yuki ,  Maki, Kazunari

    IPC分类号： C22C9/00 ,  C22F1/08 ,  H01B1/02 ,  C22C1/02

    CPC分类号： H01B1/026 ,  C22C1/02 ,  C22C1/03 ,  C22C9/04 ,  C22F1/08

    摘要： A copper alloy for an electronic device is provided wherein the copper alloy is composed of a binary alloy of Cu and Mg, the binary alloy comprises Mg at a content in a range of 3.3 to 6.9 atomic%, with a remainder being Cu and inevitable impurities, a conductivity σ (%IACS) is within the following range when the content of Mg is given as A atomic%, σ ≤ {1.7241/(-0.0347×A 2 +0.6569×A+1.7)× 100, and the copper alloy is a Cu-Mg solid solution alloy supersaturated with Mg.

    摘要翻译： worin铜合金由Cu和Mg的二元合金的被设置在电子设备用铜合金，二元合金包括镁在范围3.3〜6.9原子％的含量，且剩余部分由Cu和不可避免的杂质 中，导电性的（％IACS）为以下范围内。当Mg的含量为A原子％，A‰¤{1.7241 /（ - 0.0347×A 2 + 0.6569×A + 1.7）×100，并且铜 合金是用Mg过饱和的Cu-Mg的固溶体合金。