公开(公告)号：EP0981183A3

公开(公告)日：2000-07-05

申请号：EP99306481.5

申请日：1999-08-17

申请人： SEIKO EPSON CORPORATION

发明人： Muramatsu, Eiji

IPC分类号： H01R12/12 ,  H01R12/14

CPC分类号： H01R12/7076 ,  G02F1/1336 ,  G02F1/13452 ,  G02F2201/465 ,  H01R13/2414 ,  H05K3/365 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/49169

摘要： The present invention provides: a circuit board connecting structure capable of connecting a circuit board, such as a flexible wiring board, and another circuit board by securing adequate contact pressure without the need for forming any special part thereby to improve the reliability of contact and to reduce the number of parts; an electro-optical device; electronic apparatus provided with the same; and a manufacturing method for an electro-optical device. The circuit board connecting structure electrically connects a conductive terminal 22-1 provided on a flexible wiring substrate 20, which is a first circuit board, and a conductive terminal 12 provided on a second circuit board 10. The connecting structure has a conductive member 30 provided between the first circuit board 20 and the second circuit board 10 to electrically connect the foregoing respective conductive terminals 22-1 and 12, a structural member 40 which is fixed to the first circuit board 20 and disposed to face one surface of the first circuit board 20, and a spacing member 60 provided between the structural member 40 and the first circuit board 20. The structural member 40 has a light guide 44 on which a liquid crystal display panel 50 is rested.