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2264 条记录 (耗时 0.019 秒)

    MOUNTING APPARATUS
    5.
    发明授权
    MOUNTING APPARATUS 有权

    公开(公告)号：EP3051933B1

    公开(公告)日：2018-08-29

    申请号：EP13894140.6

    申请日：2013-09-24

    申请人： Fuji Machine Mfg. Co., Ltd.

    发明人： KAWAI, Hidetoshi

    IPC分类号： H05K13/02 ,  H05K13/00

    CPC分类号： H05K13/0404 ,  H05K13/0061 ,  H05K13/0069 ,  H05K13/08 ,  H05K13/0857 ,  H05K13/087 ,  H05K2201/09927 ,  H05K2203/0165 ,  H05K2203/163 ,  Y10T29/4913 ,  Y10T29/53174

    摘要： A mounting machine acquires identification information arranged in a back-up plate, from the back-up plate. The mounting machine controls a conveyance unit so as to change a conveyance lane based on mounting conditions when the acquired identification information is identification information which is included in the mounting conditions of a printed circuit board. Meanwhile, in the mounting machine, when the acquired identification information is not the identification information which is included in the mounting conditions of the printed circuit board, the conveyance lane is stopped from being changed. In this manner, a conveyance width of the conveyance lane is not changed when the back-up plate which is ready to be subjected to mounting processing and matches the mounting conditions is not mounted.

    IMPLANTABLE MEDICAL DEVICE FOR MINIMALLY-INVASIVE INSERTION
    8.
    发明授权
    IMPLANTABLE MEDICAL DEVICE FOR MINIMALLY-INVASIVE INSERTION 有权
    用于微创插入的可植入医疗装置

    公开(公告)号：EP2934289B1

    公开(公告)日：2018-04-25

    申请号：EP13818941.0

    申请日：2013-12-20

    申请人： Microchips Biotech, Inc.

    发明人： FARRA, Robert

    IPC分类号： A61M5/172 ,  A61B5/00 ,  A61B5/07 ,  A61M31/00

    CPC分类号： A61M5/172 ,  A61B5/076 ,  A61B5/4839 ,  A61B2562/166 ,  H01L2224/48091 ,  H01L2224/48227 ,  Y10T29/4913 ,  H01L2924/00014

    摘要： Containment devices and methods of manufacture and assembly are provided. In an embodiment, the containment device includes an elongated microchip element comprising one or more containment reservoirs that are configured to be electrically activated to open. The containment device also include an elongated electronic printed circuit board (PCB) comprising a substrate. The elongated PCB comprises a first side on which one or more electronic components are fixed and an opposed second side on which the elongated microchip element is fixed in electrical connection to the one or more electronic components. Further, the containment device includes an elongated housing fixed to the elongated PCB. The elongated housing is configured to hermetically seal the one or more electronic components of the elongated PCB within the elongated housing.

    Low inductance flex bond with low thermal resistance
    10.
    发明公开
    Low inductance flex bond with low thermal resistance 审中-公开
    低电感柔性结合，低热阻

    公开(公告)号：EP2725611A3

    公开(公告)日：2018-01-24

    申请号：EP13186185.8

    申请日：2013-09-26

    申请人： LSI Corporation

    发明人： Laturell, Donald R. ,  Abdelli, Said E. ,  Kiss, Peter ,  MacDonald, James F. ,  Wilson, Ross S.

    IPC分类号： H01L23/498 ,  H01L23/538

    CPC分类号： H05K1/0216 ,  H01L23/4985 ,  H01L23/5387 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/028 ,  H05K3/306 ,  H05K3/4691 ,  H05K2201/042 ,  Y10T29/4913 ,  H01L2924/00

    摘要： An electronic circuit with low inductance connections is disclosed. The electronic circuit includes a ground plane and a flex circuit. The flex circuit having a first surface generally facing the ground plane and a second surface opposite to the first surface. The flex circuit also having a flexible bridge defined thereof. The electronic circuit further includes a first electronic device communicatively coupled to the second surface of the flex circuit, a second electronic device communicatively coupled to the second surface of the flex circuit, and at least one conductive trace defined on the second surface of the flex circuit and extending along the flexible bridge. One end of the at least one conductive trace is configured for receiving an outbound current from the first electronic device and another end of the at least one conductive trace is communicatively coupled to the second electronic device through a vertical interconnect access.

    摘要翻译： 公开了一种具有低电感连接的电子电路。 电子电路包括接地平面和柔性电路。 该柔性电路具有大致面对地平面的第一表面和与第一表面相对的第二表面。 柔性电路也具有由其限定的柔性桥。 电子电路还包括通信地耦合到柔性电路的第二表面的第一电子设备，通信地耦合到柔性电路的第二表面的第二电子设备以及限定在柔性电路的第二表面上的至少一个导电迹线 并沿着柔性桥延伸。 所述至少一个导电迹线的一端被配置用于从所述第一电子设备接收出站电流，并且所述至少一个导电迹线的另一端通过垂直互连接入通信地耦合到所述第二电子设备。