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公开(公告)号：EP4249160A1
公开(公告)日：2023-09-27
申请号：EP22164097.2
申请日：2022-03-24
申请人： Bystronic Laser AG
发明人： HAAS, Titus , LÜDI, Andreas
摘要： In einem Aspekt betrifft die vorliegende Erfindung die Berechnung von Konturabweichungen (ka) zur Steuerung einer Laserschneidmaschine (L) mit Steueranweisungen (sa). Die Konturabweichungen (ka) werden aus einem Verschiebevektor (vv) berechnet, der aus einem Bildvergleich zwischen einem mit einer Kamera (K) erfasste Bild und einem virtuellen Rekonstruktionsbildes (v) ermittelt wird. Das virtuelle Rekonstruktionsbild (v) wird auf Basis einer auf das Werktstück (W) applizierten Referenztextur (RT) und von Steuerwerten (sw) ermittelt.
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32.发明公开
公开(公告)号：EP4244016A1
公开(公告)日：2023-09-20
申请号：EP21892537.8
申请日：2021-10-07
IPC分类号： B23K26/36 , B23K26/06 , B23K26/08 , B23K26/142
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公开(公告)号：EP4223442A8
公开(公告)日：2023-09-20
申请号：EP22217061.5
申请日：2022-12-29
发明人： GOVARI, Assaf , BEECKLER, Christopher Thomas , KEYES, Joseph Thomas , PAPAIOANNOU, Athanassios , HERRERA, Kevin Justin
IPC分类号： B23K1/00 , B23K1/06 , B23K3/08 , A61B5/00 , H01L21/607 , B23K26/08 , B23K26/362
摘要： A system includes a fixture, a laser assembly, and a positioning assembly. The fixture is configured to hold (i) a substrate of a distal-end assembly of a catheter and (ii) a lead placed on a given solder pad disposed on the substrate, the laser assembly is configured to emit a laser beam, and the positioning assembly is configured to move the fixture, with the substrate and the lead, relative to the laser assembly, so as to mark a soldering position, at which the lead is to be attached to the given solder pad, with a laser spot of the laser beam.
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公开(公告)号：EP3486024B1
公开(公告)日：2023-09-13
申请号：EP18205907.1
申请日：2018-11-13
IPC分类号： B23K26/03 , B23K26/06 , B23K26/08 , B23K26/082
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公开(公告)号：EP3459675B1
公开(公告)日：2023-08-30
申请号：EP17799429.0
申请日：2017-05-17
发明人： HARA, Hideo , ITO, Masahito , UEHARA, Masanori , ASADA, Hiroshi , SASAKI, Hirokazu , HORIKAWA, Hiroshi
IPC分类号： B23K26/38 , B23K26/046 , B23K26/14 , B23K26/08 , B23K26/40 , B23K101/34 , B23K103/04
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公开(公告)号：EP3831526B1
公开(公告)日：2023-08-16
申请号：EP20208713.6
申请日：2020-11-19
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公开(公告)号：EP4210894A1
公开(公告)日：2023-07-19
申请号：EP21765891.3
申请日：2021-08-18
发明人： KLEINER, Jonas , FLAMM, Daniel , RAVE, Henning
IPC分类号： B23K26/08 , B23K26/067 , B23K26/06 , B23K26/0622 , B23K26/364 , B23K103/00
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38.发明授权
公开(公告)号：EP4045446B1
公开(公告)日：2023-07-05
申请号：EP20799983.0
申请日：2020-10-12
发明人： VOGT, Peter , STROBEL, Toni , PAGEL, René , KLOWSKY, Uwe , RÜCKER, Steffen , KÖNIG, Christian , WITTER, Marcus
IPC分类号： B65H23/04 , B23K26/082 , B23K26/08 , B65H23/182 , B65H23/188 , B65H23/195 , G03F7/20 , H05K3/00 , B23K26/00 , B23K26/03 , B23K26/352 , B23K26/70
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39.发明公开
公开(公告)号：EP4200921A1
公开(公告)日：2023-06-28
申请号：EP21787217.5
申请日：2021-09-14
申请人： Enovix Corporation
发明人： RUST, Harrold J. , RAMASUBRAMANIAN, Murali , LAHIRI, Ashok , VALDES, Bruno A. , BUCK, Jeffrey Glenn , FORTUNATI, Kim Lester , BUSACCA, Robert S. , VARNI, John F. , WINANS, Joshua David , SARSWAT, Neal , KOBLMILLER, Gunther A. , BEAVEN, Miles E. , MOSS, Jeffery A. , ANDRES, Michael E.
IPC分类号： H01M4/139 , B23K26/0622 , B23K26/08 , B23K26/364 , B23K26/402 , H01M4/04 , H01M10/04 , B23B13/00 , B23K101/16 , B23K101/36 , B23K103/16 , B23K103/18
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公开(公告)号：EP4197683A1
公开(公告)日：2023-06-21
申请号：EP22206312.5
申请日：2022-11-09
申请人： Ricoh Company, Ltd.
IPC分类号： B23K26/03 , B23K26/082 , B23K26/08
摘要： A laser processing apparatus (20) includes: a light emitter (23) to emit laser light; a light scanner (29) to scan a workpiece (21) in a scanning direction with the laser light emitted from the light emitter (23), to process the workpiece (21); and a conveyor (22) to convey the workpiece (21) to a scanning area scanned by the light scanner (29) in a conveying direction (A) orthogonal to the scanning direction, a longitudinal direction of the scanning area is in the scanning direction (A).
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