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1.
公开(公告)号:EP4215308B1
公开(公告)日:2024-07-03
申请号:EP23151080.1
申请日:2023-01-11
IPC分类号: B23K26/38 , B23K26/14 , B23K26/046 , B23K26/066
CPC分类号: B23K26/046 , B23K26/14 , B23K26/38 , B23K26/066
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公开(公告)号:EP4302917A1
公开(公告)日:2024-01-10
申请号:EP22762780.9
申请日:2022-01-12
发明人: YAMAZAKI, Naoya
IPC分类号: B23K26/046
摘要: A control device (21) controls a scanning unit (37) and a drive unit (39) to scan laser light (LW). In addition, the control device (21) controls a focal point adjustment unit (36) and a drive unit (38) to adjust the focal position of the laser light (LW). In a display mode in which a processing subject (W) is irradiated with visible light (LH), the control device (21) controls the scanning unit (37) and the drive unit (39) to scan the visible light (LH). The control device (21) does not change an inter-lens distance of lenses (36a-36b) of the focal point adjustment unit (36).
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公开(公告)号:EP3898062B1
公开(公告)日:2023-12-06
申请号:EP19848985.8
申请日:2019-12-23
IPC分类号: B23K26/046 , B23K26/0622 , B23K26/06 , B23K26/082 , B23K26/08 , B23K26/38 , B23K101/32 , B23K103/00
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4.
公开(公告)号:EP4269016A1
公开(公告)日:2023-11-01
申请号:EP21909881.1
申请日:2021-10-06
IPC分类号: B23K26/00 , B23K26/046
摘要: Laser processing device (100) includes a laser oscillator that generates laser beam (LB), laser head (60) that irradiates a workpiece with laser beam (LB), and manipulator (40) on which laser head (60) is mounted. Manipulator (40) includes robot arm (41), arm tip shaft (J6) provided at a tip of robot arm (41) in a manner rotatable about axis (RA), and connector component (50) that connects arm tip shaft (J6) and laser head (60). Connector component (50) is provided with gauge attachment portion (51a) to which gauge (80) is attached removably. Gauge (80) has a reference point corresponding to the focal position of laser beam (LB).
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5.
公开(公告)号:EP4251364A2
公开(公告)日:2023-10-04
申请号:EP21823225.4
申请日:2021-11-26
发明人: MORGANTE, Eric
IPC分类号: B23K26/00 , B23K26/046 , B23K26/352 , B23K26/362 , B23K26/402 , B23K26/70 , C03C17/36 , B23K101/18 , B23K103/16 , B23K103/00
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公开(公告)号:EP3525975B1
公开(公告)日:2023-08-16
申请号:EP17787903.8
申请日:2017-10-10
IPC分类号: B23K26/03 , B23K26/046 , B23K26/38
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公开(公告)号:EP4201576A1
公开(公告)日:2023-06-28
申请号:EP21217133.4
申请日:2021-12-22
申请人: Bystronic Laser AG
发明人: WORATZ, Colin
IPC分类号: B23K26/046 , B23K26/142 , B23K26/14 , B23K26/40 , B23K26/70 , B23K26/38 , B23K103/04
摘要: A laser cutting method of relatively thick workpieces (208), especially of steel, with an oxygen containing cutting gas is more efficient compared to the prior art if the focal position is substantially above the workpiece (208), e.g. at least 1 mm above the workpiece (208), for example at least 5 mm, at least 8 mm or at least 10 mm above the workpiece. An especially efficient process results if additionally the nozzle (121) from which the cutting gas is emitted is close to the workpiece (208), e.g. at a distance of at most 1 mm.
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公开(公告)号:EP4201575A1
公开(公告)日:2023-06-28
申请号:EP22206384.4
申请日:2022-11-09
IPC分类号: B23K26/03 , B23K26/046 , B23K26/06 , B23K26/082 , B23K26/08 , B23K26/16 , B23K26/36 , B23K26/53 , B23K26/70 , B23K37/02 , B23K103/00 , C03C23/00 , B23K26/402
摘要: Die vorliegende Erfindung betrifft eine mobile Laservorrichtung (1) zum Bearbeiten von in einem Objekt, vorzugsweise einem Fahrzeug, bevorzugt einem Zug, oder einem Bauwerk, bevorzugt einem Gebäude, eingebauten Glastafeln (6) und die Verwendung der Laservorrichtung (1) und ein Verfahren zur Bearbeitung einer Glastafel (6).
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9.
公开(公告)号:EP4144474A1
公开(公告)日:2023-03-08
申请号:EP21194733.8
申请日:2021-09-03
申请人: Bystronic Laser AG
发明人: HELD, Michael , HAAS, Titus , LÜDI, Andreas , SCHEIDIGER, Simon , INGOLD, Elio
IPC分类号: B23K26/046 , B23K26/06 , B23K26/364 , B23K26/38 , B23K26/382
摘要: Die vorliegende Erfindung betrifft ein Anpassungsmodul (AM) zur dynamischen Anpassung eines Fokusdurchmessers eines Laserstrahls eines Laserbearbeitungskopfes einer Laserschneidmaschine zum Bearbeiten von, insbesondere flächigen oder profilierten oder rohrförmigen, Werkstücken, das zur Ausführung des Verfahrens gemäß einem der vorangehenden Patentansprüche ausgebildet ist, mit einem Prüfbaustein (AM1), der zum Prüfen ausgebildet ist, ob ein vorkonfigurierbares Triggerereignis vorliegt, und mit einem Prozessor (AM2), der - falls der Prüfbaustein ein vorkonfigurierbares Triggerereignis erkannt hat- zum Ausführen einer Anpassungsfunktion bestimmt ist zur Anpassung des Fokusdurchmessers während eines Bearbeitungsvorganges entlang einer Bahn, die der Laserbearbeitungskopf abfährt.
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公开(公告)号:EP4130834A1
公开(公告)日:2023-02-08
申请号:EP21779025.2
申请日:2021-01-26
IPC分类号: G02B7/04 , B23K26/046 , B23K26/082
摘要: A focal length adjusting device 12 is provided with: a retention unit 70 for retaining a first lens 31; a guide unit 60 for supporting the retention unit 70 so as to allow movement along an optical axis Lx of laser light Lw; a stepper motor 80 that has a shaft body 81 and is arranged so that the central axis O1 of the shaft body 81 is orthogonal to the optical axis Lx; and a conversion unit 90 that is interposed between the shaft body 81 and the retention unit 70 and converts rotational movement of the shaft body 81 into linear movement of the retention unit 70. The conversion unit 90 comprises, between itself and the retention unit 70, a coupling unit 92 that transmits kinetic force from the conversion unit 90 to the retention unit 70 in a direction parallel to the optical axis Lx but does not transmit same in a direction parallel to the central axis O1 of the shaft body 81.
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