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公开(公告)号:EP3597346B1
公开(公告)日:2024-10-09
申请号:EP18767970.9
申请日:2018-03-16
IPC分类号: B23K9/095 , B23K26/03 , G01B11/00 , G01B11/24 , G01B11/14 , G01B5/00 , G01B11/06 , G01B21/04
CPC分类号: B23K9/095 , B23K31/00 , G01B11/24 , B23K9/0956 , B23K26/032 , G01B11/0608 , G01B21/047 , G01B5/0014
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公开(公告)号:EP4433251A1
公开(公告)日:2024-09-25
申请号:EP22826522.9
申请日:2022-11-16
申请人: Lincoln Global, Inc.
CPC分类号: B23K26/0096 , B23K26/1464 , B23K26/03 , B23K26/21 , B23K26/702 , B23K26/037 , B23K26/706
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公开(公告)号:EP3858535B1
公开(公告)日:2024-09-04
申请号:EP19910656.8
申请日:2019-07-19
IPC分类号: B23K26/362 , B23K26/38 , B23K26/03 , B23K26/36
CPC分类号: B23K26/38 , B23K26/032 , B23K26/36
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公开(公告)号:EP3819065B1
公开(公告)日:2024-08-28
申请号:EP19830873.6
申请日:2019-07-01
IPC分类号: B23K26/00 , B23K26/064 , B23K26/53 , H01L21/301 , B23K26/03 , C03B33/095 , B23K103/00
CPC分类号: B23K26/064 , B23K2103/5420180801 , B23K2103/5620180801 , B23K26/53 , B23K26/032 , C03B33/0222 , C03B33/076
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公开(公告)号:EP3930954B1
公开(公告)日:2024-08-14
申请号:EP20711058.6
申请日:2020-02-28
IPC分类号: B23K26/10 , B23K26/352 , B23K26/70 , B23K26/03 , B23K37/047
CPC分类号: B23K26/106 , B23K26/3584 , B23K26/032 , B23K37/0276 , B23K26/14
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公开(公告)号:EP4406686A1
公开(公告)日:2024-07-31
申请号:EP22876849.5
申请日:2022-09-28
发明人: KIM, Jin Ha , CHOI, Byoung Chan , KANG, Ki Seok
IPC分类号: B23K26/03 , B23K26/042 , B23K26/062 , B23K26/046 , B23K26/06
CPC分类号: B23K26/03 , B23K26/042 , B23K26/062 , B23K26/046 , B23K26/06
摘要: The present invention relates to a laser processing apparatus comprising an intelligent optical head, and provides a laser processing apparatus comprising: a laser generation unit; a beam conversion apparatus for adjusting the size or shape of a laser beam generated by the laser generation unit; a beam adjustment unit for adjusting the focal position of the laser beam comprising passed through the beam conversion apparatus; a heat distribution measurement unit for measuring at least one of the surface temperature and the melting temperature of a processing target; a control unit for adjusting or controlling the intensity of the laser beam at the measured temperature of the processing target; and a beam focusing unit for focusing and transmitting the laser beam comprising passed through the beam conversion apparatus to the processing target, and a method including same.
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7.
公开(公告)号:EP4406685A1
公开(公告)日:2024-07-31
申请号:EP22872635.2
申请日:2022-08-24
发明人: HASHIMOTO, Shogo
摘要: [Problem] To reduce the length of time required to determine the position of a workpiece.
[Means to Solve Problem] The present invention includes: an imager 30; a driver 80 that causes the imager 30 to move in a relative manner, with respect to a workpiece W having a planar face Wa, in a planar direction parallel to the planar face Wa; a controller 41 that controls the driver 80 so that the imager 30 moves along a prescribed trajectory T that passes through a plurality of locations in a boundary portion Wb in the planar face Wa in a plan view; a memory storage 42 that stores image information captured by the imager 30 while the imager 30 moves along the prescribed trajectory T, and coordinate information of the imager 30 at a time of capturing each image information; a position determiner 43 that determines the position of the workpiece W in the planar direction corresponding to the boundary portion Wb, on the basis of the image information and the coordinate information stored in the memory storage 42; and an offset determiner 44 that determines an offset of the workpiece W from a reference position S, on the basis of a determination result from the position determiner 43.-
公开(公告)号:EP4403293A2
公开(公告)日:2024-07-24
申请号:EP24177160.9
申请日:2019-12-27
申请人: Wolfspeed, Inc.
发明人: DONOFRIO, Matthew , EDMOND, John , GOLAKIA, Harshad , MAYER, Eric
IPC分类号: B23K26/03
CPC分类号: B28D5/0064 , B28D5/0005 , B23K26/53 , H01L22/12 , B23K2103/5620180801 , C30B29/36 , C30B33/06 , B23K26/032 , B23K2101/4020180801 , H01L21/02035
摘要: A material processing apparatus including a laser processing station (425) configured to process a substrate (430) of crystalline material. The laser processing station (425) includes a laser configured to form subsurface laser damage (434) regions within an interior of the substrate (430), at least one translation stage configured to effect relative movement between the laser and the substrate (430), and a diffuse light source (438) configured to illuminate a top surface (433) of the substrate (430). The laser processing station (425) also includes an imaging device (442) configured to generate an image of the top surface (433) of the substrate (430). The apparatus also includes a computing device configured to analyze the image to identify a condition indicative of presence of uncracked regions in the interior of the substrate (430).
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公开(公告)号:EP4377040A1
公开(公告)日:2024-06-05
申请号:EP22744443.7
申请日:2022-07-05
CPC分类号: B23K9/1274 , B23K26/032 , B23K26/034 , B23K26/044 , B23K37/006 , B23K9/321 , B23K31/125
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10.
公开(公告)号:EP4370268A1
公开(公告)日:2024-05-22
申请号:EP22751779.4
申请日:2022-07-07
申请人: AddUp
发明人: DENAVIT, Franck
IPC分类号: B22F10/28 , B22F10/31 , B33Y10/00 , B33Y50/02 , B22F10/85 , B23K26/03 , B23K26/342 , B29C64/153 , B29C64/393 , B29C64/268 , G06T7/00
CPC分类号: B22F10/28 , B22F10/31 , B33Y10/00 , B33Y50/02 , B23K26/034 , B23K26/342 , B29C64/153 , B29C64/393 , B23K26/032 , B33Y30/00 , B22F12/44 , B22F12/90 , B22F2999/0020130101 , B29C64/268 , Y02P10/25
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