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公开(公告)号：EP1469701B1
公开(公告)日：2008-04-16
申请号：EP04076015.9
申请日：2001-08-10
IPC分类号： H04R19/00
CPC分类号： H04R19/005 , H04R31/00 , H04R31/006
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42.发明公开Miniature silicon condenser microphone and method for producing same 有权Miniatursiliciumkondensatormikrofon und Herstellungsverfahrendafür
公开(公告)号：EP1821570A1
公开(公告)日：2007-08-22
申请号：EP07002957.4
申请日：2001-10-22
CPC分类号： B81B7/0064 , B81B2201/0257 , H04R19/016
摘要： A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, a substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.
摘要翻译： 公开了一种硅电容麦克风封装。 硅电容麦克风封装包括传感器单元，基板和盖。 基板包括其中形成有凹部的上表面。 换能器单元附接到基板的上表面并且与凹部的至少一部分重叠，其中换能器单元的后部体积形成在换能器单元和基板之间。 盖子放置在换能器单元上方并包括孔。
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43.发明授权Electret microphone buffer circuit with significantly enhanced power supply rejection 有权与电源的显著增加噪声抑制驻极体传声器缓冲电路
公开(公告)号：EP1359664B1
公开(公告)日：2007-06-13
申请号：EP03252400.1
申请日：2003-04-15
发明人： Boor, Steven E.
CPC分类号： H03F3/185 , H03F3/505 , H03F2200/03 , H04R3/00
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公开(公告)号：EP1264514B1
公开(公告)日：2006-09-06
申请号：EP01918730.1
申请日：2001-03-15
IPC分类号： H04R25/00
CPC分类号： H04R25/652 , H04R25/604
摘要： A receiver assembly for a hearing aid device, the assembly comprising a case having an inner cavity, one or more mounts disposed within the inner cavity of the case, and a receiver disposed within the inner cavity of the case and connected to the mounts such that the receiver is suspended within the inner cavity of the case. The mounts dampen any vibration transmission from the receiver to the case and from the case to the receiver. Most significantly, acoustical noise from the receiver and any resulting distortion, feedback, and/or interference within the other components of the hearing aid device are substantially eliminated.
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公开(公告)号：EP1600037A1
公开(公告)日：2005-11-30
申请号：EP03773315.1
申请日：2003-10-24
IPC分类号： H04R19/01
CPC分类号： H04R31/006 , H01G7/02 , H04R19/016 , H04R25/00
摘要： A condenser microphone having a housing (12), a diaphragm assembly (14) and backplate (16) located within the housing. A spacer (18) isolates the diaphragm assembly from the housing and spaces the diaphragm assembly from the backplate. The spacer has a first portion disposed between the backplate and the diaphragm assembly, and a second portion disposed between the diaphragm assembly and the wall of the housing. A conductive member (20) electrically connects the backplate to a ground.
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公开(公告)号：EP1505853A3
公开(公告)日：2005-10-05
申请号：EP04253206.9
申请日：2004-05-28
CPC分类号： H04R19/04 , H04R1/38 , H04R19/016
摘要： An electret condenser microphone includes a housing (101), a diaphragm (108a) disposed within the housing (101), first and second sound inlet ports and an acoustic resistive material (118) disposed within the housing and in the acoustic path between the second inlet port and the diaphragm (108a). The acoustic resistive may further electrically couple a backplate (112) coupled to the diaphragm (108a) to an amplifier disposed within the housing (101).
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公开(公告)号：EP1469701A2
公开(公告)日：2004-10-20
申请号：EP04076015.9
申请日：2001-08-10
IPC分类号： H04R19/00
CPC分类号： H04R19/005 , H04R31/00 , H04R31/006
摘要： Multiple embodiments of solid state micro-structures, such as a condenser microphone, are disclosed. According to one embodiment, the transducer includes a fixed perforated member, a freely movable diaphragm spaced from the perforated member; a support ring in the perforated member maintaining the proper spacing between the diaphragm and the perforated member near the perimeter; and compliant suspension springs allowing the diaphragm to rest freely on the support ring and yet mechanically decouples the diaphragm from the perforated member. According to another embodiment, a raised micro-structure is disclosed for use in a silicon based device. The raised micro-structure comprises a generally planar film having a ribbed sidewall supporting the film.
摘要翻译： 公开了用于硅基器件的凸起的微结构。 凸起的微结构包括具有支撑薄膜的肋状侧壁的大致平面的薄膜。
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公开(公告)号：EP1331835A3
公开(公告)日：2004-10-20
申请号：EP02258969.1
申请日：2002-12-24
发明人： Boor, Steven E.
IPC分类号： H04R25/00
CPC分类号： H04R25/50
摘要： A hearing aid for converting input acoustical energy into an electrical signal, processing the signal and converting the processed electrical signal into acoustical energy is disclosed. The hearing aid includes a digitally programmable gain amplifier. The digitally programmable gain amplifier comprises circuitry for decoding a digital control input signal (referred to as the serial data input), and based upon the digital control signal it comprises a means for changing the amplifier gain.
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公开(公告)号：EP1093685A4
公开(公告)日：2004-09-01
申请号：EP99955370
申请日：1999-05-27
发明人： PEDERSEN MICHAEL , LOEPPERT PETER
CPC分类号： H04R19/005 , H02N1/006 , H04R19/04
摘要： A solid state transducer (9) is disclosed. The transducer comprises a micromachined electrostatic actuator (16) formed of silicon, a support brace (10) disposed about the actuator, and a membrane (14) coupled to the support brace. The actuator is operatively coupled to the membrane. The transducer may be either a receiver or a microphone.
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公开(公告)号：EP1356706A2
公开(公告)日：2003-10-29
申请号：EP01975662.6
申请日：2001-09-28
IPC分类号： H04R3/00
CPC分类号： H04R25/407 , H04R1/406 , H04R3/005 , H04R25/405 , H04R29/006 , H04R2201/403
摘要： A directional microphone system is disclosed, which comprises circuitry for low pass filtering a first order signal, and circuitry for high pass filtering a second order signal. The system further comprises circuitry for summing the low pass filtered first order signal and the high pass filtered second order signal. A method of determining whether a plurality of microphones have sufficiently matched frequency response characteristics to be used in a multi-order directional microphone array is also disclosed. For a microphone array having at least three microphones, wherein one of the microphones is disposed between the other of the microphones, a method of determining the arrangement of the microphones in the array is also disclosed.
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