公开(公告)号：EP2213107A1

公开(公告)日：2010-08-04

申请号：EP08727849.5

申请日：2008-01-17

申请人： Knowles Electronics, LLC

发明人： COLLINS, James, Steven

IPC分类号： H04R19/01 ,  H04R31/00

CPC分类号： H04R19/016 ,  H04R31/003 ,  H04R31/006

摘要： A microphone for transducing between an acoustical signal and an electrical signal, comprises a housing and a motor assembly disposed within the housing. The motor assembly includes a backplate and a diaphragm attached to the backplate via a spacer. The diaphragm comprising a ring and a film, the diaphragm vibrates in response to an acoustical signal, wherein the film is formed from an amorphous or semi-crystallized polyphenylene sulfide (PPS) and a metal layer is attached to the film. The film is completely covered by the metal layer and a portion of the metal is removed using a direct energy source, leaving a portion of the film directly exposed resulting in reducing the parasitic capacitances between the backplate and the diaphragm and increasing the sensitivity. Alternatively, the film is partially covered by the metal layer. At least one opening is formed on the microphone and acoustically/electrically coupled to an opening formed on a main printed circuit board of an electronic device, defining a surface mountable microphone.

公开(公告)号：EP1254586A2

公开(公告)日：2002-11-06

申请号：EP01906974.9

申请日：2001-02-05

申请人： Knowles Electronics, LLC

发明人： COLLINS, James, Steven

IPC分类号： H04R19/01

CPC分类号： H04R19/01 ,  H04R25/00 ,  Y10T29/49005 ,  Y10T29/49011 ,  Y10T29/4902 ,  Y10T29/4913 ,  Y10T29/49155

摘要： An acoustical transducer including a case and a support member, diaphragm, and backplate located within the case. The diaphragm is connected to the support member and is capable of vibrating. The backplate is mounted to the support member and is spaced a distance from the diaphragm to provide a gap between the backplate and the diaphragm. An electret material on the backplate cooperates with the diaphragm to develop a signal which is transmitted to an amplifier. By having an assembly wherein the backplate does not contact the diaphragm, the capacitance of the assembly is reduced.

公开(公告)号：EP1728408A1

公开(公告)日：2006-12-06

申请号：EP04821918.2

申请日：2004-03-30

申请人： Knowles Electronics, LLC

发明人： COLLINS, James, Steven

IPC分类号： H04R1/04

CPC分类号： H04R1/04 ,  H04R25/00 ,  H04R2225/49

摘要： A microphone assembly include a microphone housing unit having a cover (104) and a base (106). The microphone assembly further includes a preamplifier circuit assembly (122) attached to the base (106) and protected by the cover (104). The protected preamplifier circuit assembly (122) has at least one terminal (120) unprotected by the cover. A radio frequency interference suppression device can be electrically coupled to the preamplifier circuit and includes at least one internal ground (148) electrically coupled to the at least one terminal (162). The at least one internal ground (148) provides a ground path between the cover (104) and the base (106).

公开(公告)号：EP1254586B1

公开(公告)日：2009-11-11

申请号：EP01906974.9

申请日：2001-02-05

申请人： Knowles Electronics, LLC

发明人： COLLINS, James, Steven

IPC分类号： H04R19/01

CPC分类号： H04R19/01 ,  H04R25/00 ,  Y10T29/49005 ,  Y10T29/49011 ,  Y10T29/4902 ,  Y10T29/4913 ,  Y10T29/49155

摘要： An acoustical transducer including a case and a support member, diaphragm, and backplate located within the case. The diaphragm is connected to the support member and is capable of vibrating. The backplate is mounted to the support member and is spaced a distance from the diaphragm to provide a gap between the backplate and the diaphragm. An electret material on the backplate cooperates with the diaphragm to develop a signal which is transmitted to an amplifier. By having an assembly wherein the backplate does not contact the diaphragm, the capacitance of the assembly is reduced.

公开(公告)号：EP1600037A1

公开(公告)日：2005-11-30

申请号：EP03773315.1

申请日：2003-10-24

申请人： Knowles Electronics, LLC

发明人： COLLINS, James, Steven

IPC分类号： H04R19/01

CPC分类号： H04R31/006 ,  H01G7/02 ,  H04R19/016 ,  H04R25/00

摘要： A condenser microphone having a housing (12), a diaphragm assembly (14) and backplate (16) located within the housing. A spacer (18) isolates the diaphragm assembly from the housing and spaces the diaphragm assembly from the backplate. The spacer has a first portion disposed between the backplate and the diaphragm assembly, and a second portion disposed between the diaphragm assembly and the wall of the housing. A conductive member (20) electrically connects the backplate to a ground.