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109526 条记录 (耗时 0.045 秒)

    Integrated circuit device with embedded programmable logic
    46.
    发明公开
    Integrated circuit device with embedded programmable logic 审中-公开

    公开(公告)号：EP4362335A3

    公开(公告)日：2024-10-23

    申请号：EP24164462.4

    申请日：2014-10-02

    申请人： Altera Corporation

    发明人： Rahman, Arifur ,  Friebe, Bernhard

    IPC分类号： H03K19/17796

    摘要： Systems and methods are provided to enhance the functionality of an integrated circuit. Such an integrated circuit may include a primary circuitry and an embedded programmable logic programmable to adjust the functionality of the primary circuitry. Specifically, the embedded programmable logic may be programmed to adjust the functionality of the primary circuitry to complement and/or support the functionality of another integrated circuit. Accordingly, the embedded programmable logic may be programmed with functions such as data/address manipulation functions, configuration/testing functions, computational functions, or the like.

    SOLID STATE RELAY MODULE
    49.
    发明公开
    SOLID STATE RELAY MODULE 审中-公开

    公开(公告)号：EP4447319A1

    公开(公告)日：2024-10-16

    申请号：EP24170058.2

    申请日：2024-04-12

    申请人： Aptiv Technologies AG

    发明人： MLECZKO, Jamie ,  NG, Cheuk ,  LI, Yu

    IPC分类号： H03K17/082 ,  H03K17/687 ,  H01H9/52 ,  H05K7/20 ,  H01L23/36

    摘要： A solid state relay (SSR) module (100) may include a first solid state switch (206) configured to establish and break an electrical connection between an input terminal (208) and an output terminal (214). The module (100) includes an electronic controller (220) configured to turn the first solid state switch (206) on or off and a top cover (202) formed of an electrically insulative thermoplastic material. The power circuit board (204) is disposed within a cavity in the top cover (202). The top cover (210) defines openings (302) through which the input and output terminals extend (208, 214). The module (100) also includes a bottom cover (228) formed of a thermally conducive material in thermal communication with the first solid state switch (206), a compliant thermal interface paste (604) disposed between the bottom cover (228) and the first solid state switch (206), and a resilient thermal interface pad (608) attached to the bottom cover (228) by an adhesive layer (614) on the resilient thermal interface pad (608).