METHOD AND APPARATUS FOR CONTACTLESS TREATMENT OF A SEMICONDUCTOR SUBSTRATE IN WAFER FORM
    51.
    发明公开
    METHOD AND APPARATUS FOR CONTACTLESS TREATMENT OF A SEMICONDUCTOR SUBSTRATE IN WAFER FORM 失效
    方法和设备车轮形半导体基板的非接触处理

    公开(公告)号:EP0910868A1

    公开(公告)日:1999-04-28

    申请号:EP97929595.0

    申请日:1997-07-08

    IPC分类号: H01L21

    摘要: Such a treatment comprises heating the semiconductor substrate. To this end it is proposed to position the semiconductor substrate between two side sections of an enclosing apparatus and to keep the semiconductor substrate floating between said two side sections by introducing gas streams. It has been found that it is particularly effective to heat the substrate by means of at least one of said side sections. Using subject method and apparatus it is also possible to allow one of the gas streams to function as process gas, it being possible more particularly to supply process gas from one side section at a relatively low temperature to the semiconductor substrate, whilst the other side of the semiconductor substrate is subjected to a relatively high temperature originating from the opposite side section.

    APPARATUS FOR DOUBLE FLOATING WAFER TRANSPORT AND PROCESSING
    55.
    发明公开
    APPARATUS FOR DOUBLE FLOATING WAFER TRANSPORT AND PROCESSING 失效
    设备运输和半导体薄板的双面平衡病症。

    公开(公告)号:EP0182855A1

    公开(公告)日:1986-06-04

    申请号:EP85902682.0

    申请日:1985-06-03

    申请人: BOK, Edward

    发明人: BOK, Edward

    IPC分类号: B65G51 H01L21

    CPC分类号: H01L21/67784 B65G51/03

    摘要: Appareil (10) dans le passage de tunnel (12) duquel prennent place le transport et le traitement de tranches de silicium (14) dans une condition de flottaison double et où lesdites tranches (14) sont mises simultanément en rotation par des jets de fluide d'entraînement (16).

    METHOD AND APPARATUS FOR APPLYING A COATING ON A SUBSTRATE
    57.
    发明公开
    METHOD AND APPARATUS FOR APPLYING A COATING ON A SUBSTRATE 失效
    方法和设备用于将涂料涂布在基材。

    公开(公告)号:EP0101704A1

    公开(公告)日:1984-03-07

    申请号:EP83900739.0

    申请日:1983-02-21

    申请人: BOK, Edward

    发明人: BOK, Edward

    IPC分类号: B05C5 B05D1 H01L21

    CPC分类号: H01L21/67784 B05C5/0254

    摘要: Procédé et dispositif améliorés d'application d'un revêtement (24) sur le côté d'un substrat (14), se déplaçant entre des milieux faisant coussin au travers du passage (12) d'une section de cabine (10), en établissant et en maintenant une écluse de revêtement (34) dans la direction de déplacement du substrat (14) au travers du passage (12) au moins dans la section du passage (28) en face du canal d'alimentation en revêtement (22), ce qui empêche le revêtement en excès de s'échapper de cette section de passage (28) dans le sens de déplacement du substrat (14).

    TRANSPORT PATH CORRECTION TECHNIQUES AND RELATED SYSTEMS, METHODS AND DEVICES

    公开(公告)号:EP4378697A2

    公开(公告)日:2024-06-05

    申请号:EP24157429.2

    申请日:2017-07-06

    申请人: Kateeva, Inc.

    IPC分类号: B41J3/407

    摘要: A printer deposits material onto a substrate as part of a manufacturing process for an electronic product. At least one mechanical component experiences mechanical error, which is mitigated using transducers that equalize position of a transported thing, e.g., to provide an "ideal" conveyance path; a substrate conveyance system and/or a printhead conveyance system can each use transducers in this manner to improve precise droplet placement. In one embodiment, errors are measured in advance, with corrections being "played back" during production runs to mitigate repeatable transport path error. In a still more detailed embodiment, the transducers can be predicated on voice coils, which cooperate with a floatation table and floating, mechanical pivot assembly to provide frictionless, but mechanically-supported error correction.

    DYNAMIC FLUID VALVE AND METHOD FOR ESTABLISHING THE SAME
    60.
    发明授权
    DYNAMIC FLUID VALVE AND METHOD FOR ESTABLISHING THE SAME 有权
    动态流体阀及其建立方法

    公开(公告)号:EP2531634B1

    公开(公告)日:2018-04-11

    申请号:EP11703282.1

    申请日:2011-01-31

    摘要: A method, comprising: —providing a process space atmosphere at a process space atmosphere pressure; —providing an exterior atmosphere at an exterior atmosphere pressure that is different from the process space atmosphere pressure; —providing a passage via which the exterior atmosphere is in open communication with the process space atmosphere, and via which substrates are exchangeable between the exterior atmosphere and the process space atmosphere; —injecting an exchange fluid into the passage at at least one exchange fluid injection point, so as to effect a flow of exchange fluid that extends through at least a part of the passage, wherein said flow is directed towards —the exterior in case the exterior atmosphere pressure is greater than the process space atmosphere pressure; or —the process space in case the exterior atmosphere pressure is smaller than the process space atmosphere pressure.