公开(公告)号：EP4419727A1

公开(公告)日：2024-08-28

申请号：EP22802558.1

申请日：2022-10-11

申请人： ThyssenKrupp Steel Europe AG

发明人： BIENHOLZ, Dr. Stefan

IPC分类号： C23C14/16 ,  C23C14/02 ,  C23C14/24 ,  C23C14/54 ,  C23C14/56 ,  C23C2/00

CPC分类号： C23C14/16 ,  C23C14/02 ,  C23C14/24 ,  C23C14/541 ,  C23C14/568

公开(公告)号：EP3355338A1

公开(公告)日：2018-08-01

申请号：EP17207131.8

申请日：2017-12-13

申请人： Mikhailov, Sergueï

发明人： Mikhailov, Sergueï

IPC分类号： H01J37/32 ,  C23C14/28 ,  C23C14/32 ,  H01J37/34

CPC分类号： H01J37/32055 ,  C23C14/568 ,  H01J37/34

摘要： An apparatus for coating parts, comprising a deposition chamber (1) and a plurality of coating equipment (2, 3) for simultaneously or successively providing coating materials to said deposition chamber, wherein at least one of said coating equipment (2) is a metal filtered arc ion source, at least one other of said coating equipment (3) is a laser ablation source, and at least two of said coating equipment are removably connected to said deposition chamber via connecting flanges (10). At least two of said flanges are identical, so that one said coating equipment (2, 3) can be connected via different flanges to said deposition chamber.

公开(公告)号：EP1451120B1

公开(公告)日：2017-10-11

申请号：EP02784566.8

申请日：2002-11-25

申请人： GUARDIAN INDUSTRIES CORP.

发明人： WANG, Hong

IPC分类号： C03C17/36 ,  C03C17/34 ,  C23C14/00

CPC分类号： C03C17/3618 ,  C03C17/3423 ,  C03C17/3435 ,  C03C17/36 ,  C03C17/3626 ,  C03C17/3649 ,  C03C17/366 ,  C03C17/3681 ,  C03C17/3694 ,  C03C2217/78 ,  C03C2217/91 ,  C23C14/568 ,  Y10T428/12847 ,  Y10T428/12944

公开(公告)号：EP2414890B1

公开(公告)日：2017-10-04

申请号：EP10764872.7

申请日：2010-03-31

申请人： View, Inc.

发明人： KOZLOWSKI, Mark ,  KURMAN, Eric ,  WANG, Zhongchun ,  SCOBEY, Mike ,  DIXON, Jeremy ,  PRADHAN, Anshu ,  ROZBICKI, Robert

IPC分类号： G02F1/15

CPC分类号： G02F1/1523 ,  B05D5/06 ,  B23K20/10 ,  C03C17/3417 ,  C03C2217/94 ,  C23C10/28 ,  C23C14/021 ,  C23C14/022 ,  C23C14/024 ,  C23C14/046 ,  C23C14/08 ,  C23C14/083 ,  C23C14/085 ,  C23C14/086 ,  C23C14/14 ,  C23C14/185 ,  C23C14/3407 ,  C23C14/568 ,  C23C14/58 ,  C23C14/5806 ,  C23C14/5853 ,  G02F1/15 ,  G02F1/153 ,  G02F1/1533 ,  G02F1/155

公开(公告)号：EP3196693A3

公开(公告)日：2017-08-16

申请号：EP16200985.6

申请日：2010-03-31

申请人： View, Inc.

发明人： WANG, Zhongchun ,  KURMAN, Eric ,  KOZLOWSKI, Mark ,  SCOBEY, Mike ,  DIXON, Jeremy ,  PRADHAN, Anshu

IPC分类号： G02F1/15

CPC分类号： G02F1/1523 ,  B05D5/06 ,  B23K20/10 ,  C03C17/3417 ,  C03C2217/94 ,  C23C10/28 ,  C23C14/021 ,  C23C14/022 ,  C23C14/024 ,  C23C14/046 ,  C23C14/08 ,  C23C14/083 ,  C23C14/085 ,  C23C14/086 ,  C23C14/14 ,  C23C14/185 ,  C23C14/3407 ,  C23C14/568 ,  C23C14/58 ,  C23C14/5806 ,  C23C14/5853 ,  G02F1/15 ,  G02F1/153 ,  G02F1/1533 ,  G02F1/155

摘要： A method of fabricating an electrochromic device on a substrate, the method comprising: (a) depositing an electrochromic layer; (b) lithiating the electrochromic layer; (c) depositing an ion conducting layer; (d) depositing a counter electrode layer for reversibly exchanging lithium ions with the electrochromic layer during operation of the electrochromic window; and (e) lithiating the counter electrode layer, wherein (a)-(e) produces a stack on the substrate in which the ion conducting layer separates the electrochromic layer and the counter electrode layer and wherein during lithium deposition, the substrate is in a substantially vertical orientation.

摘要翻译： 一种在基底上制造电致变色器件的方法，所述方法包括：（a）沉积电致变色层; （b）锂化电致变色层; （c）沉积离子传导层; （d）在所述电致变色窗口的操作期间沉积用于可逆地与所述电致变色层交换锂离子的反电极层; （e）锂化反电极层，其中（a） - （e）在基底上产生叠层，其中离子导电层将电致变色层和反电极层分开，并且其中在锂沉积期间，基底处于 基本垂直的方向。

公开(公告)号：EP2703518B1

公开(公告)日：2017-07-12

申请号：EP13169604.9

申请日：2013-05-29

申请人： Samsung Display Co., Ltd.

发明人： Kim, Min Ho ,  Cha, You Min ,  Park, Seuk Hwan

IPC分类号： C23C14/04 ,  C23C14/54 ,  C23C14/52 ,  C23C14/56 ,  C23C14/46 ,  B05C3/20

CPC分类号： B05C3/20 ,  C23C14/042 ,  C23C14/46 ,  C23C14/52 ,  C23C14/542 ,  C23C14/568

摘要： A deposition apparatus includes deposition sources (S1, S2, S3, S4), a deposition chamber (CB), a mask assembly (MA, MA10, MA20, MA30), and a transfer unit (TP). The mask assembly (MA, MA10, MA20, MA30) includes a support member (10), a shutter member (20), and a drive member (30). The support member (10) has a first opening (OP1) configured to allow the deposition materials (M1, M2, M3, M4) to pass through while supporting the base substrate (SUB) on which the deposition materials are deposited. The shutter member (20) is accommodated in the support member (10) and has a second opening (OP2) smaller than the first opening (OP1). The drive member (30) is configured to change a position of the second opening (OP2) with respect to the base substrate (SUB) in accordance with the movement of the mask assembly (MA, MA10, MA20, MA30).

摘要翻译： 沉积设备包括沉积源（S1，S2，S3，S4），沉积室（CB），掩模组件（MA，MA10，MA20，MA30）和转印单元（TP）。 面罩组件（MA，MA10，MA20，MA30）包括支撑构件（10），活门构件（20）和驱动构件（30）。 支撑构件（10）具有第一开口（OP1），该第一开口（OP1）被配置为允许沉积材料（M1，M2，M3，M4）在支撑沉积有沉积材料的基础基板（SUB）的同时穿过。 活门构件20容纳在支撑构件10中并具有比第一开口OP1小的第二开口OP2。 驱动构件（30）构造成根据掩模组件（MA，MA10，MA20，MA30）的移动而改变第二开口（OP2）相对于基础基板（SUB）的位置。

公开(公告)号：EP3159159A1

公开(公告)日：2017-04-26

申请号：EP15810304.4

申请日：2015-06-11

申请人： ULVAC, Inc.

发明人： KOBAYASHI Hiroki ,  HENMI Mitsunori ,  HIROSE Mitsutaka ,  MASHIMA Shinnosuke ,  KIMURA Isao ,  SUU Koukou

IPC分类号： B32B15/00 ,  B41J2/14 ,  C23C14/04 ,  C23C14/06 ,  C23C14/34 ,  H01L41/047 ,  H01L41/29 ,  H01L41/316

CPC分类号： H01L41/083 ,  B32B15/00 ,  B41J2/14 ,  C23C14/04 ,  C23C14/088 ,  C23C14/185 ,  C23C14/34 ,  C23C14/35 ,  C23C14/566 ,  C23C14/568 ,  C23C14/588 ,  H01L41/0471 ,  H01L41/0805 ,  H01L41/29 ,  H01L41/297 ,  H01L41/314 ,  H01L41/316

摘要： A multi-layered film includes a first electroconductive layer, a dielectric layer, and a second electroconductive layer, which are sequentially layered and disposed on a main surface of a substrate. A lower surface of the dielectric layer comes into contact with an upper surface of the first electroconductive layer, an upper surface and an side surface of the dielectric layer is coated with the second electroconductive layer, and an side end of a portion at which the first electroconductive layer directly overlaps the second electroconductive layer is located inside a side end of the substrate on the main surface of the substrate.

摘要翻译： 多层膜包括依次层叠并设置在基板的主表面上的第一导电层，电介质层和第二导电层。 电介质层的下表面与第一导电层的上表面接触，电介质层的上表面和侧表面被第二导电层覆盖，并且第一导电层的第一导电层 与第二导电层直接重叠的导电层位于衬底主表面上的衬底侧端的内侧。

公开(公告)号：EP3031084A4

公开(公告)日：2017-02-22

申请号：EP14833768

申请日：2014-08-06

申请人： FIRST SOLAR INC

发明人： GARABEDIAN RAFFI ,  MALIK ROGER ,  THEIL JEREMY ,  TRIVEDI JIGISH ,  YU MING

IPC分类号： H01L31/0304 ,  C23C16/455 ,  C23C16/54

CPC分类号： H01L31/0304 ,  C23C14/243 ,  C23C14/568 ,  C23C16/22 ,  H01L21/02546 ,  H01L21/02576 ,  H01L21/02579 ,  H01L21/0262 ,  H01L21/64 ,  H01L21/67173 ,  H01L21/6776 ,  H01L31/03046 ,  H01L31/0693 ,  H01L31/18 ,  H01L31/184 ,  H01L2221/67 ,  Y02E10/544 ,  Y02P70/521

公开(公告)号：EP3102715A1

公开(公告)日：2016-12-14

申请号：EP14702599.3

申请日：2014-02-04

申请人： Applied Materials, Inc.

发明人： BANGERT, Stefan ,  SCHÜSSLER, Uwe ,  DIEGUEZ-CAMPO, Jose Manuel ,  HAAS, Dieter

IPC分类号： C23C14/24 ,  C23C14/56 ,  C23C14/04 ,  C23C14/12 ,  B05D3/04 ,  B05D1/02 ,  B05D1/00 ,  H01L51/00 ,  H01L51/56 ,  B65G49/05 ,  C23C14/50 ,  H01L21/67 ,  H01L21/677

CPC分类号： H01L51/56 ,  B05D1/60 ,  C23C14/042 ,  C23C14/12 ,  C23C14/243 ,  C23C14/246 ,  C23C14/505 ,  C23C14/56 ,  C23C14/562 ,  C23C14/564 ,  C23C14/566 ,  C23C14/568 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67271 ,  H01L21/67712 ,  H01L21/67718 ,  H01L21/67727 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/6776 ,  H01L51/001 ,  H01L51/0011

摘要： A system for depositing one or more layers, particularly layers including organic materials therein, is described. The system includes a load lock chamber for loading a substrate to be processed, a transfer chamber for transporting the substrate, a vacuum swing module provided between the load lock chamber and the transfer chamber, at least one deposition apparatus for depositing material in a vacuum chamber of the at least one deposition chamber, wherein the at least one deposition apparatus is connected to the transfer chamber; a further load lock chamber for unloading the substrate that has been processed, a further transfer chamber for transporting the substrate, a further vacuum swing module provided between the further load lock chamber and the further transfer chamber, and a carrier return track from the further vacuum swing module to the vacuum swing module, wherein the carrier return track is configured to transport the carrier under vacuum conditions and/or under a controlled inert atmosphere.

摘要翻译： 一种用于沉积一个或多个层，特别是层在其中包括有机材料，系统被描述。 该系统包括将被处理用于装载基板的负载锁定室，传送室，用于搬运基板，负载锁定腔室和传送腔室之间提供了一种真空变压模块，至少一个沉积设备用于在真空室中淀积材料 所述至少一个沉积室中，worin所述至少一个沉积设备被连接到传输室; 用于卸载衬底的再负载锁定腔室也已被处理，A进一步传送室用于输送基板，另外的负载锁定腔室和进一步传送室之间提供另外的真空变压模块，并从另外的真空的载波返回轨道 摆动模块到真空变压模块，worin载体返回轨道被配置为传送和/或受控的惰性气氛下在真空条件下的载体。

公开(公告)号：EP3097220A1

公开(公告)日：2016-11-30

申请号：EP14703296.5

申请日：2014-01-22

申请人： Applied Materials, Inc.

发明人： SAUER, Andreas ,  RIES, Florian ,  DEPPISCH, Thomas

IPC分类号： C23C14/50 ,  C23C14/56 ,  C23C16/54

CPC分类号： C23C14/562 ,  C23C14/24 ,  C23C14/34 ,  C23C14/50 ,  C23C14/541 ,  C23C14/568 ,  C23C16/463 ,  C23C16/505 ,  C23C16/52 ,  C23C16/545

摘要： A processing apparatus for processing a flexible substrate in a vacuum chamber is described. The processing apparatus includes a processing drum for processing the flexible substrate while being guided on the processing drum, a roller arrangement having one or more rollers configured to contact the flexible substrate along a portion of one or more circumferences of the one or more rollers before the flexible substrate is guided on the processing drum, wherein the combined length of contact along one or more portions of the one or more circumferences of the one or more rollers is 270 mm or above, and wherein an individual length of contact along each of the one or more portions of the one or more circumferences of the one or more rollers is 500 mm or below, and a temperature adjustment element adjusting the temperature of the one or more rollers.