摘要:
Grinding wheel for a floor grinding machine, comprising a metal wheel (1) with a first and a second flat surface. Diamond-containing grinding elements (11, 12) are arranged on the first flat surface. Grinding elements (11, 12), preferably diamond-containing, are also arranged on the second flat surface of the wheel (1).
摘要:
A grinding wheel 10 comprises a disk core 11 and a grinding stone 20 surrounding the core 11. The grinding stone 20 includes a first abrasive portion 30 and a second abrasive portion 40. The first abrasive portion forms a circumferential surface of the grinding stone 20 and has small grains. The second abrasive portion 40 forms at least one lateral surface of the grinding stone 20 and has larger grains than the first abrasive portion 30.
摘要:
Eine Schrupp-Schleifscheibe (1) weist mindestens zwei Schichten (16, 17) von gebundenem Schleifkorn (11) auf, die jeweils in Richtung einer Mittel-Achse (6) beidseitig durch je eine Armierung (15, 19, 14, 18) verstärkt sind. Zwischen einander benachbarten Schichten (16, 17) ist eine ringförmige, sich bis in die Nähe des Außenumfangs (9) erstreckende Trennschicht (20) mit einem Außen-Durchmesser (D 20 ) und einem Innen-Durchmesser (d 20 ) und einer Dicke (e) angeordnet, die die einander benachbarten Schichten (16, 17) voneinander trennt, aber in Richtung der Mittel-Achse (6) gegeneinander abstützt.
摘要:
A grinding wheel having a tool portion formed by firmly fixing diamond grains to an end face of a cup-shaped core by brazing. A circumferentially continuous groove is formed in a substantially central portion of the end face of the core. The abrasive grains are firmly fixed to an end face portion excluding regions near an outer rim and near an inner rim of the end face and near the boundaries with the groove under the condition that, with respect to all the abrasive grains, skirts of a brazing material layer for holding the abrasive grains have a length one or more times an average grain size of the abrasive grains. The provision of the groove in the end face of the core can enhance the capability of ejecting chips that occur during machining; besides, chips can be captured into the groove to preclude the occurrence of scratches resulting from the chips. Moreover, sufficient lengths of skirts of the brazing material layer are secured for all the abrasive grains arranged on the end face of the core, which improves the force for holding the abrasive grains and avoids grain fall-out during machining.
摘要:
A system and method for polishing semiconductor wafers includes a rotatable polishing pad (36) movably positionable in a plurality of partially overlapping configurations with respect to a semiconductor wafer (w). A pad dressing assembly (16) positioned coplanar, and adjacent, to the wafer provides in-situ pad conditioning to a portion of the polishing pad (36) not in contact with the wafer. The method includes the step of radially moving the polishing pad (36) with respect to the wafer.
摘要:
The invention relates to an electroplated grinding wheel having abrasive grain layer parts in which plural abrasive grains are fixed with the metal bonding phase. The abrasive grain layer part has a high abrasive grains concentration at a center part of said abrasive grain layer part and a low abrasive grain concentration at a surrounding area of said abrasive grain layer part.
摘要:
A system and method for polishing semiconductor wafers includes a rotatable polishing pad (36) movably positionable in a plurality of partially overlapping configurations with respect to a semiconductor wafer (w). A pad dressing assembly (16) positioned coplanar, and adjacent, to the wafer provides in-situ pad conditioning to a portion of the polishing pad (36) not in contact with the wafer. The method includes the step of radially moving the polishing pad (36) with respect to the wafer.
摘要:
The invention provides individually made abrasive discs with the primary abrasive surface around the periphery of the disc where the bulk of the abrading action occurs when the disc is in use. The invention also provides a process by which these discs can be made using a unique grain feeding technique which is capable of depositing abrasive grain on a backing surface accurately and in annular patterns.