公开(公告)号：EP4417400A1

公开(公告)日：2024-08-21

申请号：EP22880906.7

申请日：2022-10-06

Applicant: NHK Spring Co., Ltd.

Inventor： MIZUTA, Hidetoshi ,  FURUSE, Atom ,  NAGASAWA, Kaoru ,  ARAI, Fumitaka

IPC: B29C65/48 ,  B60G21/055 ,  F16B11/00 ,  C09J5/06 ,  C09J201/00 ,  B29C65/02 ,  B29C65/14 ,  B29C65/44 ,  B29C65/46 ,  B29C65/52 ,  B29L31/30 ,  B29L31/00 ,  B29C35/08

CPC classification number: C09J5/06 ,  C09J201/00 ,  B60G21/055 ,  B29C65/4835 ,  B29L2031/305520130101 ,  B29L2031/72120130101 ,  B29C65/44 ,  B29C65/46 ,  B29C66/0242 ,  B29C66/543 ,  B29C66/53241 ,  B29C65/02 ,  B29C66/8322 ,  B29C66/91411 ,  B29C66/944 ,  B29C65/48 ,  B29C66/532 ,  F16B11/006 ,  B29C66/1122 ,  B29C65/522 ,  B29C66/028 ,  B29C66/71 ,  B29C66/7212 ,  B29C66/742 ,  B29C66/73751 ,  B29C66/73753 ,  B29C65/1412 ,  B29C2035/082220130101 ,  B29C65/1416

Abstract: A bonding method according to the present invention is a bonding method for bonding a bush to an adherend member and includes: an adhesive application step of applying an adhesive to a part of a buffer member, the part being bonded to the adherend member; a first heating step of heating a part of the adherend member, the part being bonded to the buffer member; a second heating step of heating the part of the adherend member after the first heating step; and an attachment step of attaching the buffer member to the adherend member after the second heating step.

公开(公告)号：EP4410919A1

公开(公告)日：2024-08-07

申请号：EP22876350.4

申请日：2022-09-28

Applicant: NITTO DENKO CORPORATION

Inventor： KURODA, Tomoharu ,  MIZUHARA, Ginji ,  TSUMURA, Daisuke

IPC: C09J11/06 ,  C09J11/08 ,  C09J133/00 ,  C09J167/00 ,  C09J175/04 ,  C09J201/00 ,  C09J7/38

CPC classification number: C09J167/00 ,  C09J201/00 ,  C09J11/08 ,  C09J11/06 ,  C09J7/38 ,  C09J175/04 ,  C09J133/00

Abstract: The purpose of the present invention is to provide: an adhesive composition from which an adhesive layer, which firmly bonds members when a voltage is not applied thereto, and the adhesive strength of which is sufficiently reduced by applying a voltage thereto, can be formed; an adhesive sheet comprising an adhesive layer that is formed from said adhesive composition; and a bonded body. The present invention relates to: an adhesive composition which contains a polymer, an ionic liquid, and a tackifier, wherein the product of the acid value [mgKOH/g] of the tackifier and the content [parts by mass] of the tackifier with respect to 100 parts by mass of the polymer is less than 1,200; an adhesive sheet comprising an adhesive layer that is formed from said adhesive composition; and a bonded body.

公开(公告)号：EP4407659A1

公开(公告)日：2024-07-31

申请号：EP22883392.7

申请日：2022-10-07

Applicant: Denka Company Limited

Inventor： HASUMI, Mizuki ,  MOTOIKE, Shingo ,  IIZUKA, Kazuki ,  NAKAMURA, Masashi

IPC: H01L21/304 ,  B32B27/00 ,  C09J7/20 ,  C09J7/29 ,  C09J7/38 ,  C09J201/00 ,  H01L21/301 ,  H01L21/683

CPC classification number: B32B27/00 ,  C09J7/29 ,  C09J7/38 ,  C09J7/20 ,  C09J201/00 ,  H01L21/30 ,  H01L21/304 ,  H01L21/683

Abstract: The present invention provides a base material for semiconductor wafer processing, the base material being capable of enhancing adhesion to a stage in a semiconductor wafer processing step. The present invention provides a base material which is used for an adhesive sheet for processing a semiconductor wafer having a projected part, wherein the thermal shrinkages of the base material in the machine direction (MD) and in the transverse direction (TD) after heating at 130°C for 10 minutes are both 0% or more.

公开(公告)号：EP3460012A2

公开(公告)日：2019-03-27

申请号：EP18201532.1

申请日：2012-09-10

Applicant: Nippon Kayaku Kabushiki Kaisha

Inventor： TAKAHASHI, Chihiro ,  SAKAI, Hideomi ,  HARA, Yukihiro ,  ARIFUKU, Michiharu

IPC: C09D7/61 ,  B32B17/06 ,  C09J11/04

CPC classification number: E04B1/7641 ,  B32B17/064 ,  C08K3/22 ,  C08K7/18 ,  C08K11/00 ,  C08K2003/2231 ,  C08K2003/2296 ,  C09D7/61 ,  C09J7/00 ,  C09J7/10 ,  C09J9/00 ,  C09J11/04 ,  C09J133/02 ,  C09J133/08 ,  C09J201/00 ,  C09J2205/102 ,  C09J2433/00 ,  G02B5/22 ,  G02B5/223 ,  Y10T428/2982

Abstract: A heat ray shielding microparticle liquid dispersion containing heat-ray-shielding microparticles and a dispersant is disclosed, wherein the heat-ray-shielding microparticles have a half-value width of a first main peak obtained by an X-ray diffraction pattern of 0.01° to 0.80°, wherein the heat-ray-shielding microparticles are either tin oxide, indium oxide, or zinc oxide, and wherein the diameter of primary particles of the heat-ray-shielding microparticles is 1 to 100 nm and the specific surface area of the primary particles as calculated by BET is 5 to 200 m 2 /g.
Further, a heat-ray shielding adhesive composition, a varnish, a heat ray shielding transparent adhesive sheet are disclosed.

公开(公告)号：EP3386023A1

公开(公告)日：2018-10-10

申请号：EP16870193.6

申请日：2016-11-28

Applicant: Zeon Corporation

Inventor： AKIIKE, Junnosuke ,  TANAKA, Keiichiro ,  ASAI, Kazuki ,  OURA, Kei

IPC: H01M10/058 ,  C08F265/08 ,  C09J7/00 ,  C09J11/08 ,  C09J201/00 ,  H01M2/16 ,  H01M4/13

CPC classification number: H01M2/1686 ,  C08F265/08 ,  C09J7/00 ,  C09J11/08 ,  C09J133/10 ,  C09J201/00 ,  H01M2/16 ,  H01M4/13 ,  H01M10/0525 ,  H01M10/058

Abstract: Disclosed is a composition for non-aqueous secondary battery adhesive layer which comprises a particulate polymer and a binder, wherein the particulate polymer comprises 5% to 50% by mass of a (meth)acrylonitrile monomer unit and 0.1% to 3.5% by mass of a cross-linkable monomer unit. Also disclosed is a non-aqueous secondary battery adhesive layer prepared by using the composition for non-aqueous secondary battery adhesive layer. Also disclosed is a laminate which comprises a substrate and the non-aqueous secondary battery adhesive layer disposed on at least one side of the substrate either directly or indirectly through one or more other layers. Also disclosed is a non-aqueous secondary battery wherein at least one of a positive electrode, a negative electrode, and a separator comprises the non-aqueous secondary battery adhesive layer.

公开(公告)号：EP3382777A1

公开(公告)日：2018-10-03

申请号：EP16868193.0

申请日：2016-11-17

Applicant: Zeon Corporation

Inventor： ASAI, Kazuki

IPC: H01M4/13 ,  C09J201/00 ,  H01M2/16 ,  H01M10/058 ,  H01M10/0585 ,  H01M10/0587

CPC classification number: H01M2/0287 ,  C09J201/00 ,  H01M2/16 ,  H01M2/1626 ,  H01M4/13 ,  H01M4/139 ,  H01M4/622 ,  H01M10/0525 ,  H01M10/058 ,  H01M10/0585 ,  H01M10/0587 ,  H01M2004/027 ,  H01M2004/028 ,  H01M2300/0097

Abstract: A composition for a non-aqueous secondary battery adhesive layer contains organic particles and a water-soluble polymer. The water-soluble polymer has a 1 mass% aqueous solution viscosity of at least 500 mPa·s and not more than 9,000 mPa·s. Viscosity η 0 of the composition for a non-aqueous secondary battery adhesive layer at a shear rate of 100 s -1 is at least 10 mPa·s and not more than 200 mPa·s, and a ratio of η 0 relative to viscosity η 1 of the composition for a non-aqueous secondary battery adhesive layer at a shear rate of 10,000 s -1 is at least 1.5 and not more than 5.0.

公开(公告)号：EP3381890A1

公开(公告)日：2018-10-03

申请号：EP18169810.1

申请日：2011-08-02

Applicant: Chevron Phillips Chemical Company LP

Inventor： MATSON, Michael S. ,  REFVIK, Mitchell D. ,  NETEMEYER, Eric J.

IPC: C07C319/04 ,  C07C321/10 ,  C07C321/22 ,  C07C321/06 ,  C07D337/00

CPC classification number: C09J175/04 ,  C07C319/04 ,  C07C321/06 ,  C07C321/10 ,  C07C321/22 ,  C07C2601/14 ,  C07C2601/18 ,  C07C2601/20 ,  C09J11/06 ,  C09J163/00 ,  C09J201/00

Abstract: The present invention discloses processes for forming polythiol compositions from olefinic hydrocarbons such as cyclooctadiene, cyclododecatriene, and trivinylcyclohexane. The polythiol compositions produced from these processes, including the sulfur-containing compounds of these compositions, also are described.

公开(公告)号：EP3378917A1

公开(公告)日：2018-09-26

申请号：EP16866455.5

申请日：2016-11-18

Applicant: Sekisui Chemical Co., Ltd.

Inventor： YAMAGAMI, Mai ,  HANEDA, Satoshi ,  WAKIYA, Takeshi ,  YAMADA, Yasuyuki ,  UEDA, Saori ,  SASADAIRA, Masao

IPC: C09J201/00 ,  B22F7/08 ,  B23K35/24 ,  C08F12/36 ,  C08F16/32 ,  C08F30/08 ,  C08F36/08 ,  C08J3/12 ,  C09J9/02 ,  C09J11/00 ,  C09J11/08 ,  H01B1/00 ,  H01B1/22 ,  H01B5/00 ,  H01R11/01

CPC classification number: B23K35/3613 ,  B22F7/08 ,  B23K35/025 ,  B23K35/24 ,  B23K35/3006 ,  B23K2101/40 ,  C08F12/36 ,  C08F16/32 ,  C08F30/08 ,  C08F36/08 ,  C08F36/20 ,  C08F212/36 ,  C08F216/06 ,  C08J3/12 ,  C09J9/02 ,  C09J11/00 ,  C09J11/08 ,  C09J201/00 ,  H01B1/00 ,  H01B1/22 ,  H01B5/00 ,  H01R11/01

Abstract: Particles that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming the connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 µm or more and 15 µm or less, the particles have a 10% K value of exceeding 3000 N/mm 2 and 20000 N/mm 2 or less, and the particles have a particle diameter CV value of 50% or less.

公开(公告)号：EP3378916A1

公开(公告)日：2018-09-26

申请号：EP16866454.8

申请日：2016-11-18

Applicant: Sekisui Chemical Co., Ltd.

Inventor： YAMAGAMI, Mai ,  HANEDA, Satoshi ,  WAKIYA, Takeshi ,  YAMADA, Yasuyuki ,  UEDA, Saori ,  SASADAIRA, Masao

IPC: C09J201/00 ,  B22F7/08 ,  B23K35/24 ,  C08F12/36 ,  C08F16/32 ,  C08F30/08 ,  C08F36/08 ,  C09J9/02 ,  C09J11/00 ,  C09J11/08 ,  H01B1/00 ,  H01B1/22 ,  H01B5/00 ,  H01R11/01

CPC classification number: H01B1/22 ,  B22F7/08 ,  B22F2301/10 ,  B22F2301/15 ,  B22F2301/255 ,  B22F2301/30 ,  B22F2304/10 ,  B23K35/025 ,  B23K35/24 ,  B23K35/3613 ,  C08F12/36 ,  C08F16/20 ,  C08F16/32 ,  C08F30/08 ,  C08F36/08 ,  C08G61/02 ,  C08G2261/3142 ,  C08G2261/3321 ,  C09J9/02 ,  C09J11/00 ,  C09J11/08 ,  C09J201/00 ,  H01B1/00 ,  H01B5/00 ,  H01L24/29 ,  H01L2224/29391 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2924/0635 ,  H01L2924/35121 ,  H01R11/01

Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 µm or more and 15 µm or less, the particles have a 10% K value of 30 N/mm 2 or more and 3000 N/mm 2 or less, and the particles have a particle diameter CV value of 50% or less.

公开(公告)号：EP3378915A1

公开(公告)日：2018-09-26

申请号：EP16866453.0

申请日：2016-11-18

Applicant: Sekisui Chemical Co., Ltd.

Inventor： YAMAGAMI, Mai ,  HANEDA, Satoshi ,  WAKIYA, Takeshi ,  YAMADA, Yasuyuki ,  UEDA, Saori ,  SASADAIRA, Masao

IPC: C09J201/00 ,  B22F7/08 ,  B23K35/24 ,  C08F12/36 ,  C08F16/32 ,  C08F30/08 ,  C08F36/08 ,  C08J3/12 ,  C09J9/02 ,  C09J11/00 ,  C09J11/08 ,  H01B1/00 ,  H01B1/22 ,  H01B5/00 ,  H01R11/01

CPC classification number: B23K35/34 ,  B22F7/08 ,  B23K35/24 ,  C08F12/36 ,  C08F16/32 ,  C08F30/08 ,  C08F36/08 ,  C08J3/12 ,  C09J9/02 ,  C09J11/00 ,  C09J11/08 ,  C09J201/00 ,  H01B1/00 ,  H01B1/22 ,  H01B5/00 ,  H01R11/01

Abstract: A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the heat dissipation performance, and can increase the connection strength is provided. The connecting material according to the present invention is a connecting material used for forming the connection part that connects two members to be connected, the connecting material contains particles and metal atom-containing particles, the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 µm or more and 300 µm or less, the particles have a 10% K value of exceeding 3000 N/mm 2 and 20000 N/mm 2 or less, and the particles have a particle diameter CV value of 10% or less.