公开(公告)号：EP2248399A1

公开(公告)日：2010-11-10

申请号：EP09709241.5

申请日：2009-01-09

申请人： Crain, John M. ,  Lettow, John S. ,  Aksay's, Iihan A. ,  Korkut, Sibel ,  Chiang, Katherine S. ,  Chen, Chuan-Hua ,  Prud'homme, Robert K.

发明人： LETTOW, John, S. ,  AKSAY, Iihan, A. ,  KORKUT, Sibel ,  CHIANG, Katherine, S. ,  CHEN, Chuan-hua ,  PRUD'HOMME, Robert, K.

IPC分类号： H05K1/11 ,  C09C1/46 ,  H01L21/302

CPC分类号： H05K1/095 ,  B82Y30/00 ,  B82Y40/00 ,  C01P2004/02 ,  C01P2006/12 ,  C01P2006/40 ,  C08K3/04 ,  C09C1/46 ,  C09D7/65 ,  C09D7/70 ,  C09D11/037 ,  C09D11/102 ,  C09D11/52 ,  C09D171/02 ,  C09D177/00 ,  H01L2924/0002 ,  H05K1/092 ,  H05K3/0091 ,  H05K3/12 ,  H05K2201/0323 ,  Y10S977/734 ,  Y10S977/847 ,  Y10S977/932 ,  H01L2924/00

摘要： Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed.

摘要翻译： 印刷电子器件包括至少一个表面上的基底，该基底已经涂覆了包含官能化石墨烯片和至少一种粘合剂的导电油墨层。 进一步公开了制备印刷电子器件的方法。

公开(公告)号：EP2248399B1

公开(公告)日：2015-08-19

申请号：EP09709241.5

申请日：2009-01-09

申请人： Crain, John M. ,  Lettow, John S. ,  Aksay's, Iihan A. ,  Korkut, Sibel ,  Chiang, Katherine S. ,  Chen, Chuan-Hua ,  Prud'homme, Robert K.

发明人： LETTOW, John, S. ,  AKSAY, Iihan, A. ,  KORKUT, Sibel ,  CHIANG, Katherine, S. ,  CHEN, Chuan-hua ,  PRUD'HOMME, Robert, K.

IPC分类号： H05K1/11 ,  C09C1/46 ,  H01L21/302

CPC分类号： H05K1/095 ,  B82Y30/00 ,  B82Y40/00 ,  C01P2004/02 ,  C01P2006/12 ,  C01P2006/40 ,  C08K3/04 ,  C09C1/46 ,  C09D7/65 ,  C09D7/70 ,  C09D11/037 ,  C09D11/102 ,  C09D11/52 ,  C09D171/02 ,  C09D177/00 ,  H01L2924/0002 ,  H05K1/092 ,  H05K3/0091 ,  H05K3/12 ,  H05K2201/0323 ,  Y10S977/734 ,  Y10S977/847 ,  Y10S977/932 ,  H01L2924/00

摘要： Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed.