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    MULTI-MATERIAL STRUCTURE WITH EMBEDDED ELECTRONICS
    5.
    发明公开
    MULTI-MATERIAL STRUCTURE WITH EMBEDDED ELECTRONICS 审中-公开
    嵌入式电子的多材料结构

    公开(公告)号：EP3278639A1

    公开(公告)日：2018-02-07

    申请号：EP16771460.9

    申请日：2016-04-01

    Applicant: Tacto Tek OY

    Inventor： HEIKKINEN, Mikko ,  SÄÄSKI, Jarmo

    IPC: H05K5/00 ,  H05K5/06 ,  H05K1/18 ,  H05K3/28 ,  B29C45/16 ,  B29L31/34

    CPC classification number: H05K1/186 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/189 ,  H05K3/12 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/0129 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/1316 ,  H05K2203/1327

    Abstract: A multilayer structure for an electronic device, includes a flexible substrate film (202, 502) for accommodating electronics, a number of electronic components (308, 508) provided on a first surface area (401A, 501A) of the film, the film also including a second surface area adjacent (401B, 501B) to the first surface area, and a number of conductive traces (412, 512) printed on the substrate film for electrically connecting electronic components together, wherein the number of electronic components and the related first surface area of the substrate accommodating the components have been overmolded with first thermoplastic material (306, 506), the adjacent second surface area and at least part of the first area being overmolded with second thermoplastic material so that at least part of the electronic components and the first thermoplastic material thereon are substantially embedded between the substrate film and second thermoplastic material. A corresponding method of manufacture is presented.

    TOUCH SENSOR WIRING BODY, TOUCH SENSOR WIRING SUBSTRATE, AND TOUCH SENSOR
    6.
    发明公开
    TOUCH SENSOR WIRING BODY, TOUCH SENSOR WIRING SUBSTRATE, AND TOUCH SENSOR 审中-公开
    触摸传感器配线体，触摸传感器配线基板和触摸传感器

    公开(公告)号：EP3264243A1

    公开(公告)日：2018-01-03

    申请号：EP16755715.6

    申请日：2016-02-26

    Applicant: Fujikura Ltd.

    Inventor： SHIOJIRI, Takeshi ,  OGURA, Shingo

    IPC: G06F3/044 ,  G06F3/041

    CPC classification number: G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/02 ,  H05K3/12

    Abstract: A wiring body (3) for a touch sensor includes: a first resin layer (31); a first conductor layer (32) provided on the first resin layer (31) and including first conductor lines (322); a second resin layer (33) covering the first conductor layer (32); and a second conductor layer (34) provided above the first conductor layer (32) via the second resin layer (33) and including second conductor lines (342). The first and second conductor layers (32) and (34) are electrically insulated by the second resin layer (33). A following Expression (1) is satisfied: D 1 2 ...(1). In the above Expression (1), D 1 is a thickness of the first resin layer (31) in a first region corresponding to a first conductor line (322) in a first predetermined cross-section that crosses the wiring body (3) along a second conductor line (342), and D 2 is a thickness of the second resin layer (33) in the first region of the first predetermined cross-section.

    Abstract translation: 用于触摸传感器的配线体（3）包括：第一树脂层（31）;第二树脂层 设置在第一树脂层（31）上并包括第一导体线（322）的第一导体层（32）; 覆盖第一导体层（32）的第二树脂层（33）; 以及经由第二树脂层（33）设置在第一导体层（32）上并且包括第二导体线（342）的第二导体层（34）。 第一和第二导体层（32）和（34）通过第二树脂层（33）电绝缘。 满足以下表达式（1）：D1

    METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT SUBSTRATE, AND ELECTRONIC CIRCUIT SUBSTRATE OBTAINED THEREBY
    8.
    发明公开
    METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT SUBSTRATE, AND ELECTRONIC CIRCUIT SUBSTRATE OBTAINED THEREBY 审中-公开
    制造电子电路基板的方法和由此获得的电子电路基板

    公开(公告)号：EP3203816A1

    公开(公告)日：2017-08-09

    申请号：EP15846149.1

    申请日：2015-08-31

    Applicant: Komura-tech Co., Ltd.

    Inventor： KANEHARA, Masayuki ,  URANO, Masaaki

    IPC: H05K3/12 ,  B41M1/04 ,  B41M1/30 ,  B41F3/20 ,  B41F17/14

    CPC classification number: H05K3/12 ,  B41F3/20 ,  B41F17/14 ,  B41M1/04 ,  B41M1/30 ,  C09D11/52 ,  H05K1/097 ,  H05K3/1275 ,  H05K3/1283 ,  H05K2201/0257 ,  H05K2203/1131

    Abstract: An electronic circuit board manufacturing method according to the present disclosure is a method of manufacturing an electronic circuit board including a substrate and an electronic circuit having a predetermined pattern, the electronic circuit being fixed on the substrate and being made from a nanoink composition containing metal particles. The method includes the steps of: causing a printing plate to hold a nanoink composition containing metal particles, the printing plate including an ink holding part formed on a surface thereof and having a predetermined pattern; bringing a surface of the substrate into intimate contact with the printing plate to transfer the nanoink composition held on the ink holding part onto the substrate (workpiece W); and drying the transferred nanoink composition in an environment of 40°C or below in the atmosphere to fix the nanoink composition after the transfer step, thereby forming an electronic circuit having a predetermined pattern. This method is capable of forming a layer made from a uniform nanoink composition rapidly and efficiently at ordinary temperatures and under atmospheric pressure.

    Abstract translation: 根据本公开的电子电路板制造方法是一种制造电子电路板的方法，该电子电路板包括基板和具有预定图案的电子电路，该电子电路固定在基板上并由包含金属颗粒的纳米燃料组合物制成 。 所述方法包括以下步骤：使印刷板保持包含金属颗粒的纳米油墨组合物，所述印刷板包括在其表面上形成并具有预定图案的油墨保持部分; 使基板的表面与印刷板紧密接触以将保持在墨水保持部件上的纳米燃料组合物转印到基板（工件W）上; 以及在大气中在40℃或更低的环境下干燥转印的纳米油墨组合物以在转印步骤后固定纳米油墨组合物，由此形成具有预定图案的电子电路。 该方法能够在常温和常压下快速有效地形成由均匀的纳米油墨组合物制成的层。

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