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公开(公告)号：EP1454340A2
公开(公告)日：2004-09-08
申请号：EP02791341.7
申请日：2002-11-27
IPC分类号： H01L21/00
CPC分类号： H01L21/67745 , H01L21/67155 , H01L21/67778 , Y10S414/139
摘要： A high-speed wafer-processing apparatus and method that employs a vacuum chamber having at least two wafer transport robots and a process station. The vacuum chamber interfaces with a number of single-wafer load locks that are loaded and unloaded one wafer at a time by a robot in atmosphere. Four load locks are sized to allow for a gentle vacuum cycling of each wafer without significant pumpdown delays. The robots in the vacuum chamber move wafers sequentially from one of the load locks to a process station for processing and then to another one of the load locks for unloading by the atmospheric robot.
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公开(公告)号：EP1454340B1
公开(公告)日：2006-09-13
申请号：EP02791341.7
申请日：2002-11-27
IPC分类号： H01L21/00
CPC分类号： H01L21/67745 , H01L21/67155 , H01L21/67778 , Y10S414/139
摘要： A high-speed wafer-processing apparatus and method that employs a vacuum chamber having at least two wafer transport robots and a process station. The vacuum chamber interfaces with a number of single-wafer load locks that are loaded and unloaded one wafer at a time by a robot in atmosphere. Four load locks are sized to allow for a gentle vacuum cycling of each wafer without significant pumpdown delays. The robots in the vacuum chamber move wafers sequentially from one of the load locks to a process station for processing and then to another one of the load locks for unloading by the atmospheric robot.
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