公开(公告)号：EP3061851A4

公开(公告)日：2017-06-21

申请号：EP14856618

申请日：2014-10-24

申请人： OM SANGYO CO LTD

发明人： TAKAMIZAWA MASAO ,  NISHIMURA YOSHIYUKI ,  FUKUDA CHISA

IPC分类号： C25D3/12 ,  C25D5/00 ,  C25D5/16

CPC分类号： C25D3/12 ,  C23C18/1653 ,  C25D3/562 ,  C25D5/16 ,  C25D7/123 ,  C25D21/12

摘要： There is provided a method for producing a plated article, comprising immersing a substrate made of a conductive metal in a plating solution and forming a plating layer on the substrate by electroplating, wherein the plating solution is a solution containing 0.01 to 1 mol/L of Ni ions with pH of 6 or more; and a porous Ni plating layer is formed by performing the electroplating at a cathode current density of 10 A/dm 2 or more. This method allows for easily producing a plated article wherein a uniform porous Ni plating layer is formed on the surface of a substrate.

摘要翻译： 本发明提供一种电镀物品的制造方法，其特征在于，将由导电性金属构成的基板浸渍在电镀液中，通过电镀在基板上形成电镀层，其中，电镀液为含有0.01〜1mol / L pH值等于或大于6的Ni离子; 通过以10A / dm 2以上的阴极电流密度进行电镀，形成多孔Ni镀层。 通过该方法，能够容易地制造在基板表面形成均匀的多孔质Ni镀层的镀敷物。

公开(公告)号：EP3061851A1

公开(公告)日：2016-08-31

申请号：EP14856618.5

申请日：2014-10-24

申请人： OM Sangyo Co., Ltd.

发明人： TAKAMIZAWA, Masao ,  NISHIMURA, Yoshiyuki ,  FUKUDA, Chisa

IPC分类号： C25D3/12 ,  C25D5/00

CPC分类号： C25D3/12 ,  C23C18/1653 ,  C25D3/562 ,  C25D5/16 ,  C25D7/123 ,  C25D21/12

摘要： There is provided a method for producing a plated article, comprising immersing a substrate made of a conductive metal in a plating solution and forming a plating layer on the substrate by electroplating, wherein the plating solution is a solution containing 0.01 to 1 mol/L of Ni ions with pH of 6 or more; and a porous Ni plating layer is formed by performing the electroplating at a cathode current density of 10 A/dm 2 or more. This method allows for easily producing a plated article wherein a uniform porous Ni plating layer is formed on the surface of a substrate.

摘要翻译： 提供一种电镀制品的制造方法，其特征在于，将由导电性金属制成的基板浸渍在电镀液中，通过电镀在所述基板上形成镀覆层，所述镀液为含有0.01〜1mol / L的 pH为6以上的Ni离子; 通过以10A / dm 2以上的阴极电流密度进行电镀而形成多孔Ni镀层。 该方法允许容易地制造其中在基板的表面上形成均匀的多孔Ni镀层的电镀制品。

公开(公告)号：EP3276042A1

公开(公告)日：2018-01-31

申请号：EP16768841.5

申请日：2016-03-23

申请人： OM Sangyo Co., Ltd.

发明人： NISHIMURA, Yoshiyuki ,  MIYAKE, Rie ,  FUKUDA, Chisa ,  TAKAMIZAWA, Masao ,  MITOOKA, Yutaka

IPC分类号： C23C18/18 ,  H05K3/18

CPC分类号： C23C18/1612 ,  C23C18/1639 ,  C23C18/1667 ,  C23C18/18 ,  C23C18/1868 ,  C23C18/1893 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  C23C18/54 ,  H05K3/18

摘要： There is provided a method for producing a plated article in which a plating film pattern is formed on the surface of a glass substrate, comprising a first step of irradiating a partial area of the surface of the glass substrate with a pulsed laser; a second step of attaching an electroless catalyst on the surface of the glass substrate; a third step of selectively deactivating or selectively removing the catalyst attached to the unirradiated area with the pulsed laser in the glass substrate; and a fourth step of nonelectrolytically plating the glass substrate after the third step to selectively form a plating film in the irradiated area with the pulsed laser. The method allows for easily producing a plated article in which a highly adherent plating film pattern is formed on the surface of the glass substrate.

摘要翻译： 本发明提供一种在玻璃基板的表面形成镀膜图案的镀敷物的制造方法，其特征在于，包括：第一工序，用脉冲激光照射玻璃基板表面的一部分区域; 将无电催化剂附着在玻璃基板的表面上的第二步骤; 第三步骤，用玻璃基板中的脉冲激光选择性地钝化或选择性地除去附着于未照射区域的催化剂; 以及第四步骤，在第三步骤之后非电解镀覆玻璃衬底，以便用脉冲激光在照射区域中选择性地形成镀膜。 该方法允许容易地制造其中在玻璃基板的表面上形成有高度附着的镀膜图案的镀覆制品。