公开(公告)号：EP1739706A1

公开(公告)日：2007-01-03

申请号：EP05721570.9

申请日：2005-03-22

申请人： Pioneer Corporation ,  Pioneer Micro Technology Corp.

发明人： SAKEMURA, Kazuto c/o Corporate Res. & Dev. Lab. ,  ASO, Saburo ,  HANIHARA, Koji ,  NEGISHI, Nobuyasu c/o Corporate Res. & Dev. Lab. ,  NAKADA, Tomonari c/o Corporate Res. & Dev. Lab. ,  YOSHIKAWA, Takamasa c/o Corporate Res. & Dev. Lab.

IPC分类号： H01J1/312 ,  H01J9/02 ,  H01J31/12

CPC分类号： H01J9/022 ,  B82Y10/00 ,  H01J1/312 ,  H01J31/127

摘要： An electron emitting device having a lower electrode on a side near to a substrate and an upper electrode on a side remote from the substrate respectively, formed of a plurality of electron emitting elements remitting electrons from a side of the upper electrode side, wherein space is formed between the electron emitting elements, and the upper electrode extends across the plurality of electron emitting elements and the space by a bridging portion of the upper electrode.

摘要翻译： 分别向电子发射从衬底远程具有在一侧的下部电极附近的基板和上部电极上的侧设备，形成的电子发射从上部电极侧的侧缓解电子元件的多个，worin空间是 电子发射元件之间形成，并且上电极跨越电子发射元件的多元性和由所述上部电极的一个桥接部分的空间中延伸。

公开(公告)号：EP1739706A4

公开(公告)日：2008-12-03

申请号：EP05721570

申请日：2005-03-22

申请人： PIONEER CORP ,  PIONEER MICRO TECHNOLOGY CORP

发明人： SAKEMURA KAZUTO ,  ASO SABURO ,  HANIHARA KOJI ,  NEGISHI NOBUYASU ,  NAKADA TOMONARI ,  YOSHIKAWA TAKAMASA

IPC分类号： H01J1/312 ,  H01J9/02 ,  H01J31/12

CPC分类号： H01J9/022 ,  B82Y10/00 ,  H01J1/312 ,  H01J31/127

摘要： An electron emitting device is composed of a plurality of electron emitting elements. The electron emitting element is provided with a lower electrode (11) and an upper electrode (15) and emits an electron from an upper electrode side. In the electron emitting device, a space is formed between the electron emitting elements and the upper electrode extends over the space on a bridge part (15a). The space is formed by providing a through hole or a notched part (15a) on the bridge part, and etching a stacked body under the upper electrode by using the bridge part as a mask. The upper electrodes of the adjacent electron emitting elements are electrically connected by the bridge part without bringing the upper electrodes into contact with the electron emitting element side planes and a substrate. Therefore, a current path can be shortened and a possibility of disconnection can be reduced.