Apparatus for cleaning deposition chamber parts using selective spray etch
    2.
    发明公开
    Apparatus for cleaning deposition chamber parts using selective spray etch 有权
    一种用于使用选择性Spritzätzung清洗涂覆室部件

    公开(公告)号:EP2383049A1

    公开(公告)日:2011-11-02

    申请号:EP11175407.3

    申请日:2008-06-27

    摘要: In one aspect, a spray cleaning apparatus (400, 500,600, 700) for components of an electronic device manufacturing process chamber includes: a support member (606, 702, 706); a spray nozzle (408, 608) attached to the support member; a cleaning chemistry supply (410, 604, 704); and a conduit (606, 706) adapted to convey cleaning chemistry from the cleaning chemistry supply to the spray nozzle; wherein the spray nozzle attached to the support member is adapted to rotate and/or to move linearly and is adapted to direct a spray of cleaning chemistry to the interior of an electronic device manufacturing process chamber component from a plurality of directions.

    摘要翻译: 在一个方面中,一个喷涂清洁设备(400,500,600,700),用于电子器件制造处理室的元件,包括:支撑构件(606,702,706); 一个喷嘴(408,608)附接到所述支撑构件; 清洁化学品供应(410,604,704); 和导管(606,706)angepasst传达从清洁化学品供应到喷嘴清洗化学品; worin附接到所述支撑构件的喷嘴是angepasst旋转和/或线性地移动,并且angepasst将来自方向的多元性到电子器件制造处理室元件的内部清洁化学品的喷射。