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公开(公告)号:EP3598853A1
公开(公告)日:2020-01-22
申请号:EP18184863.1
申请日:2018-07-20
发明人: HOPPENAU, Lukas , PUSTAN, David
IPC分类号: H05K1/02
摘要: The invention relates to a sensor device (1) which comprises a circuit board (50) and at least one sensor (52) arranged on the circuit board (50). Further, the sensor device (1) comprises a housing (20) wherein the housing (20) comprises at least a first opening (30). The circuit board (50) comprises a marking (40), wherein the marking (40) codes information, and wherein the at least one first opening (30) is configured and arranged such that it leaves the marking (40) uncovered by the housing (20) such that the marking (40) is visible from outside of the housing (20) through the at least one first opening (30).
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公开(公告)号:EP3292404B1
公开(公告)日:2019-05-22
申请号:EP17702401.5
申请日:2017-02-03
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公开(公告)号:EP3411266A1
公开(公告)日:2018-12-12
申请号:EP17702407.2
申请日:2017-02-03
IPC分类号: B60N2/56
CPC分类号: B60N2/565 , B60N2/5657 , B60N2/5685 , B60N2/5692
摘要: The invention relates to a sensor module (1), comprising: at least a first sensor (10) that is designed to measure relative humidity and/or temperature, wherein the sensor module (1) is configured to be mounted in an automotive seat (2), which automotive seat (2) comprises a seat cover region (200) forming an outer surface (200a) of the seat that faces a passenger (P) sitting on the automotive seat (2), wherein the sensor module (1) is configured to be mounted such in said automotive seat (2) that it is spaced apart from said seat cover region (200). Further, the invention relates to an automotive seat (2) comprising such a sensor module (1)
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公开(公告)号:EP3202616B1
公开(公告)日:2020-09-02
申请号:EP16154134.7
申请日:2016-02-03
发明人: Hoppenau, Lukas , Götze, Michael , Graf, Markus
IPC分类号: B60N2/56
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公开(公告)号:EP3497466A1
公开(公告)日:2019-06-19
申请号:EP17748468.0
申请日:2017-08-02
发明人: WINKLER, Lukas , BECKER, Manuel , WIGET, Markus
IPC分类号: G01S3/783
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公开(公告)号:EP3206029B8
公开(公告)日:2018-08-08
申请号:EP16163475.3
申请日:2016-04-01
发明人: Wiget, Markus , Winkler, Lukas
CPC分类号: G01N33/0009 , G01N27/121 , G01N33/0027 , H01L27/0248
摘要: An electronic component comprises a carrier (3), a sensor device (2) mounted on the carrier (3), which sensor device (2) comprises a sensor chip (21), and an electrostatic discharge protection element (1) for protecting the sensor chip (21) from an electrostatic discharge, which protection element (1) is mounted on the carrier (3).
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公开(公告)号:EP3795977A1
公开(公告)日:2021-03-24
申请号:EP19197886.5
申请日:2019-09-17
发明人: BECKER, Manuel
IPC分类号: G01N1/24 , F01N1/24 , G10K11/178
摘要: The present invention relates to a sensor module (1) for measuring at least one measurand, wherein the sensor module (1) comprises: a housing (2) surrounding an internal space (20) of the housing (2); a flow channel (21) extending through the housing (2) and comprising an inlet section (22) and an outlet section (23); a sensor (3) configured to measure at least one measurand of a flow passing the sensor (3); and a fan (4) arranged in the internal space (20), wherein the fan (4) comprises a rotor (40) that is rotatable about a rotation axis (z), wherein the fan (4) is configured to generate a flow (L) in said flow channel (21) flowing through the inlet section (22) and to the outlet section (23) so that the flow (L) passes the sensor (3). According to the present invention, the sensor module (1) comprises at least one sound-absorbing material portion (5) forming an internal surface section (50) of the flow channel (21) to reduce noise generated by the fan (4).
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公开(公告)号:EP3717878A1
公开(公告)日:2020-10-07
申请号:EP18795422.7
申请日:2018-10-23
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公开(公告)号:EP2224218B1
公开(公告)日:2018-11-28
申请号:EP09002618.8
申请日:2009-02-25
发明人: Hunziker, Werner , Mayer, Felix
CPC分类号: G01D11/245 , G01F1/684 , G01F1/6845 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , Y10T29/49158 , H01L2924/00014 , H01L2924/00012
摘要: The flow sensor or other type of sensor comprises a package (3) having a cylindrical section (6) arranged between an anchor section (5) and a head section (7). The diameter of the anchor section (5) is typically larger than the diameter of the cylindrical section (6), which in turn is typically larger than the diameter of the head section (7). A sensor chip (1) is embedded partially into the package (3), with a sensitive area (2) being exposed to the surroundings. The sensor can e.g. be inserted into a bore having a diameter matching the one of the cylindrical section (6).
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公开(公告)号:EP3557192B1
公开(公告)日:2020-10-21
申请号:EP18168280.8
申请日:2018-04-19
发明人: Merz, Matthias , Pustan, David , Schmid, Tobias
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