专利检索 ap:"Silecs, Inc." 第 1 页

1.

发明公开
MATERIALS AND METHODS FOR FORMING HYBRID ORGANIC-INORGANIC DIELECTRIC MATERIALS 审中-公开
标题翻译：材料与有机材料的无机DIELECTRISCHEN的制作方法

公开(公告)号：EP1463740A2

公开(公告)日：2004-10-06

申请号：EP03700437.1

申请日：2003-01-08

申请人： Silecs, Inc.

发明人： RANTALA, Juha, T. , MAANINEN, Arto, L., T. , MAANINEN, Tiina, J. , PIETIKAINEN, Jarkko, J.

IPC分类号： C07F7/12 , C07F7/18 , C08G77/04

CPC分类号： H01L21/02131 , C07F7/0874 , C07F7/12 , C07F7/123 , C07F7/1868 , C07F7/1888 , H01L21/02211 , H01L21/02282 , H01L21/02304 , H01L21/02348 , H01L21/31629 , H01L21/31633

摘要： The present invention generally relates to methods for making dielectrics for integrated circuit processes and devices. More particularly, the invention relates to multi-level circuit processes, such as damascene processes that utilize metal and metal alloys (e.g., copper and copper alloys) as well as low-k dielectric materials. The methods of the present invention allow for greater control of the dielectric fabrication process.